Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > News > Nanodevice connections leap forward

July 1st, 2004

Nanodevice connections leap forward

Abstract:
Until now, making contact to nanowires and nanotubes in electronic devices has meant using lithography to define metal electrodes. But this means that the contacts must be relatively large. Now, researchers at Harvard University, US, have come up with an integrated contact and interconnection method that overcomes this inherent size constraint. The technique transforms selected regions of silicon nanowires into metallic nickel silicide. (more on earlier article)

Source:
Nanotechweb

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

Rutgers, NIST physicists report technology with potential for sub-micron optical switches March 31st, 2015

Next important step toward quantum computer: Scientists at the University of Bonn have succeeded in linking 2 different quantum systems March 30th, 2015

State-of-the-art online system unveiled to pinpoint metrology software accuracy March 27th, 2015

SUNY POLY CNSE to Host First Ever Northeast Semi Supply Conference (NESCO) Conference Will Connect New and Emerging Innovators in the Northeastern US and Canada with Industry Leaders and Strategic Investors to Discuss Future Growth Opportunities in NYS March 25th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE