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January 2nd, 2008
Interconnect Conference Expands Scope
The IITC committee also added a section on novel materials and concepts, which could include papers on optical interconnects, nanotechnology-based interconnects, new interconnect materials, etc. "At one time, we had several papers that looked at all the low-k candidates and compared them. We got away from that kind of presentation, but now we're returning to these materials papers, which can be about low-k materials, metals for contacts, CMP slurry materials, and the science behind them," Shapiro said.
The IITC will continue to provide a forum for the exploration of all interconnect concepts from on-chip to the system level, calling attention to the ultimate influence chip-level decisions have on system performance. There are sessions on process modeling, reliability and interconnect systems, in addition to those previously mentioned. The call for papers deadline for the June 1-4, 2008, conference in Burlingame, Calif., is Feb. 1.
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