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May 29th, 2006
SMTA International Emerging Technologies Summit
SMTA is again co-locating its annual conference, SMTA International, with the Assembly Tech Expo (ATExpo) show this fall.
The first session, Packaging Space: Nano to Outer, will feature papers on Emerging Trends Overview, Bonding Techniques in Wafer Fabrication, Flip Chip Integration of a Large Format Array of MOEMS Devices for Space Infrared Astronomy, Multiscale Assembly and Packaging System for MOEMS, and Nanotechnology and Room Temperature Assembly.
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