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EIPC Summer Conference Dresden 2008
The European Institute of Printed Circuits (EIPC) extends an invitation to companies and individuals active in the Packaging and Interconnection Industry to submit abstracts for presentation at their Summer Conference which is to be held onMay 29 & 30 2008 in Dresden, Germany.
The aim of the Summer Conference is to provide a platform for speakers and delegates to exchange information on market conditions and future innovation on interconnection and packaging. Delegates and visitors from throughout Europe will attend this event, offering presenters the opportunity to reach a targeted audience of decision makers and leaders of the international packaging and interconnection industry.
Dresden, A Top Ten Business Location in Germany
The Saxon state capital is not only an attractive metropolis; it has also evolved into an acknowledged and dynamic city of business and science over the past few years. This is easily demonstrated in a very impressive manner by the city's spectacular and successful business setups, continuous economic growth, rising sales figures, substantial expansion of already established enterprises, decreasing unemployment figures, and growing purchasing power as well as its top placement in all famous economic rankings.
The city's economy is based on a wide range of branches. Thus, the decisive impulses for growth and development emanate from the three future-oriented fields of competence: microelectronics/information and communication technology, nanotechnology / new materials, and life sciences / biotechnology. But Dresden also has an exceptional concentration of research institutions. One of the outstanding features of the venue is the close link existing between research and industry which results in superb performances and innovative developments while setting worldwide impulses. Very motivated and highly qualified employees, of whom 55% work in the high tech sector, reinforce this trend.
The conference organisers will choose a suitable hotel in the city centre of Dresden as venue for the conference. Dresden Airport is situated about nine kilometers north-east of the city centre. If you want to use public transport, there are S-Bahn, bus and tram connections to take you from the airport to the city centre quickly and inexpensively.
This will be an evening dinner in a typical German atmosphere which is included in the conference fee for participants. At the end of the first conference day, all conference participants and, if applicable , their partners are invited to join us for an evening tour and a wonderful dinner. We will leave the hotel by coach for a city tour to view the many historical highlights Dresden has to offer. After the sight seeing tour the participants can enjoy exquisite German cuisine and afterwards the coach will take us back to the hotel.
We invite you to submit a paper for one of the following key topics:
-- Global & European PCB market trends
-- PCB fabrication success and experience
-- Advanced Technology Developments
-- Improved performance in high-temperature and high reliability applications
-- Technology, Processes and Materials for rigid flexible circuits
-- Materials for PCBs
* Material for advanced ML PCBs
* State of halogen free laminate in Europe
-- Lamination (Standard pressing condition,
* Short cycle pressing HDI layers)
-- Multilayer fabrication
* Imaging (conventional and or digital)
(Inner layer, Outer layer, Solder masking)
-- Plating of halogen free laminate
-- Chemical processes for environmentally friendly manufacture
-- Surface finishes for PCB's (ENIG, Sn, Ag, HASL, Organic)
-- Via hole plugging
* Blind via hole plugging
-- Any other topic you feel may be of interest
Notes for speakers
The following guidelines are provided regarding the submittal of papers and how they are to be presented at the Summer Conference in Dresden:
-- Papers should supply new technical, management or statistical information and not be presented for commercial purposes.
-- All presentations should be made in English. If the author has problems with presenting in English, he or she should note this situation on the Abstract Submission Form.
-- Presentations should not make direct comparisons with competitors' products.
-- When the description of particular equipment is necessary for proper understanding of the process, it shall be confined to technical aspects.
-- Text files of the presentation will be required in a universal application like MS Word or in Adobe Acrobat PDF format.
-- Illustrations, graphics, tables or pictures (including presenter's photograph) have to be electronically delivered in standard format and in the appropriate resolution (75 dpi for electronic publication and/or 300 dpi for printed material).
-- The author or presenter of an oral presentation will be offered a complimentary one day conference registration, valid on the day the author is invited to present.
Abstracts should include the following:
-- Title of Presentation
-- Author Listing; first/last name, affiliation, mailing address, telephone, fax, e-mail
-- Abstract text (max. 200 words)
-- Biography: brief background on the principal/presenting author (max. 100 words)
Abstracts will be reviewed by the Programme Committee, consisting of experts from within our industry. The official language of the Conference is English, NO simultaneous translations will be provided.
Selections will be based on the following criteria:
-- Contribution to the industry.
-- The abstract should clearly describe the nature, content, key points, and significance of the proposed paper.
-- Presentations are to be strictly non-commercial and must focus on technical merits of described processes.
-- Proprietary and/or confidentiality issues as well as approvals should be determined at time of submission.
Instructions will be included in an author's kit that will be mailed to you on acceptance of your proposal. All presentations will be included in the Proceedings of the Winter Conference. Manuscripts will be required for inclusion in the Proceedings.
-- 1 page Abstract February 20, 2008
-- Notification of Acceptance March 7, 2008
Please use the abstract submission form, which you can get from www.eipc.org
Table Top Exhibition and Poster Display Area
During the EIPC Summer Conference, the EIPC will provide an opportunity for information sharing and discussion in a dedicated area. This will allow for visitors to obtain latest product information and know-how on an informal, or ‘one-to-one' basis.
A 'Poster Wall' and a table with chairs will be provided during the two days of the Conference.
Kindly note that space for the Table Top Exhibition is limited, so you are asked to book as early as possible.
Costs for the ‘Table Top and Poster Exhibition' include one person for coffee breaks and lunch. Conference participation and evening party are not included.
The European Institute of Printed Circuits (EIPC), based in The Netherlands, is an international service provider to the European Interconnection and Packaging Industry.
Since 1968, the EIPC is servicing about 130 member companies, including suppliers of machinery and materials to the PCB industry, PCB Manufacturers, contract electronics manufacturers and OEM’s.
For more information, please click here
EIPC Services B.V.
6211 ND Maastricht
EIPC Services B.V.
PO Box 2060
6201 CD Maastricht
Copyright © EIPCIf you have a comment, please Contact us.
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