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Nextreme Thermal Solutions, Inc.
Nextreme designs and manufactures micro-scale thermal and power management products for the semiconductor, photonics, consumer, automotive and defense/aerospace industries. The company has embedded cooling and power generation capabilities into the widely accepted copper pillar bumping process used in high-volume electronic packaging.
Nextreme's breakthrough addresses the most challenging thermal and power management constraints in electronics today, and delivers the only fully-scalable technology solution by leveraging the existing, high-volume flip chip manufacturing infrastructure. By minimizing the need for manufacturing changes and focusing on developing a seamless design-in solution, Nextreme will change the future of thermal and power management for the entire electronics industry.
3908 Patriot Dr. , Suite 140
Durham, NC 27703-8031 USA