Home > News > PLA plastic nanoengineered for high temperature thermoforming
November 8th, 2007
PLA plastic nanoengineered for high temperature thermoforming
A compostable plastic made from nanoengineered polylactic acid (PLA) is designed to meet the demands of high-temperature thermoforming packaging.
Standalone PLA has a heat resistance of about 105°F (44°c), while the new engineered resin from Cereplast incorporates nanotechnology and a patented process that allows it to reach up to 155°F (68°c).
Cereplast said this week it is marketing its high-temperature resistant CP-TH-6000 at a price lower than conventional styrenic thermoformed resin.
Penn Study: Understanding Graphene’s Electrical Properties on an Atomic Level July 22nd, 2014
NUS scientists use low cost technique to improve properties and functions of nanomaterials: By 'drawing' micropatterns on nanomaterials using a focused laser beam, scientists could modify properties of nanomaterials for effective applications in photonic and optoelectric applicat July 22nd, 2014
Steam from the sun: New spongelike structure converts solar energy into steam July 21st, 2014
Carbyne morphs when stretched: Rice University calculations show carbon-atom chain would go metal to semiconductor July 21st, 2014
Harris & Harris Group to Host Conference Call on Second-Quarter 2014 Financial Results on August 15, 2014 July 23rd, 2014
UCF Nanotech Spinout Developing Revolutionary Battery Technology: Power the Next Generation of Electronics with Carbon July 23rd, 2014
Deadline Announced for Registration in 7th Int'l Nanotechnology Festival in Iran July 23rd, 2014
A Crystal Wedding in the Nanocosmos July 23rd, 2014
Key Announcements made at TAPPI International Nanotechnology Conference July 7th, 2014
Squid sucker ring teeth material could aid reconstructive surgery, serve as eco-packaging July 2nd, 2014
FDA issues guidance on use of nanotechnology in foods July 1st, 2014
Shaken, not stirred -- mythical god's capsules please! June 26th, 2014