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Phiar Honored for Pioneering New Concepts in Metal-Insulator Electronics Device Technology
Phiar Corporation, the leading provider of metal-insulator electronics, today announced it has received the Award for Small Business Innovation Research from the Defense Advanced Research Projects Agency (DARPA), which serves as the central research and development organization for the Department of Defense. The award ceremony was held on August 8 during the DARPATech 2007 conference in Anaheim, Calif.
"Phiar Corporation achieved innovation excellence by creating new electronic device technology that enables affordable, low-power sensor and communication operations," said Dr. Anthony J. Tether, director of DARPA. "Using new nanotechnology-based quantum tunneling principles, Phiar's technology offers a potential solution to the speed and power limitations of semiconductor-based devices and higher performance from existing manufacturing technologies."
Phiar is currently involved in a DARPA II contract after successfully completing two previous DARPA contracts. The latest grant was made through DARPA's Microsystems Technology Office to fund metal-insulator transistor development. Phiar is developing a new, full product family of metal-insulator electronic devices including diodes, detectors, modulators, mixers, varactors and transistors. Phiar's patented devices provide substantial speed advantages over semiconductor devices and can be manufactured with existing CMOS factory equipment. Phiar's technology, which can be integrated on a wide range of substrates, exceeds the performance limitations of semiconductor-based devices while being less expensive to manufacture.
"It is a great honor and a tremendous validation of our efforts to be recognized by DARPA for developing new, high-performance metal-insulator electronics," said Bob Goodman, CEO of Phiar Corporation. "Our work with DARPA has fueled incredible innovation in our labs, and we are delighted to continue to work with DARPA to further strengthen our country's ability to defend itself against foreign threats."
About Phiar Corporation
Phiar is developing low cost, nano-scale devices that take performance beyond the physical limits of semiconductors. Phiar’s metal-insulator technology can be integrated into supporting CMOS chip dies, or manufactured on a wide range of other substrates. Natively operating from DC to 3 THz, Phiar’s technology is a compact, practical replacement for costly compound semiconductors in GHz applications and cryogenic devices in the emerging THz field. Phiar is funded by Menlo Ventures.
DARPA is the central research and development organization for the Department of Defense. DARPA's mission is to maintain the technological superiority of the U.S. military and prevent technological surprise from harming our national security by sponsoring revolutionary, high-payoff research that bridges the gap between fundamental discoveries and their military use.
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Alissa Vasilevskis or Karen Joe, 415-512-0770
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