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Home > News > The challenge of integrating fragile nanostructures into functional devices

November 18th, 2007

The challenge of integrating fragile nanostructures into functional devices

We have written Spotlight after Spotlight pointing out the numerous challenges that researchers are facing with regard to nanofabrication. Uncountable research papers have been written about the numerous methods available for synthesizing nanomaterials. What today is called 'nanofabrication' deals with the issues of fabricating complex and functional nano- and microstructures by integrating these synthesized nanomaterials. To complicate matters, many of these nanomaterials are fragile, either because they are composed of a limited number of atomic layers or because they are 'soft', i.e., of biological or molecular nature. This fragile nature of some materials creates a major headache: how to integrate them at an individual level into devices without altering their structure and, consequently, their properties during device fabrication. Currently, researchers use mainly e-beam lithography and, in some cases, focused ion beam to fabricate devices which incorporate nanostructures. These methods have been proven to be very useful, for example for investigations of carbon nanotubes. However, they can not be applied on fragile nanostructures, because they damage or contaminate the structures - this could result from exposure to high energy particle beams; the requirement for lift-off steps; exposure to chemicals, etc. Researchers have now shown that individual nanostructures can be integrated into functional devices using dynamic nanostenceling which allows the integration of individual nanostructures into devices using entirely scanning probe based methods and without exposure to damaging conditions, such as high-energy charged particles, heat, or resists.


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