Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > News > Toshiba ready for 65 nm fabrication in first half 2005

February 20th, 2004

Toshiba ready for 65 nm fabrication in first half 2005

Abstract:
Toshiba Corp. has completed its 300mm wafer fab in Oita, Kyushu, and intends to lead the industry with fabrication of chips on a 65 nm process line in the first half of next year. The 65-nm process will be for volume production. Part of the new fab's capacity will be allocated to the virtual joint venture fab with Sony Corp. Toshiba and Sony respectively invested 42 billion yen (about $389 million) for the virtual fab.

Source:
EETimes

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

Alloying materials of different structures offers new tool for controlling properties June 19th, 2017

GLOBALFOUNDRIES®, ON Semiconductor Deliver the Industry’s Lowest Power Bluetooth® Low Energy SoC Family: 55nm LPx RF-enabled platform, with SST’s highly reliable embedded SuperFlash®, provides low power and cost for IoT and “Connected” Health and Wellness Devices June 19th, 2017

New prospects for universal memory -- high speed of RAM and the capacity of flash: Thin films created at MIPT could be the basis for future development of ReRAM June 17th, 2017

In a project funded by the Austrian Science Fund FWF, the physicist Serdar Sarıçiftçi investigates possible uses in electronics of the semiconductor properties of indigo pigment June 14th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project