Home > News > Toshiba, NEC Electronics to team up on 32-nm chips
November 28th, 2007
Toshiba, NEC Electronics to team up on 32-nm chips
Abstract:
Japanese chipmakers Toshiba and NEC Electronics said Tuesday they would jointly develop 32-nanometer chips to better keep up with rivals.
The companies will decide in 2008 how and if they will jointly produce the chips, they said.
Chipmakers are racing to move to tinier circuit sizes to cut production costs per chip function and to enable powerful electronics that run for hours without killing the battery. But the shift also forces changes in fundamental materials and processes and exposes chipmakers to huge initial costs.
Source:
news.zdnet.com
Bookmark:
Chip Technology
Imec and GLOBALFOUNDRIES collaborate to advance high-density memory technology: STT-MRAM offers enhanced performance and scalability for embedded and standalone applications May 21st, 2013
Penn engineers' nanoantennas improve infrared sensing May 20th, 2013
UC Riverside scientists discovering new uses for tiny carbon nanotubes: Adding ionic liquid to nanotube films could build smaller gadgets, and create more cost effective 'Smart Windows' that darken in bright sun May 15th, 2013
Nanometrics Announces Upcoming Investor Events May 14th, 2013
Announcements
JPK reports on single molecule research at IISER Pune in India using AFM and CellHesion techniques May 21st, 2013
Imec and GLOBALFOUNDRIES collaborate to advance high-density memory technology: STT-MRAM offers enhanced performance and scalability for embedded and standalone applications May 21st, 2013
International survey supports need for built-in water protection on smartphones and tablets May 21st, 2013
Rice unveils method for tailoring optical processors: Arranging nanoparticles in geometric patterns allows for control of light with light May 21st, 2013
Alliances/Partnerships/Distributorships
Imec and GLOBALFOUNDRIES collaborate to advance high-density memory technology: STT-MRAM offers enhanced performance and scalability for embedded and standalone applications May 21st, 2013
NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013
Imec and Renesas collaborate on ultra-low power short range radios: Collaboration will develop robust wireless solutions for future electronics May 16th, 2013
HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013