Home > News > IMEC, Ghent University Create Bendable Ultra-Thin Chips
April 4th, 2006
IMEC, Ghent University Create Bendable Ultra-Thin Chips
Abstract:
Leuven, Belgium-based nanoelectronics and nanotechnology research center IMEC and its associated laboratory INTEC of the University of Ghent jointly developed a new process flow for ultra-thin chip packages resulting in bendable packaged chips of only 50 micron thickness that allows embedding packaged chips empowering smart, highly-integrated, flexible electronic systems for a wide variety of applications.
Source:
reed-electronics.com
Bookmark:
| Related News Press |
Chip Technology
Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024
Utilizing palladium for addressing contact issues of buried oxide thin film transistors April 5th, 2024
HKUST researchers develop new integration technique for efficient coupling of III-V and silicon February 16th, 2024
Announcements
NRL charters Navy’s quantum inertial navigation path to reduce drift April 5th, 2024
Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024
Energy
Development of zinc oxide nanopagoda array photoelectrode: photoelectrochemical water-splitting hydrogen production January 12th, 2024
Shedding light on unique conduction mechanisms in a new type of perovskite oxide November 17th, 2023
Inverted perovskite solar cell breaks 25% efficiency record: Researchers improve cell efficiency using a combination of molecules to address different November 17th, 2023
The efficient perovskite cells with a structured anti-reflective layer – another step towards commercialization on a wider scale October 6th, 2023
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||