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Home > News > Avoiding yield killers in 3D nanoimprint lithography

October 7th, 2007

Avoiding yield killers in 3D nanoimprint lithography

Nanoimprint lithography (NIL) has developed into a key technique for the fabrication of polymer nanopatterns and three-dimensional (3D) nanostructures. At its core, NIL is a simple nanometer scale pattern transfer process where a master mold with a desired pattern is used to fabricate identical patterns in an imprint resist, typically a polymer, with subsequent heat or light curing of the resulting mold. The attractivity of NIL comes from its capability for patterning with high resolution, high fidelity, high throughput, and low cost. Using NIL, nanometer sized patterns can easily be formed on various substrates, including silicon wafers, glass plates, flexible polymer films, and even nonplanar substrates. The limitation of conventional NIL techniques lies in their resulting patterned 2D layers; the formation of 3D micro- and nanostructures by stacking the 2D layers cannot be achieved by conventional NIL. That's why researchers came up with reverse nanoimprint lithography, a technique to transfer patterned 2D layers and to form multistacked 3D micro- and nanostructures on the substrate. While this works in principal, the achievable yields are very low due to the difficulty of detaching the master mold from the 3D structure. Researchers in South Korea have now managed to demonstrate the first successful fabrication of multi-stacked 2D nano patterned slabs on various substrates including flexible polymer film. This means real 3D nano structures such as photonic crystals can be fabricated with reasonable cost.


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