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Home > News > SMTA International Emerging Technologies Summit

May 29th, 2006

SMTA International Emerging Technologies Summit

Abstract:
SMTA is again co-locating its annual conference, SMTA International, with the Assembly Tech Expo (ATExpo) show this fall.

The first session, Packaging Space: Nano to Outer, will feature papers on Emerging Trends Overview, Bonding Techniques in Wafer Fabrication, Flip Chip Integration of a Large Format Array of MOEMS Devices for Space Infrared Astronomy, Multiscale Assembly and Packaging System for MOEMS, and Nanotechnology and Room Temperature Assembly.

Source:
emsnow.com

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