- About Us
- Career Center
- Nano-Social Network
- Nano Consulting
- My Account
July 18th, 2006
New thin-film semiconductor techniques invented by University of Wisconsin-Madison engineers promise to add sensing, computing and imaging capability to an amazing array of materials.
A team led by electrical and computer engineer Zhenqiang (Jack) Ma and materials scientist Max Lagally have developed a process to remove a single-crystal film of semiconductor from the substrate on which it is built. This thin layer (only a couple of hundred nanometers thick) can be transferred to glass, plastic or other flexible materials, opening a wide range of possibilities for flexible electronics. In addition, the semiconductor film can be flipped as it is transferred to its new substrate, making its other side available for more components. This doubles the possible number of devices that can be placed on the film.
University of Wisconsin-Madison
|Related News Press|
Simulations predict flat liquid May 21st, 2015
Stanford breakthrough heralds super-efficient light-based computers: Light can transmit more data while consuming far less power than electricity, and an engineering feat brings optical data transport closer to replacing wires May 29th, 2015
New chip makes testing for antibiotic-resistant bacteria faster, easier: Researchers at the University of Toronto design diagnostic chip to reduce testing time from days to one hour, allowing doctors to pick the right antibiotic the first time May 28th, 2015
Collaboration could lead to biodegradable computer chips May 28th, 2015
Physicists solve quantum tunneling mystery: ANU media release: An international team of scientists studying ultrafast physics have solved a mystery of quantum mechanics, and found that quantum tunneling is an instantaneous process May 27th, 2015
Two UCSB Professors Receive Early Career Research Awards: The Department of Energy’s award for young scientists acknowledges UC Santa Barbara’s standing as a top tier research institution May 29th, 2015