Home > News > Board Assembly Technology Trends - iNEMI Technology Roadmap
May 1st, 2007
Board Assembly Technology Trends - iNEMI Technology Roadmap
There are also an increasing number of situations where the barrier to implementing a new process or technology is a business issue (as opposed to a technical uncertainty). Some of these business issues include:
• Supply chain readiness to deal with the transition to lead-free is a key gap for the electronics industry going forward. The ability for the supply chain to support both lead containing and lead-free bills-of-materials (BOMs) will provide significant challenges and investments for some time to come.
• With research and development (R&D) responsibility transitioning to the EMS companies in low cost geographies, government, academia and industry consortia will need to formulate ways to adopt and develop emerging technologies (such as nanotechnology) into the board assembly process, in the global outsourcing environment.
Quantum teleportation on a chip: A significant step towards ultra-high speed quantum computers April 1st, 2015
Rutgers, NIST physicists report technology with potential for sub-micron optical switches March 31st, 2015
Next important step toward quantum computer: Scientists at the University of Bonn have succeeded in linking 2 different quantum systems March 30th, 2015
State-of-the-art online system unveiled to pinpoint metrology software accuracy March 27th, 2015
Interviews/Book Reviews/Essays/Reports/Podcasts/Journals/White papers
A novel way to apply drugs to dental plaque Nanoparticles release drugs to reduce tooth decay April 1st, 2015
So, near and yet so far: Stable HGNs for Raman April 1st, 2015
Two-dimensional dirac materials: Structure, properties, and rarity April 1st, 2015
3-D neural structure guided with biocompatible nanofiber scaffolds and hydrogels April 1st, 2015