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February 20th, 2004
Toshiba ready for 65 nm fabrication in first half 2005
Toshiba Corp. has completed its 300mm wafer fab in Oita, Kyushu, and intends to lead the industry with fabrication of chips on a 65 nm process line in the first half of next year. The 65-nm process will be for volume production. Part of the new fab's capacity will be allocated to the virtual joint venture fab with Sony Corp. Toshiba and Sony respectively invested 42 billion yen (about $389 million) for the virtual fab.
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