Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > News > New hybrid material has potential use in microelectronics

October 14th, 2003

New hybrid material has potential use in microelectronics

U of T scientists have developed a new class of hybrid materials combining organic and inorganic elements that could lead to improved computer chips, among other applications. The material is a porous solid that assembles itself at the molecular level and displays superior insulating properties to silica; it is categorized as a nanocomposite because the nanoscale pore size of its honeycomb-like structure is so tiny, measuring in the billionths of a metre in diameter and organic and inorganic parts are integrated into a composite structure.

University of Toronto

Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press


Metamaterial device allows chameleon-like behavior in the infrared October 28th, 2016

A Tiny Machine: UCSB electrical and computer engineers design an infinitesimal computing device October 28th, 2016

The molecular mechanism that blocks membrane receptors has been identified: The work in which the Ikerbasque researcher of the Biofisika Institute Xabier Contreras has participated has been published in the journal Cell October 27th, 2016

How nanoscience will improve our health and lives in the coming years: Targeted medicine deliveries and increased energy efficiency are just two of many ways October 26th, 2016

The latest news from around the world, FREE

  Premium Products
Only the news you want to read!
 Learn More
University Technology Transfer & Patents
 Learn More
Full-service, expert consulting
 Learn More

Nanotechnology Now Featured Books


The Hunger Project