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November 8th, 2007
A compostable plastic made from nanoengineered polylactic acid (PLA) is designed to meet the demands of high-temperature thermoforming packaging.
Standalone PLA has a heat resistance of about 105°F (44°c), while the new engineered resin from Cereplast incorporates nanotechnology and a patented process that allows it to reach up to 155°F (68°c).
Cereplast said this week it is marketing its high-temperature resistant CP-TH-6000 at a price lower than conventional styrenic thermoformed resin.
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