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SEMATECH's new and continuing alliances with semiconductor equipment and materials suppliers will highlight the consortium's set of expert talks on key industry challenges and opportunities during SEMICON West next month.
SEMATECH to Describe Supplier Alliances, Technical Challenges at SEMICON West
SAN FRANCISCO , CA | Posted on July 10th, 2007
The lineup includes an appearance by Raj Jammy, SEMATECH's Front End Processes director, as an expert panelist at DuPont's seminar, "Technology Partnerships and Tools for the Future." Jammy will join with four other technologists in addressing key issues for the IC value chain, in an event beginning at 3 p.m. Wednesday, July 18 in Moscone Center's South Hall, Rooms 236-238.
SEMATECH has long recognized the importance of effective collaboration with industry suppliers, whose equipment and materials are fundamental to chip manufacturing. From providing access to the advanced equipment line within ATDF and opening interactive test centers for new technologies, to launching new engagement platforms for supplier-oriented R&D and creating targeted membership options, SEMATECH strives to build a global community of experts devoted to solving our industry's most critical challenges.
Additionally, Jammy will appear on the Device Scaling TechXPOT Stage with four other ranking technologists representing SEMATECH and its subsidiaries, ATDF and International SEMATECH Manufacturing Initiative (ISMI). Their talks—covering front-end scaling, a new product for enhancing fab productivity, extreme ultraviolet lithography, e°©manufacturing, and nanoscale metrology—are detailed below.
"Process Advancements for continued CMOS Device Scaling in Front-end,"
Raj Jammy, director of Front End Processes (FEP), SEMATECH
10:30 a.m. Tuesday, July 17
Jammy will address trends in CMOS scaling and the impact of key process elements on performance — including increasing reliance on new materials and architectures, the development of non-planar alternatives, and the need to reduce operating voltages — and how these trends can be addressed through heterogeneous integration and system level improvements.
"ATDF Delivers 45nm NanopatternTM Test Wafer"
12:10 p.m. July 17
David Baker, new products manager, ATDF
Baker will accept SEMI's Technology Innovation Award for the novel NanopatternTM wafer, a testing device which enables resistance testing of polysilicon-on-oxide features that simulate 45 nm gate structures for cleans, deposition and metrology test applications. Baker also will detail the product's advantages, performance, and value proposition for customers.
"FEP Metrology: Nano and Sub-Nanoscale Challenges and Achievements"
Pat Lysaght, FEP Senior Member Technical Staff, SEMATECH
12:30 p.m. July 17
Lysaght will discuss how SEMATECH and national laboratories are collaborating to address the urgent need for high spatial resolution physical characterization in order to develop accurate mechanistic models that represent measured electrical performance. This effort positions SEMATECH for future participation in the emerging Nano Science Centers beginning operation in 2007 and 2008 at the five national labs in the U.S.
"e-Manufacturing: Enabling High Volume Manufacturing
for Future Technology Nodes"
Steve Fulton, manager of Equipment Integration and Automation, ISMI
11:10 a.m. July 18
Fulton will describe how the introduction of new and emerging materials and processes required by continued device scaling add complexity and pose significant challenges to remain competitive in high volume manufacturing. e-Manufacturing enables the use of emerging information technologies and factory systems to provide automated, data driven, decisions and productivity optimization.
"EUVL - What is Needed for Manufacturability"
Michael Lercel, director of Lithography, SEMATECH
4:20 p.m. July 18
Asserting that the feasibility of extreme ultraviolet lithography (EUVL) has been successfully demonstrated, Lercel will describe the challenges of bringing the next-generation technology to manufacturability. His talk will include assessments of source power, mask blank defects, optics lifetime, cost of ownership, and other attributes of EUV, which appears to be emerging as the most cost-effective replacement for optical lithography.
For 20 years, SEMATECH® ( http://www.sematech.org ) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.
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