Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Toshiba and IBM Extend Semiconductor Research and Development Collaboration

Abstract:
New Agreement Broadens and Extends Ongoing Collaboration to Include 32nm CMOS Process Technology

Toshiba and IBM Extend Semiconductor Research and Development Collaboration

EAST FISHKILL, NY and TOKYO, Japan | Posted on December 18th, 2007

IBM (NYSE: IBM) and Toshiba Corporation today announced that they have entered into a joint development agreement on 32nm bulk complementary metal oxide semiconductor (CMOS) process technology.

Since December 2005, IBM and Toshiba have collaborated on fundamental advanced research related to semiconductor process technologies at the 32nm technology generation and beyond at the research facilities in Yorktown and Albany, New York. Building on the success of this ongoing research collaboration, the two companies have agreed to extend the scope of the joint development work to now include 32nm bulk CMOS process technology.

Under the new agreement, Toshiba joins a six company IBM Alliance for 32nm bulk CMOS process technology development* based in East Fishkill, New York.

Through this collaboration IBM and Toshiba plan to accelerate development of next-generation technology to achieve high-performance, energy-efficient chips at the 32nm process level, and to enhance the companies' leadership in the global semiconductor industry.

"This agreement caps a year of extraordinary momentum for IBM and its semiconductor Alliance Partners," said Gary Patton, vice president for IBM's Semiconductor Research and Development Center. "In 2008 we'll continue to strive to collectively deliver the industry breakthroughs and manufacturing milestones that come from talented engineers and semiconductor experts working in an open, collaborative environment with access to world class R&D facilities such as UAlbany NanoCollege's Albany NanoTech complex."

"This is a promising collaboration," said Mr. Shozo Saito, Corporate Senior Vice President of Toshiba Corporation and President & CEO of Toshiba's Semiconductor Company. "In addition to continuing the successful collaboration on fundamental advanced research, Toshiba will jointly develop the state-of-the-art 32nm bulk CMOS process integration technology, as a member of the world-class seven-company IBM Alliance. Concurrently we will also accelerate our own development of integration technology for the 32nm process at Toshiba's Advanced Microelectronics Center in Yokohama, toward achieving early production of leading-edge devices."

* For recent news on IBM's Semiconductor Alliance partners please see: http://www-03.ibm.com/press/us/en/pressrelease/22858.wss

For further information about IBM Microelectronics, visit http://www.ibm.com/chips/

####

For more information, please click here

Contacts:
IBM Contact:
Bruce McConnel
IBM Media Relations
203-739-5462


Toshiba Corporation Press Contact:
Corporate Communications Office
+81-(3)3457-2105
http://www.toshiba.co.jp/contact/media.htm

Copyright © Marketwire

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

A promising route to the scalable production of highly crystalline graphene films August 26th, 2016

Analog DNA circuit does math in a test tube: DNA computers could one day be programmed to diagnose and treat disease August 25th, 2016

Silicon nanoparticles trained to juggle light: Research findings prove the capabilities of silicon nanoparticles for flexible data processing in optical communication systems August 25th, 2016

AIM Photonics Announces Release of Process Design Kit (PDK) for Integrated Silicon Photonics Design August 25th, 2016

Announcements

Forces of nature: Interview with microscopy innovators Gerd Binnig and Christoph Gerber August 26th, 2016

A promising route to the scalable production of highly crystalline graphene films August 26th, 2016

Graphene under pressure August 26th, 2016

New electrical energy storage material shows its power: Nanomaterial combines attributes of both batteries and supercapacitors August 25th, 2016

Alliances/Trade associations/Partnerships/Distributorships

Thomas Swan and NGI announce unique partnership July 28th, 2016

Starpharma initiates new DEPô drug delivery program with AstraZeneca July 27th, 2016

XEI Scientific Partners with Electron Microscopy Sciences to Promote and Sell its Products in North and South America July 25th, 2016

Leti and Korea Institute of Science and Technology to Explore Collaboration on Advanced Technologies for Digital Era July 14th, 2016

Research partnerships

New electrical energy storage material shows its power: Nanomaterial combines attributes of both batteries and supercapacitors August 25th, 2016

New theory could lead to new generation of energy friendly optoelectronics: Researchers at Queen's University Belfast and ETH Zurich, Switzerland, have created a new theoretical framework which could help physicists and device engineers design better optoelectronics August 23rd, 2016

A new way to display the 3-D structure of molecules: Metal-organic frameworks provide a new platform for solving the structure of hard-to-study samples August 21st, 2016

Researchers watch catalysts at work August 19th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic