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June 22nd, 2007
German chemicals group BASF and IBM are to partner on the development of specialst electronic materials required in the production of ICs using the 32-nm node process technology under development.
The companies suggest both the process and the related chemicals and materials will be commercialized by chip makers by 2010.
No financial or technical details were revealed about the joint development. The research will be carried out jointly at IBM's facilities in Yorktown Heights, U.S. and BASF's headquarters in Ludwigshafen, Germany.
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