Home > Press > AMKOR and IMEC Sign Collaboration Agreement for 3D Wafer-Level Packaging
Amkor Technology, Inc. (Nasdaq: AMKR), a world-leading provider of advanced semiconductor assembly and test services, and IMEC, a leading independent non-profit nanoelectronics and nanotechnology research center based in Belgium, today announced that they have entered into a 2-year collaboration agreement to develop cost-effective, 3D integration technology based on wafer-level processing techniques.
AMKOR and IMEC Sign Collaboration Agreement for 3D Wafer-Level Packaging
CHANDLER, AZ & LEUVEN, Belgium | Posted on July 17th, 2007
"This collaboration with IMEC will enhance our continuing efforts to develop low cost, state of the art packaging solutions for our customers", said Dan Mis, Amkor's Senior Vice President for Wafer Level Advanced Product Development.
Luc Van den hove, IMEC's Executive Vice President and Chief Operating Officer, commented "We are pleased that one of the leading semiconductor packaging service providers has joined our 3D system integration program that targets the development of post-passivation technology for 3D interconnects at the IC bond pad level."
Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company’s SEC filings and on Amkor’s web site: http://www.amkor.com .
IMEC is a leading independent non-profit research center in nanoelectronics and nanotechnology focusing on the next generations of chips and systems, and on the enabling technologies for ambient intelligence. IMEC is headquartered in Leuven, Belgium, and further information on IMEC can be found at http://www.imec.be .
For more information, please click here
Amkor Technology, Inc.
Gil Tily, Corporate Vice President and General Counsel,
480-821-5000, ext. 5162
Katrien Marent, IMEC Corporate Communications,
+32 16 28 18 80
Copyright © Business Wire 2007
If you have a comment, please Contact
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Switching to spintronics: Berkeley Lab reports on electric field switching of ferromagnetism at room temp December 17th, 2014
Pb islands in a sea of graphene magnetise the material of the future December 16th, 2014
Stanford team combines logic, memory to build a 'high-rise' chip: Today circuit cards are laid out like single-story towns; Futuristic architecture builds layers of logic and memory into skyscraper chips that would be smaller, faster, cheaper -- and taller December 15th, 2014
Stacking two-dimensional materials may lower cost of semiconductor devices December 11th, 2014
How does enzymatic pretreatment affect the nanostructure and reaction space of lignocellulosic biomass? December 18th, 2014
Silicon Valley-Based Foresight Valuation Launches STR-IP™, a New Initiative for Startups to Discover the Value of Their Intellectual Property December 18th, 2014
Iranian Scientists Use Nanotechnology to Increase Power, Energy of Supercapacitors December 18th, 2014
Iranian Researchers Produce Electrical Pieces Usable in Human Body December 18th, 2014
SUNY Poly NanoCollege Faculty Member Selected as American Physical Society Fellow: SUNY Poly Associate Professor of Nanoscience Dr. Vincent LaBella Recognized for Significant Technological Innovations that Enable Interactive Learning December 17th, 2014
New 'electronic skin' for prosthetics, robotics detects pressure from different directions December 10th, 2014
SEMATECH Reports Significant Progress in EUV Resist Outgas Testing: Technologists from SEMATECH and JSR demonstrate outgas test results that further enable EUV lithography for high-volume manufacturing readiness December 3rd, 2014
Toward a low-cost 'artificial leaf' that produces clean hydrogen fuel December 3rd, 2014
Unraveling the light of fireflies December 17th, 2014
Scientists trace nanoparticles from plants to caterpillars: Rice University study examines how nanoparticles behave in food chain December 16th, 2014
FEI and Oregon Health & Science University Install a Complete Correlative Microscopy Workflow in Newly Built Collaborative Science Facility December 16th, 2014
New Technique Could Harvest More of the Sun's Energy December 9th, 2014