Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > EV Group Files Patent Infringement Lawsuit Against the 3M Company

Abstract:
EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced that it has filed a patent infringement lawsuit in federal court of New York against the 3M Company ("3M"). The complaint alleges that 3M has infringed upon a U.S. Patent through the marketing and sale of the 3M Wafer Support System, which is used in the production of silicon wafers. The complaint seeks damages to compensate EVG for 3M's wrongful infringement and an injunction against 3M from all future infringement of the Patent.

EV Group Files Patent Infringement Lawsuit Against the 3M Company

ST. FLORIAN, Austria | Posted on July 14th, 2008

DI Erich Thallner, president of EVG, notes, "EVG's success depends on the protection of our intellectual property. When a company infringes on our rights, we have a responsibility to protect the tremendous investments we've made in research and development on behalf of our customers, suppliers and employees. To this end, we will vigorously protect our arsenal of technology innovation from those who we feel are competing unfairly through legal recourse, if necessary, as is the case here."

Semiconductor wafer manufacturing typically involves hundreds of discrete operations on the surface of a silicon wafer, which are performed over a number of weeks. In order to minimize wafer breakage and damage, which can easily occur during this lengthy manufacturing process, the base wafers are typically 700- to 800-microns thick. Stacked die packages require significantly reduced final wafer thickness in order not to create unacceptably tall packages. The more dies that can be packaged in a stack, the better. The device claimed in the patent enables silicon wafers to be thinned to less than 50 microns with standard back grinding equipment, which means that a greater number of dies can be stacked-providing greater performance without an increase in height.

####

About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor- related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. More information is available at www.EVGroup.com.

EVG is a registered trademark of EV Group. All other trademarks or registered trademarks mentioned in this release are the property of their respective holders.

For more information, please click here

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Scientists illuminate a hidden regulator in gene transcription: New super-resolution technique visualizes important role of short-lived enzyme clusters May 27th, 2016

Doubling down on Schrödinger's cat May 27th, 2016

Finding a new formula for concrete: Researchers look to bones and shells as blueprints for stronger, more durable concrete May 26th, 2016

Deep Space Industries and SFL selected to provide satellites for HawkEye 360’s Pathfinder mission: The privately-funded space-based global wireless signal monitoring system will be developed by Deep Space Industries and UTIAS Space Flight Laboratory May 26th, 2016

Legal

SUNY CNSE and Albany Law School Partner to Create First-of-its-Kind Nanotechnology Education and Training Program November 5th, 2013

US Court of Appeals characterizes Wyatt Technology Corporation Lanham Act claims as “groundless, unreasonable, vexatious or pursued in bad faith” May 31st, 2013

Fluidigm Files Lawsuit against NanoString’s Deceptive Marketing: Fluidigm Sues NanoString for False and Misleading Advertising under the Lanham Act November 8th, 2012

Photonic gels are colorful sensors: Rice, MIT researchers create thin-film polymer metamaterial with potential for many uses October 10th, 2012

Chip Technology

Gigantic ultrafast spin currents: Scientists from TU Wien (Vienna) are proposing a new method for creating extremely strong spin currents. They are essential for spintronics, a technology that could replace today's electronics May 25th, 2016

Diamonds closer to becoming ideal semiconductors: Researchers find new method for doping single crystals of diamond May 25th, 2016

Dartmouth team creates new method to control quantum systems May 24th, 2016

Attosecond physics: A switch for light-wave electronics May 24th, 2016

Announcements

Scientists illuminate a hidden regulator in gene transcription: New super-resolution technique visualizes important role of short-lived enzyme clusters May 27th, 2016

Doubling down on Schrödinger's cat May 27th, 2016

Finding a new formula for concrete: Researchers look to bones and shells as blueprints for stronger, more durable concrete May 26th, 2016

Deep Space Industries and SFL selected to provide satellites for HawkEye 360’s Pathfinder mission: The privately-funded space-based global wireless signal monitoring system will be developed by Deep Space Industries and UTIAS Space Flight Laboratory May 26th, 2016

Patents/IP/Tech Transfer/Licensing

Programmable materials find strength in molecular repetition May 23rd, 2016

Syracuse University chemists add color to chemical reactions: Chemists in the College of Arts and Sciences have come up with an innovative new way to visualize and monitor chemical reactions in real time May 19th, 2016

Researchers integrate diamond/boron nitride crystalline layers for high-power devices May 12th, 2016

New tool allows scientists to visualize 'nanoscale' processes May 4th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic