Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Applied Materials’ UVision 3 Sets Benchmark for Brightfield Inspection Sensitivity and Productivity

Applied Materials' UVision 3 system delivers 40% faster throughput than any brightfield inspection tool and the 20nm sensitivity needed for advanced immersion lithography. (Photo: Business Wire)
Applied Materials' UVision 3 system delivers 40% faster throughput than any brightfield inspection tool and the 20nm sensitivity needed for advanced immersion lithography. (Photo: Business Wire)

Abstract:
Applied Materials, Inc. today unveiled its Applied UVision® 3 system, the industry's highest productivity DUV1 Brightfield wafer inspection tool with the critical-defect detection sensitivity required for 45 nanometer (nm) FEOL2 and immersion lithography. Delivering significant advancements to Applied's breakthrough UVision technology, this next-generation system triples the number of laser beams scanning the wafer to provide 40% faster throughput than any competitive system. Two new imaging modes extend sensitivity to 20nm, and a new flexible automatic defect classification engine enables quick access to defects of interest and faster yield learning.

Applied Materials’ UVision 3 Sets Benchmark for Brightfield Inspection Sensitivity and Productivity

SANTA CLARA, CA | Posted on November 26th, 2007

"The UVision 3 system's multi-beam DUV laser architecture allows extendibility beyond the resolution limits of traditional optical inspection," said Dr. Gilad Almogy, vice president and general manager of Applied Materials' Process Diagnostics and Control group. "With this enhanced system, leading-edge memory and immersion lithography manufacturers can run volume production at engineering tool sensitivity with a shorter cycle time to generate meaningful data. We have shipped multiple UVision 3 systems to leading customers where they have validated its exceptional sensitivity at groundbreaking DUV Brightfield throughputs."

By coupling unique laser DUV architecture with a sensitive photo-multiplier tube (PMT) and variable polarization, the UVision 3 system also meets the challenges of 32nm memory development. New Brightfield imaging modes, both in the illumination and collection path, address the contrast versatility required for immersion lithography. In addition, the system's innovative algorithms of high defect accuracy and stitch-to-stitch detection enable enhanced sensitivity on periphery areas, a key advantage not addressed by any other Brightfield system.

UVision 3 is an integral part of Applied Material's advanced lithography-enabling technologies for 45nm and below double patterning and advanced FEOL applications. For more information on the Applied UVision system, visit http://appliedmaterials.com/products/uvision_4.html .

1 DUV=deep ultraviolet

2 FEOL=front end of line

####

About Applied Materials, Inc.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in Nanomanufacturing Technology™ solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel displays, solar photovoltaic cells, flexible electronics and energy efficient glass. At Applied Materials, we apply Nanomanufacturing Technology to improve the way people live.

For more information, please click here

Contacts:
Applied Materials, Inc.
Betty Newboe
408-563-0647
(editorial/media)

Randy Bane
408-986-7977
(financial community)

Copyright © Business Wire 2007

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

Surprising qualities of insulator ring surfaces: Surface phenomena in ring-shaped topological insulators are just as controllable as those in spheres made of the same material June 30th, 2016

How cancer cells spread and squeeze through tiny blood vessels (video) June 30th, 2016

New, better way to build circuits for world's first useful quantum computers June 28th, 2016

Soft decoupling of organic molecules on metal June 23rd, 2016

Announcements

A drop of water as a model for the interplay of adhesion and stiction June 30th, 2016

No need in supercomputers: Russian scientists suggest a PC to solve complex problems tens of times faster than with massive supercomputers June 30th, 2016

Surprising qualities of insulator ring surfaces: Surface phenomena in ring-shaped topological insulators are just as controllable as those in spheres made of the same material June 30th, 2016

How cancer cells spread and squeeze through tiny blood vessels (video) June 30th, 2016

Tools

How cancer cells spread and squeeze through tiny blood vessels (video) June 30th, 2016

Oxford Instruments and Dresden High Magnetic Field Laboratory collaborate to develop HTS magnet technology components for high field superconducting magnet systems June 29th, 2016

Texas A&M Chemist Says Trapped Electrons To Blame For Lack Of Battery Efficiency: Forget mousetraps — today’s scientists will get the cheese if they manage to build a better battery June 28th, 2016

FEI Launches Helios G4 DualBeam Series for Materials Science: The Helios G4 DualBeam Series features new capabilities to enable scientists and engineers to answer the most demanding and challenging scientific questions June 27th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic