Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > News > Nanodevice connections leap forward

July 1st, 2004

Nanodevice connections leap forward

Abstract:
Until now, making contact to nanowires and nanotubes in electronic devices has meant using lithography to define metal electrodes. But this means that the contacts must be relatively large. Now, researchers at Harvard University, US, have come up with an integrated contact and interconnection method that overcomes this inherent size constraint. The technique transforms selected regions of silicon nanowires into metallic nickel silicide. (more on earlier article)

Source:
Nanotechweb

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

Switching with molecules: Molecular switch will facilitate the development of pioneering electro-optical devices May 25th, 2018

Columbia Researchers Squeeze Light into Nanoscale Devices and Circuits: Team is first to directly image propagation and dynamics of graphene plasmons at very low temperatures; findings could impact optical communications and signal processing May 23rd, 2018

Supersonic waves may help electronics beat the heat May 18th, 2018

Deeper understanding of quantum chaos may be the key to quantum computers May 16th, 2018

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project