Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Toshiba and IBM Extend Semiconductor Research and Development Collaboration

Abstract:
New Agreement Broadens and Extends Ongoing Collaboration to Include 32nm CMOS Process Technology

Toshiba and IBM Extend Semiconductor Research and Development Collaboration

EAST FISHKILL, NY and TOKYO, Japan | Posted on December 18th, 2007

IBM (NYSE: IBM) and Toshiba Corporation today announced that they have entered into a joint development agreement on 32nm bulk complementary metal oxide semiconductor (CMOS) process technology.

Since December 2005, IBM and Toshiba have collaborated on fundamental advanced research related to semiconductor process technologies at the 32nm technology generation and beyond at the research facilities in Yorktown and Albany, New York. Building on the success of this ongoing research collaboration, the two companies have agreed to extend the scope of the joint development work to now include 32nm bulk CMOS process technology.

Under the new agreement, Toshiba joins a six company IBM Alliance for 32nm bulk CMOS process technology development* based in East Fishkill, New York.

Through this collaboration IBM and Toshiba plan to accelerate development of next-generation technology to achieve high-performance, energy-efficient chips at the 32nm process level, and to enhance the companies' leadership in the global semiconductor industry.

"This agreement caps a year of extraordinary momentum for IBM and its semiconductor Alliance Partners," said Gary Patton, vice president for IBM's Semiconductor Research and Development Center. "In 2008 we'll continue to strive to collectively deliver the industry breakthroughs and manufacturing milestones that come from talented engineers and semiconductor experts working in an open, collaborative environment with access to world class R&D facilities such as UAlbany NanoCollege's Albany NanoTech complex."

"This is a promising collaboration," said Mr. Shozo Saito, Corporate Senior Vice President of Toshiba Corporation and President & CEO of Toshiba's Semiconductor Company. "In addition to continuing the successful collaboration on fundamental advanced research, Toshiba will jointly develop the state-of-the-art 32nm bulk CMOS process integration technology, as a member of the world-class seven-company IBM Alliance. Concurrently we will also accelerate our own development of integration technology for the 32nm process at Toshiba's Advanced Microelectronics Center in Yokohama, toward achieving early production of leading-edge devices."

* For recent news on IBM's Semiconductor Alliance partners please see: http://www-03.ibm.com/press/us/en/pressrelease/22858.wss

For further information about IBM Microelectronics, visit http://www.ibm.com/chips/

####

For more information, please click here

Contacts:
IBM Contact:
Bruce McConnel
IBM Media Relations
203-739-5462


Toshiba Corporation Press Contact:
Corporate Communications Office
+81-(3)3457-2105
http://www.toshiba.co.jp/contact/media.htm

Copyright © Marketwire

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

Tuning into quantum: Scientists unlock signal frequency control of precision atom qubits July 16th, 2018

Nanometrics to Announce Second Quarter Financial Results on July 31, 2018 July 12th, 2018

Leti and Soitec Launch a New Substrate Innovation Center to Develop Engineered Substrate Solutions: Industry-inclusive hub promotes early collaboration and learning from substrate to system level July 11th, 2018

GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX Technology : With 50 client designs and growing, 22FDX proves its value as a cost-effective solution for power-sensitive applications July 9th, 2018

Announcements

The relationship between charge density waves and superconductivity? It's complicated July 19th, 2018

Sirrus's Issued Patent Portfolio Continues To Accelerate July 18th, 2018

FEFU scientists reported on toxicity of carbon and silicon nanotubes and carbon nanofibers: Nanoparticles with a wide range of applying, including medicine, damage cells of microalgae Heterosigma akashivo badly. July 18th, 2018

In borophene, boundaries are no barrier: Rice U., Northwestern researchers make and test atom-thick boron's unique domains July 17th, 2018

Alliances/Trade associations/Partnerships/Distributorships

Leti and Oscaro Partner on Letis New Low-Power, Low-Cost Transceiver to Track Parcels July 12th, 2018

Leti and Soitec Launch a New Substrate Innovation Center to Develop Engineered Substrate Solutions: Industry-inclusive hub promotes early collaboration and learning from substrate to system level July 11th, 2018

Leti & Partners Launch Pilot Program to Assess New Perception Sensors for Autonomous Vehicles July 5th, 2018

Powering the 21st Century with Integrated Photonics: UCSB-Led Team Selected for Demonstration of a Novel Waveguide Platform Which is Transparent Throughout the MWIR and LWIR Spectral Bands June 19th, 2018

Research partnerships

The relationship between charge density waves and superconductivity? It's complicated July 19th, 2018

FEFU scientists reported on toxicity of carbon and silicon nanotubes and carbon nanofibers: Nanoparticles with a wide range of applying, including medicine, damage cells of microalgae Heterosigma akashivo badly. July 18th, 2018

In borophene, boundaries are no barrier: Rice U., Northwestern researchers make and test atom-thick boron's unique domains July 17th, 2018

Nano-kirigami: 'Paper-cut' provides model for 3D intelligent nanofabrication July 13th, 2018

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project