Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > AMKOR and IMEC Sign Collaboration Agreement for 3D Wafer-Level Packaging

Abstract:
Amkor Technology, Inc. (Nasdaq: AMKR), a world-leading provider of advanced semiconductor assembly and test services, and IMEC, a leading independent non-profit nanoelectronics and nanotechnology research center based in Belgium, today announced that they have entered into a 2-year collaboration agreement to develop cost-effective, 3D integration technology based on wafer-level processing techniques.

AMKOR and IMEC Sign Collaboration Agreement for 3D Wafer-Level Packaging

CHANDLER, AZ & LEUVEN, Belgium | Posted on July 17th, 2007

"This collaboration with IMEC will enhance our continuing efforts to develop low cost, state of the art packaging solutions for our customers", said Dan Mis, Amkor's Senior Vice President for Wafer Level Advanced Product Development.

Luc Van den hove, IMEC's Executive Vice President and Chief Operating Officer, commented "We are pleased that one of the leading semiconductor packaging service providers has joined our 3D system integration program that targets the development of post-passivation technology for 3D interconnects at the IC bond pad level."

####

About Amkor
Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company’s SEC filings and on Amkor’s web site: http://www.amkor.com .

About IMEC:

IMEC is a leading independent non-profit research center in nanoelectronics and nanotechnology focusing on the next generations of chips and systems, and on the enabling technologies for ambient intelligence. IMEC is headquartered in Leuven, Belgium, and further information on IMEC can be found at http://www.imec.be .

For more information, please click here

Contacts:
Amkor Technology, Inc.
Gil Tily, Corporate Vice President and General Counsel,
480-821-5000, ext. 5162
or
IMEC
Katrien Marent, IMEC Corporate Communications,
+32 16 28 18 80

Copyright © Business Wire 2007

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

ICN2 researchers compute unprecedented values for spin lifetime anisotropy in graphene November 17th, 2017

Nanometrics to Participate in the 6th Annual NYC Investor Summit 2017 November 16th, 2017

GLOBALFOUNDRIES Demonstrates Industry-Leading 112G Technology for Next-Generation Connectivity Solutions: High bandwidth, low power SerDes IP portfolio enables ‘connected intelligence’ in data centers and networking applications November 15th, 2017

Nanometrics Announces $50 Million Share Repurchase Program November 15th, 2017

Announcements

Nanoparticles could allow for faster, better medicine: Exposure of nanoparticles in the body allows for more effective delivery November 20th, 2017

ICN2 researchers compute unprecedented values for spin lifetime anisotropy in graphene November 17th, 2017

Math gets real in strong, lightweight structures: Rice University researchers use 3-D printers to turn century-old theory into complex schwarzites November 16th, 2017

The stacked color sensor: True colors meet minimization November 16th, 2017

Alliances/Trade associations/Partnerships/Distributorships

EC Project Aims at Creating and Commercializing Cyber-Physical-System Solutions November 14th, 2017

GLOBALFOUNDRIES, Fudan Team to Deliver Next Generation Dual Interface Smart Card November 14th, 2017

Leti Coordinating Project to Develop Innovative Drivetrains for 3rd-generation Electric Vehicles: CEA Tech’s Contribution Includes Liten’s Knowhow in Magnetic Materials and Simulation And Leti’s Expertise in Wide-bandgap Semiconductors October 20th, 2017

More 22 of 59,885 Print all In new window Leti to Present Update of CoolCube/3DVLSI Technologies Development at 2017 IEEE S3S: Future Developments and Tape-Out Vehicles to Be Presented during Oct. 17 Workshop October 12th, 2017

Research partnerships

EC Project Aims at Creating and Commercializing Cyber-Physical-System Solutions November 14th, 2017

Leti Joins DARPA-Funded Project to Develop Implantable Device for Restoring Vision November 9th, 2017

Nanoshells could deliver more chemo with fewer side effects: In vitro study verifies method for remotely triggering release of cancer drugs November 8th, 2017

Ames Laboratory, UConn discover superconductor with bounce October 25th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project