Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > AMKOR and IMEC Sign Collaboration Agreement for 3D Wafer-Level Packaging

Abstract:
Amkor Technology, Inc. (Nasdaq: AMKR), a world-leading provider of advanced semiconductor assembly and test services, and IMEC, a leading independent non-profit nanoelectronics and nanotechnology research center based in Belgium, today announced that they have entered into a 2-year collaboration agreement to develop cost-effective, 3D integration technology based on wafer-level processing techniques.

AMKOR and IMEC Sign Collaboration Agreement for 3D Wafer-Level Packaging

CHANDLER, AZ & LEUVEN, Belgium | Posted on July 17th, 2007

"This collaboration with IMEC will enhance our continuing efforts to develop low cost, state of the art packaging solutions for our customers", said Dan Mis, Amkor's Senior Vice President for Wafer Level Advanced Product Development.

Luc Van den hove, IMEC's Executive Vice President and Chief Operating Officer, commented "We are pleased that one of the leading semiconductor packaging service providers has joined our 3D system integration program that targets the development of post-passivation technology for 3D interconnects at the IC bond pad level."

####

About Amkor
Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company’s SEC filings and on Amkor’s web site: http://www.amkor.com .

About IMEC:

IMEC is a leading independent non-profit research center in nanoelectronics and nanotechnology focusing on the next generations of chips and systems, and on the enabling technologies for ambient intelligence. IMEC is headquartered in Leuven, Belgium, and further information on IMEC can be found at http://www.imec.be .

For more information, please click here

Contacts:
Amkor Technology, Inc.
Gil Tily, Corporate Vice President and General Counsel,
480-821-5000, ext. 5162
or
IMEC
Katrien Marent, IMEC Corporate Communications,
+32 16 28 18 80

Copyright © Business Wire 2007

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

Strem Chemicals and Dotz Nano Ltd. Sign Distribution Agreement for Graphene Quantum Dots Collaboration February 21st, 2017

Particles from outer space are wreaking low-grade havoc on personal electronics February 19th, 2017

Liquid metal nano printing set to revolutionize electronics: Creating integrated circuits just atoms thick February 18th, 2017

Research opens door to smaller, cheaper, more agile communications tech February 16th, 2017

Announcements

Tiny nanoclusters could solve big problems for lithium-ion batteries February 21st, 2017

Strem Chemicals and Dotz Nano Ltd. Sign Distribution Agreement for Graphene Quantum Dots Collaboration February 21st, 2017

Oxford Instruments announces Dr Brad Ramshaw of Cornell University, as winner of the 2017 Lee Osheroff Richardson Science Prize February 20th, 2017

Breakthrough with a chain of gold atoms: In the field of nanoscience, an international team of physicists with participants from Konstanz has achieved a breakthrough in understanding heat transport February 20th, 2017

Alliances/Trade associations/Partnerships/Distributorships

Strem Chemicals and Dotz Nano Ltd. Sign Distribution Agreement for Graphene Quantum Dots Collaboration February 21st, 2017

Leti Coordinating Project to Adapt Obstacle-Detection Technology Used in Autonomous Cars for Portable and Wearable Systems: INSPEX to Combine Knowhow of Nine European Organizations to Create Portable and Wearable Spatial-Exploration Systems February 2nd, 2017

GLOBALFOUNDRIES Expands Partner Program to Speed Time-to-Market of FDX™ Solutions: Increased support affirms FDXcelerator™ Program’s vital role in promoting broader deployment of GLOBALFOUNDRIES’ FDX™ portfolio December 15th, 2016

Infrared instrumentation leader secures exclusive use of Vantablack coating December 5th, 2016

Research partnerships

Graphene foam gets big and tough: Rice University's nanotube-reinforced material can be shaped, is highly conductive February 13th, 2017

Cedars-Sinai, UCLA Scientists Use New ‘Blood Biopsies’ With Experimental Device to Speed Cancer Diagnosis and Predict Disease Spread: Leading-Edge Research Is Part of National Cancer Moonshot Initiative February 13th, 2017

Highly sensitive gas sensors for volatile organic compound detection February 6th, 2017

UCLA physicists map the atomic structure of an alloy: Researchers measured the coordinates of more than 23,000 atoms in a technologically important material February 3rd, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project