Home > News > TAPPI issues call for papers for 2008 PLACE conference
November 7th, 2007
TAPPI issues call for papers for 2008 PLACE conference
TAPPI invites all industry professionals to participate in the 2008 PLACE Conference Technical Program, September 14-17, 2008 in Portsmouth, Virginia. Sponsored by TAPPI's Polymers, Laminations, Adhesives, Coatings, and Extrusions (PLACE) Division, this conference is tailored for attendees from all areas of the flexible packaging and converting industries.
Key topics for the 2008 conference include brand owner presentations, sustainability, biodegradable packaging, nanotechnology, intelligent/smart packaging, barrier innovations, converting solutions, performance packaging, and productivity enhancement.
Democratizing synthetic biology: New method makes research cheaper, faster, and more accessible March 3rd, 2015
Pens filled with high-tech inks for do-it-yourself sensors March 3rd, 2015
Black phosphorus is new 'wonder material' for improving optical communication March 3rd, 2015
Heightened Efficiency in Purification of Wastewater Using Nanomembranes March 3rd, 2015
International research partnership tricks the light fantastic March 2nd, 2015
UC research partnership explores how to best harness solar power March 2nd, 2015
Imec, Holst Centre and Renesas Present World’s Lowest Power 2.4GHz Radio Chip for Bluetooth Low Energy March 1st, 2015
Imec Demonstrates Compact Wavelength-Division Multiplexing CMOS Silicon Photonics Transceiver March 1st, 2015