Nanotechnology Now

• About Us
  
  • Advertising
  • Our Mission
  • Our Team
  • Comments
  • Friends
  • Contact
• Nanotechnology
• News
  
  • Current News
  • Press Releases
  • Submit Press
  • Press kit
  • Interviews
• Columns
• Products
  
  • Our Products
  • Books
  • Featured Books
• Directories
  
  • Companies/Academic
  • Events
  • Glossary
  • Best Of
• Career Center
• Nano-Social Network
• Nano Consulting
• My Account

Home > News > Basis for pan-European cooperation: 'Micro/Nano-Atlas of Europe' analyses technologies and markets in high-tech clusters

October 19th, 2007

Basis for pan-European cooperation: 'Micro/Nano-Atlas of Europe' analyses technologies and markets in high-tech clusters

Abstract:
According to the economist's Michael Porter's cluster theory, clusters (economic agglomerations) make a region and the local industry more competitive. The recently published "Micro/Atlas of Europe" describes eight leading-edge microand nanotechnology clusters in Northern, Western and Central Europe. By pointing out similarities and differences, it demonstrates where cross-border cooperation between clusters might be possible and fruitful.

Source:
nanowerk.com

Bookmark:

Related News Press

Announcements

Aspen Aerogels Announces $22.5 Million Private Placement May 18th, 2013

NanoInk, Inc. Assets To Be Sold May 18th, 2013

NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013

Scientists capture first direct proof of Hofstadter butterfly effect May 17th, 2013

Alliances/Partnerships/Distributorships

NIA Public Briefing: Nanotechnology and the Council of Europe May 17th, 2013

Imec and Renesas collaborate on ultra-low power short range radios: Collaboration will develop robust wireless solutions for future electronics May 16th, 2013

HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013

Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process: Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding May 13th, 2013