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Home > News > Board Assembly Technology Trends - iNEMI Technology Roadmap

May 1st, 2007

Board Assembly Technology Trends - iNEMI Technology Roadmap

Abstract:
There are also an increasing number of situations where the barrier to implementing a new process or technology is a business issue (as opposed to a technical uncertainty). Some of these business issues include:



Supply chain readiness to deal with the transition to lead-free is a key gap for the electronics industry going forward. The ability for the supply chain to support both lead containing and lead-free bills-of-materials (BOMs) will provide significant challenges and investments for some time to come.

With research and development (R&D) responsibility transitioning to the EMS companies in low cost geographies, government, academia and industry consortia will need to formulate ways to adopt and develop emerging technologies (such as nanotechnology) into the board assembly process, in the global outsourcing environment.

Source:
pcb007.com

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