Home > Press > AMKOR and IMEC Sign Collaboration Agreement for 3D Wafer-Level Packaging
Amkor Technology, Inc. (Nasdaq: AMKR), a world-leading provider of advanced semiconductor assembly and test services, and IMEC, a leading independent non-profit nanoelectronics and nanotechnology research center based in Belgium, today announced that they have entered into a 2-year collaboration agreement to develop cost-effective, 3D integration technology based on wafer-level processing techniques.
AMKOR and IMEC Sign Collaboration Agreement for 3D Wafer-Level Packaging
CHANDLER, AZ & LEUVEN, Belgium | Posted on July 17th, 2007
"This collaboration with IMEC will enhance our continuing efforts to develop low cost, state of the art packaging solutions for our customers", said Dan Mis, Amkor's Senior Vice President for Wafer Level Advanced Product Development.
Luc Van den hove, IMEC's Executive Vice President and Chief Operating Officer, commented "We are pleased that one of the leading semiconductor packaging service providers has joined our 3D system integration program that targets the development of post-passivation technology for 3D interconnects at the IC bond pad level."
Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company’s SEC filings and on Amkor’s web site: http://www.amkor.com .
IMEC is a leading independent non-profit research center in nanoelectronics and nanotechnology focusing on the next generations of chips and systems, and on the enabling technologies for ambient intelligence. IMEC is headquartered in Leuven, Belgium, and further information on IMEC can be found at http://www.imec.be .
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Amkor Technology, Inc.
Gil Tily, Corporate Vice President and General Counsel,
480-821-5000, ext. 5162
Katrien Marent, IMEC Corporate Communications,
+32 16 28 18 80
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