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Ångström Aerospace Corporation
Ångström Aerospace Corporation (ÅAC) mission is to develop and provide products, including services based on state-of-the-art Micro-ElectroMechanical Systems (MEMS) and nanotechnologies. Using advanced 3-dimensional wafer level packaging (WLP), Ångström Aerospace enables 3D-System-in-Package (3D-SiP) modules that enables unprecedented possibilities to combine micro-electronics and MEMS sensors/actuators. Our vision is to be a market leader supplier of novel qualified products for rugged and extreme environments based on innovative ideas and unique competence within the field of multifunctional MEMS.
Dag Hammarskjölds väg 54 B
Uppsala SE-751 83 SWEDEN
+46 18 560130
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