- About Us
- Career Center
- Nano-Social Network
- Nano Consulting
- My Account
May 29th, 2006
SMTA is again co-locating its annual conference, SMTA International, with the Assembly Tech Expo (ATExpo) show this fall.
The first session, Packaging Space: Nano to Outer, will feature papers on Emerging Trends Overview, Bonding Techniques in Wafer Fabrication, Flip Chip Integration of a Large Format Array of MOEMS Devices for Space Infrared Astronomy, Multiscale Assembly and Packaging System for MOEMS, and Nanotechnology and Room Temperature Assembly.
|Related News Press|
Scientists find technique to improve carbon superlattices for quantum electronic devices: In a paradigm shift from conventional electronic devices, exploiting the quantum properties of superlattices holds the promise of developing new technologies October 20th, 2016
Leti Scientists Participating in Sessions on Med Tech, Automotive Technologies, MEMS, Si-photonics and Lithography at SEMICON Europa: Teams also Will Demonstrate Technology Advances in Telecom, Data Fusion, Energy, Silicon Photonics and 3D Integration October 18th, 2016
Nanosciences: Genes on the rack October 21st, 2016
Nanoparticle vaccinates mice against dengue fever October 21st, 2016