Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > News > Nanodevice connections leap forward

July 1st, 2004

Nanodevice connections leap forward

Abstract:
Until now, making contact to nanowires and nanotubes in electronic devices has meant using lithography to define metal electrodes. But this means that the contacts must be relatively large. Now, researchers at Harvard University, US, have come up with an integrated contact and interconnection method that overcomes this inherent size constraint. The technique transforms selected regions of silicon nanowires into metallic nickel silicide. (more on earlier article)

Source:
Nanotechweb

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

SEMATECH to Showcase Innovation and Advances in Manufacturing at SEMICON Japan 2014: SEMATECH experts will share the latest techniques, emerging trends and best practices in advanced manufacturing strategies and methodologies November 26th, 2014

'Giant' charge density disturbances discovered in nanomaterials: Juelich researchers amplify Friedel oscillations in thin metallic films November 26th, 2014

Nanometrics Announces Upcoming Investor Events November 19th, 2014

A novel method for identifying the body’s ‘noisiest’ networks November 19th, 2014

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More












ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE