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Confluense is a CMP [Chemical Mechanical Polishing] equipment and process technology provider to the Nanomanufacturing value chain.
Confluense's CMP solution actively manages the liquid film between the pad and wafer by controlling the liquid film residence time. Real time liquid film tuning provides the user removal rate control, selectivity control, improved surface condition (finish, cleanliness), differentiated waste handling, with improved efficiency/lower consumption rates. The technology is applicable to many nanofabrication abrasive processes including; substrate lapping / polishing, wafer thinning, wafer and display edge finishing.
7277 William Ave.; Suite 300
Allentown, PA 18106 USA