Home > Press > Solutions Emerging for Wafer Cleaning at 45 nm and Beyond, SEMATECH Conference Finds
Potential solutions are starting to emerge for preparing wafers for manufacturing at and beyond the 45 nm technology generation, technologists indicated at a recent industry meeting organized by SEMATECH.
Solutions Emerging for Wafer Cleaning at 45 nm and Beyond, SEMATECH Conference Finds
Austin, TX | Posted on May 17th, 2007
The 2007 Surface Preparation and Cleaning Conference, held here in late April, reported several techniques for non-damaging particle removal from wafer surfaces, along with multiple methods for removing photoresist with minimal silicon and oxide loss.
These and other conference presentations were aimed at acquainting equipment companies and chip-makers with the latest innovations in wafer and mask-cleaning technologies, in an effort to surmount the related challenges posed at 45 nm (and for subsequent generations for some advanced manufacturers) by the International Technology Roadmap for Semiconductors (ITRS).
"The 45 nm generation is coming up fast - and some chip-makers are there already - and many of the manufacturing issues are connected to surface preparation and cleaning," said SEMATECH's Joel Barnett, conference chair. "The conference made it clear that many of our chemistries and approaches will have to change, but that plenty of potential solutions are being considered for 45 nm and beyond."
For example, 12 presentations were offered on non-damaging nanoparticle removal, including:
* Shock tube-enhanced laser-induced plasma (LIP) shockwaves for sub-50 nm nanoparticle removal, from Clarkson University. This approach confines LIP beams to specially engineered "shock tubes" to increase the cleaning power of shock waves.
* Plasma-assisted cleaning by electrostatics (PACE), offered by the University of Illinois at Urbana-Champaign. This technology utilizes broad-area plasma to provide a negative charge to contamination, allowing it to be repelled electrostatically.
* An ionized molecular-activated coherent solution, proposed by Nano Green Technology, Inc. This method uses a charged solution of ammonia in water to form clusters that attract particles at the molecular level, without damaging the wafer surface.
* Parametric nanoscale cleaning from Lancetta, Inc., which suggested a technology that removes particles by forming nanoscale bubbles to absorb the contaminants.
On photoresist issues, seven papers offered new or enhanced methods for minimizing silicon and oxide loss during removal. These included photoreactive cleaning from UVTech Systems; a CO2 cryogenic press and non-oxidizing chemistry from DuPont Electronic Technologies, EKC Technology, and BOC Eco-Snow Systems; and methodologies for all-wet chemistries from FSI International and SEZ Group.
Earlier in the conference, keynote speaker Jadgish Prasad of AMI Semiconductor urged engineers to consider the requirements of surface cleaning when designing future generations of microchip circuits. Design dominates how wet processing is done, and processing limitations in turn influence the design process, he said.
Reflecting a chip-maker's perspective, Prasad emphasized the critical influence of surface preparation on yield and reliability. "Sixty percent of fab-related (yield) problems are related to cleans, and another 12 percent to etching steps," he said. Prasaid predicted that manufacturers will need to adopt new etch chemistries and cleaning regimens for the 45 nm generation and beyond.
High-k materials and metals gates also are slated for introduction at 45 nm. Although this year's conference did not address these approaches, SEMATECH has published numerous papers detailing high-k related surface preparation processes and continues to develop processes related to dual metal gate and higher-k gate processes.
Capping the meeting was a panel of industry experts who analyzed the key challenges of surface preparation at 45 nm. Their comments, captured in a webcast by Semiconductor International, pointed to the need for significantly different technologies in the field ( see http://www.reed-electronics.com/semiconductor/article/CA6426899 ).
"Our purpose in offering the conference is to help prepare our audience for the cleaning demands of 45 nm technology," Barnett said. "Our speakers gave them plenty of leading-edge data to meet that test."
For 20 years, SEMATECH® ( http://www.sematech.org ) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.
For more information, please click here
Copyright © Business Wire 2007
If you have a comment, please Contact
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Materials for the next generation of electronics and photovoltaics: MacArthur Fellow develops new uses for carbon nanotubes October 21st, 2014
Nitrogen Doped Graphene Characterized by Iranian, Russian, German Scientists October 21st, 2014
Crystallizing the DNA nanotechnology dream: Scientists have designed the first large DNA crystals with precisely prescribed depths and complex 3D features, which could create revolutionary nanodevices October 20th, 2014
Imaging electric charge propagating along microbial nanowires October 20th, 2014
Special UO microscope captures defects in nanotubes: University of Oregon chemists provide a detailed view of traps that disrupt energy flow, possibly pointing toward improved charge-carrying devices October 21st, 2014
Super stable garnet ceramics may be ideal for high-energy lithium batteries October 21st, 2014
Could I squeeze by you? Ames Laboratory scientists model molecular movement within narrow channels of mesoporous nanoparticles October 21st, 2014
Detecting Cancer Earlier is Goal of Rutgers-Developed Medical Imaging Technology: Rare earth nanocrystals and infrared light can reveal small cancerous tumors and cardiovascular lesions October 21st, 2014
Ucore's McKenzie to Deliver Presentation to Rare Earths Conference in Singapore as Highlight of Fall 2014 Marketplace Schedule October 19th, 2014
Aspen Aerogels, Inc. Schedules Third Quarter 2014 Earnings Release and Conference Call for November 6, 2014 October 17th, 2014
New VDMA Association "Electronics, Micro and Nano Technologies" founded: Inaugural Meeting in Frankfurt/Main, Germany October 15th, 2014
Nanotronics Imaging Releases nSPEC® 3D, Powerful Microscope That Captures 3D Images at Nanoscale, in Lightning Speed: Company Unveils Design at American Chemical Society 2014 International Elastomer Conference October 14th, 2014