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December 12th, 2006
NEXX Systems to Participate in IMEC's Industrial ...
NEXX Systems today announced its participation in IMEC's Industrial Affiliation Program (IIAP) for 3D wafer level packaging and integrated passive devices. This research agreement continues NEXX Systems' long-term, successful relationship with IMEC, which in the past has included the development of novel interconnection and packaging processes on Cu/low-k back-end-of-line (BEOL) integrated circuits (on a Nimbus system), and "above IC" wiring and passive components (on a Stratus system).
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