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Home > News > Nikon launches EUV lithography development

January 15th, 2004

Nikon launches EUV lithography development

Nikon Corp. said Wednesday it will begin full-scale development of extreme ultraviolet lithography systems in 2004 and will begin offering working tools by 2006. Nikon had already announced an aggressive development plan for 193-nm ArF immersion lithography, with shipments planned as early as 2005. Nikon intends to offer an ArF dry tool with high NA of 0.9, then an ArF immersion tool for the 45-nm node and, finally, EUV for 45-nm manufacturing and beyond.


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