Home > News > TAPPI issues call for papers for 2008 PLACE conference
November 7th, 2007
TAPPI issues call for papers for 2008 PLACE conference
TAPPI invites all industry professionals to participate in the 2008 PLACE Conference Technical Program, September 14-17, 2008 in Portsmouth, Virginia. Sponsored by TAPPI's Polymers, Laminations, Adhesives, Coatings, and Extrusions (PLACE) Division, this conference is tailored for attendees from all areas of the flexible packaging and converting industries.
Key topics for the 2008 conference include brand owner presentations, sustainability, biodegradable packaging, nanotechnology, intelligent/smart packaging, barrier innovations, converting solutions, performance packaging, and productivity enhancement.
Atom-thick CCD could capture images: Rice University scientists develop two-dimensional, light-sensitive material December 20th, 2014
Oregon researchers glimpse pathway of sunlight to electricity: Collaboration with Lund University uses modified UO spectroscopy equipment to study 'maze' of connections in photoactive quantum dots December 19th, 2014
Instant-start computers possible with new breakthrough December 19th, 2014
Aculon Hires New Business Development Director December 19th, 2014
Bruker Introduces BioScope Resolve High-Resolution BioAFM System: Featuring PeakForce Tapping for Quantitative Bio-Mechanical Property Mapping December 16th, 2014
TCL Launches World’s Most Advanced TV in the World’s Largest Market: New Quantum Dot TVs with Color IQ™ Optics Deliver OLED-Quality Color at a Fraction of the Price December 15th, 2014
Stanford team combines logic, memory to build a 'high-rise' chip: Today circuit cards are laid out like single-story towns; Futuristic architecture builds layers of logic and memory into skyscraper chips that would be smaller, faster, cheaper -- and taller December 15th, 2014
PETA science consortium to present at Society for Risk Analysis meeting December 10th, 2014