Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Applied Materials’ UVision 3 Sets Benchmark for Brightfield Inspection Sensitivity and Productivity

Applied Materials' UVision 3 system delivers 40% faster throughput than any brightfield inspection tool and the 20nm sensitivity needed for advanced immersion lithography. (Photo: Business Wire)
Applied Materials' UVision 3 system delivers 40% faster throughput than any brightfield inspection tool and the 20nm sensitivity needed for advanced immersion lithography. (Photo: Business Wire)

Abstract:
Applied Materials, Inc. today unveiled its Applied UVision® 3 system, the industry's highest productivity DUV1 Brightfield wafer inspection tool with the critical-defect detection sensitivity required for 45 nanometer (nm) FEOL2 and immersion lithography. Delivering significant advancements to Applied's breakthrough UVision technology, this next-generation system triples the number of laser beams scanning the wafer to provide 40% faster throughput than any competitive system. Two new imaging modes extend sensitivity to 20nm, and a new flexible automatic defect classification engine enables quick access to defects of interest and faster yield learning.

Applied Materials’ UVision 3 Sets Benchmark for Brightfield Inspection Sensitivity and Productivity

SANTA CLARA, CA | Posted on November 26th, 2007

"The UVision 3 system's multi-beam DUV laser architecture allows extendibility beyond the resolution limits of traditional optical inspection," said Dr. Gilad Almogy, vice president and general manager of Applied Materials' Process Diagnostics and Control group. "With this enhanced system, leading-edge memory and immersion lithography manufacturers can run volume production at engineering tool sensitivity with a shorter cycle time to generate meaningful data. We have shipped multiple UVision 3 systems to leading customers where they have validated its exceptional sensitivity at groundbreaking DUV Brightfield throughputs."

By coupling unique laser DUV architecture with a sensitive photo-multiplier tube (PMT) and variable polarization, the UVision 3 system also meets the challenges of 32nm memory development. New Brightfield imaging modes, both in the illumination and collection path, address the contrast versatility required for immersion lithography. In addition, the system's innovative algorithms of high defect accuracy and stitch-to-stitch detection enable enhanced sensitivity on periphery areas, a key advantage not addressed by any other Brightfield system.

UVision 3 is an integral part of Applied Material's advanced lithography-enabling technologies for 45nm and below double patterning and advanced FEOL applications. For more information on the Applied UVision system, visit http://appliedmaterials.com/products/uvision_4.html .

1 DUV=deep ultraviolet

2 FEOL=front end of line

####

About Applied Materials, Inc.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in Nanomanufacturing Technology™ solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel displays, solar photovoltaic cells, flexible electronics and energy efficient glass. At Applied Materials, we apply Nanomanufacturing Technology to improve the way people live.

For more information, please click here

Contacts:
Applied Materials, Inc.
Betty Newboe
408-563-0647
(editorial/media)

Randy Bane
408-986-7977
(financial community)

Copyright © Business Wire 2007

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

SouthWest NanoTechnologies (SWeNT) Receives NIST Small Business Innovation Research (SBIR) Phase 1 Award to Produce Greater than 99% Semiconducting Single-Wall Carbon Nanotubes September 19th, 2014

Toward optical chips: A promising light source for optoelectronic chips can be tuned to different frequencies September 19th, 2014

IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices September 18th, 2014

‘Small’ transformation yields big changes September 16th, 2014

Announcements

New star-shaped molecule breakthrough: Scientists at The University of Manchester have generated a new star-shaped molecule made up of interlocking rings, which is the most complex of its kind ever created September 22nd, 2014

Synthesis of Nanostructures with Controlled Shape, Size in Iran September 22nd, 2014

Iranian Scientists Separate Zinc Ion at Low Concentrations September 20th, 2014

Toward optical chips: A promising light source for optoelectronic chips can be tuned to different frequencies September 19th, 2014

Tools

IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices September 18th, 2014

FEI Opens New Technology Center in Czech Republic: FEI expands its presence in Brno with the opening of a new, larger facility September 18th, 2014

New NPZ100-403 Piezo Stage from nPoint Inc. September 17th, 2014

Researchers Create World’s Largest DNA Origami September 11th, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE