Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SEMATECH’s Litho Forum Spotlights High-Stakes Shift to Next-Generation Manufacturing

Abstract:
The semiconductor industry's movers and shakers will gather May 12-14 at SEMATECH's bi-annual Litho Forum to debate how best to approach the high-stakes shift to 22 nm manufacturing.

SEMATECH’s Litho Forum Spotlights High-Stakes Shift to Next-Generation Manufacturing

Albany, NY | Posted on April 23rd, 2008

"Lithography is a huge investment for manufacturers and suppliers alike. Where companies place their bets will have a big effect on their bottom line," said Mike Lercel, director of SEMATECH's lithography division and conference chair.

The forum will be keynoted by John Warlaumont, vice president of technology for SEMATECH. The agenda includes sessions organized by leading industry experts:

* Extreme ultraviolet lithography - Janice Golda, director of lithography capital equipment development, Intel
* 193 double patterning lithography - David Medeiros, senior manager of patterning research, IBM @ Albany Nanotech
* 193 high index lithography - Will Conley, distinguished member of the technical staff, Technology Solutions Organization, Freescale Semiconductor
* Nanoimprint lithography - Lloyd Litt, SEMATECH project manager, Alternative Lithography, Advanced Micro Devices
* Maskless lithography - Burn Lin, senior director, Nanopatterning Technology, TSMC

Sessions will maximize discussion time, and attendees will be surveyed for their plans and preferences on lithographic approaches for future manufacturing. The survey will also assess how attendees perceive the development status of each option and its viability for the demands of large-scale manufacturing. Additional information is available at www.sematech.org.

Lithography is a capital-intensive process. A single piece of next-generation lithographic equipment is expected to cost in excess of $40 million. The risk embraces manufacturers and suppliers alike. For any single technology or approach to be considered commercially viable, at least two equipment suppliers must support it.

Lithography is a key process in the microfabrication of semiconductors. Light is used to transfer a geometric pattern from a photomask to a light-sensitive chemical photoresist on the substrate surface. A series of chemical treatments engraves the exposure pattern into the material underneath the photoresist. A CMOS wafer, for example, will go through the photolithographic cycle up to 50 times.

####

About SEMATECH®
EMATECH works with members and partners on a pre-competitive basis to drive innovation from the lab through the manufacturing process. At the industry level, the organization plays a major role in arbitrating generational shifts by hosting industry-wide forums to foster dialogue and build consensus and helps maintain the International Technology Roadmap for Semiconductors (ITRS), a 15-year assessment of the industry’s future technology requirements.

For 20 years, SEMATECH® (www.sematech.org), the global consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
SEMATECH
Anne Englander
512-356-7155

Copyright © Business Wire 2008

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Information storage with a nanoscale twist: Discovery of a novel rotational force inside magnetic vortices makes it easier to design ultrahigh capacity disk drives March 28th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform: Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

Leti and HORIBA Scientific to Host Webinar on Ultrafast Characterization Tool: Plasma Profiling Time-of-Flight Mass Spectrometer Tool Cuts Optimization Time In Layer Deposition and Fabrication of Wide Range of Applications March 27th, 2017

Laser activated gold pyramids could deliver drugs, DNA into cells without harm: Microstructures create temporary pores in cells March 27th, 2017

Chip Technology

A big leap toward tinier lines: Self-assembly technique could lead to long-awaited, simple method for making smaller microchip patterns March 27th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform: Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

Argon is not the 'dope' for metallic hydrogen March 24th, 2017

Scientists discover new 'boat' form of promising semiconductor: GeSe Uncommon form attenuates semiconductor's band gap size March 23rd, 2017

Announcements

Information storage with a nanoscale twist: Discovery of a novel rotational force inside magnetic vortices makes it easier to design ultrahigh capacity disk drives March 28th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform: Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

Leti and HORIBA Scientific to Host Webinar on Ultrafast Characterization Tool: Plasma Profiling Time-of-Flight Mass Spectrometer Tool Cuts Optimization Time In Layer Deposition and Fabrication of Wide Range of Applications March 27th, 2017

Laser activated gold pyramids could deliver drugs, DNA into cells without harm: Microstructures create temporary pores in cells March 27th, 2017

Events/Classes

Leti and HORIBA Scientific to Host Webinar on Ultrafast Characterization Tool: Plasma Profiling Time-of-Flight Mass Spectrometer Tool Cuts Optimization Time In Layer Deposition and Fabrication of Wide Range of Applications March 27th, 2017

Leti Presents Advances in Propagation Modeling and Antenna Design for mmWave Spectrum: Paper Is One of 15 that Leti Presented at European Conference on Antennas and Propagation March 19-24 March 23rd, 2017

Next-gen steel under the microscope March 18th, 2017

UC researchers use gold coating to control luminescence of nanowires: University of Cincinnati physicists manipulate nanowire semiconductors in pursuit of making electronics smaller, faster and cheaper March 17th, 2017

Printing/Lithography/Inkjet/Inks/Bio-printing

Liquid metal nano printing set to revolutionize electronics: Creating integrated circuits just atoms thick February 18th, 2017

New stem cell technique shows promise for bone repair January 25th, 2017

NUS researchers achieve major breakthrough in flexible electronics: New classes of printable electrically conducting polymer materials make better electrodes for plastic electronics and advanced semiconductor devices January 14th, 2017

Nanowire 'inks' enable paper-based printable electronics: Highly conductive films make functional circuits without adding high heat January 4th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project