Home > News > Toshiba ready for 65 nm fabrication in first half 2005
February 20th, 2004
Toshiba ready for 65 nm fabrication in first half 2005
Abstract:
Toshiba Corp. has completed its 300mm wafer fab in Oita, Kyushu, and intends to lead the industry with fabrication of chips on a 65 nm process line in the first half of next year. The 65-nm process will be for volume production. Part of the new fab's capacity will be allocated to the virtual joint venture fab with Sony Corp. Toshiba and Sony respectively invested 42 billion yen (about $389 million) for the virtual fab.
Source:
EETimes
Related News Press |
Chip Technology
Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024
Utilizing palladium for addressing contact issues of buried oxide thin film transistors April 5th, 2024
HKUST researchers develop new integration technique for efficient coupling of III-V and silicon February 16th, 2024
The latest news from around the world, FREE | ||
Premium Products | ||
Only the news you want to read!
Learn More |
||
Full-service, expert consulting
Learn More |
||