Nanotechnology Now

Our NanoNews Digest Sponsors
Heifer International



Home > Press > GLOBALFOUNDRIES and Mentor Collaborate to Launch New Semiconductor Verification Solution Embedded with Advanced Machine Learning Capabilities: New industry-leading ML-enhanced DFM solution for designing on GF 12LP+ platform can provide customers with a more efficient experience

Abstract:
GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, today announced at its annual Global Technology Conference (GTC) a significantly enhanced design for manufacturability (DFM) kit embedded with advanced machine learning (ML) capabilities. Developed in collaboration with Mentor, a Siemens business, the new industry-leading ML-enhanced DFM solution, built on Mentor’s Calibre® nmDRC platform, can provide customers with a more effective design and development experience and, ultimately, contribute to a faster time to market.

GLOBALFOUNDRIES and Mentor Collaborate to Launch New Semiconductor Verification Solution Embedded with Advanced Machine Learning Capabilities: New industry-leading ML-enhanced DFM solution for designing on GF 12LP+ platform can provide customers with a more efficient experience

Santa Clara, CA | Posted on October 1st, 2020

The new ML-enhanced DFM kit is launching as an update to the process design kit (PDK) for GF’s 12LP+ differentiated semiconductor solution. Built on a proven platform with a robust production ecosystem, 12LP+ is optimized for artificial intelligence (AI) training and inference applications, and is currently ready for production at GF’s Fab 8 in Malta, New York.

GF’s new ML-enhanced DFM solution is among the first of its kind in the industry. GF plans to roll out the capability to the PDKs of its 12LP and 22FDX® semiconductor platforms in Q4 2020.

“We are excited to launch this new enhancement, infused with advanced machine learning models, and provide our customers with a quicker overall DFM verification and an even more effective design experience – all toward the goal of successful prototyping and a faster time to market,” said Jim Blatchford, vice president of Technology Enablement at GF. “Our close partnership with Mentor helped enable the new enhancement to be seamlessly integrated into our 12LP+ PDK, and we look forward to rolling out additional machine learning-infused capabilities in the PDKs for our other specialty semiconductor solutions.”

“We are pleased to partner with GLOBALFOUNDRIES to incorporate machine learning based models into Calibre nmDRC for GF’s 12LP+ platform,” said Michael White, director of Physical Verification Product Management, Calibre Design Solutions, at Mentor. “Working together with GLOBALFOUNDRIES, we have incorporated machine learning into the design flow to help create a seamless transition for our mutual customers."

Following its founding in 2009, GF has pioneered a DFM checking platform, called DRC+, which combines pattern-matching tools from electronic design automation (EDA) software suited with a proprietary library of yield detractor patterns. DRC+ enables chip designers to preventively detect defective patterns, or hotspots, in early designs that could lead to manufacturing defects.

GF and Mentor have partnered to integrate GF-developed ML models into DRC+, to help amplify the ability of DRC+ to recognize new and previously unseen hotspot patterns and improve production yield. Trained by GF on silicon data collected during its manufacturing operations, the new ML-enhanced DFM kit has been validated and qualified to enable chip designers to more successfully discover and mitigate potential problems early in the design process.

Catching and addressing these hotspots in the development phase is critical for designers as they progress toward successful prototyping and scale manufacturing.

GF 12LP+ Ready for Production

Engineered to meet the specific needs of the fast-growing AI market, GF’s 12LP+ offers best-in-class combination of performance, power, and area. Contributing to this are new features including an updated standard cell library, an interposer for 2.5D packaging, and a low-power 0.5V Vmin SRAM bitcell that supports the low latency and power-efficient shuttling of data between the AI processors and memory.

12LP+ builds upon GF’s established 14nm/12LP platform, of which GF has shipped more than one million wafers. By partnering closely and learning from AI customers, GF developed 12LP+ to provide greater differentiation and increased value for designers in the AI space while minimizing their development and production costs.

Driving the enhanced performance of 12LP+ are features including a 20-percent SoC-level logic performance boost over 12LP, and a 10-percent improvement in logic area scaling. These advancements are achieved in 12LP+ through its next-generation standard cell library with performance-driven area optimized components, single Fin cells, a new low-voltage SRAM bitcell, and improved analog layout design rules.

####

About GLOBALFOUNDRIES
GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. GF delivers differentiated feature-rich solutions that enable its customers to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company.

For more information, please click here

Contacts:
Michael Mullaney
GLOBALFOUNDRIES
518-305-1597

Copyright © GLOBALFOUNDRIES

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related Links

Click here to learn more about GF’s 12LP+ specialized application solution:

Note: A list of relevant Siemens trademarks can be found here:

Related News Press

News and information

Simulating magnetization in a Heisenberg quantum spin chain April 5th, 2024

NRL charters Navy’s quantum inertial navigation path to reduce drift April 5th, 2024

Innovative sensing platform unlocks ultrahigh sensitivity in conventional sensors: Lan Yang and her team have developed new plug-and-play hardware to dramatically enhance the sensitivity of optical sensors April 5th, 2024

Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024

Possible Futures

Innovative sensing platform unlocks ultrahigh sensitivity in conventional sensors: Lan Yang and her team have developed new plug-and-play hardware to dramatically enhance the sensitivity of optical sensors April 5th, 2024

Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024

A simple, inexpensive way to make carbon atoms bind together: A Scripps Research team uncovers a cost-effective method for producing quaternary carbon molecules, which are critical for drug development April 5th, 2024

With VECSELs towards the quantum internet Fraunhofer: IAF achieves record output power with VECSEL for quantum frequency converters April 5th, 2024

Chip Technology

Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024

Utilizing palladium for addressing contact issues of buried oxide thin film transistors April 5th, 2024

HKUST researchers develop new integration technique for efficient coupling of III-V and silicon February 16th, 2024

Electrons screen against conductivity-killer in organic semiconductors: The discovery is the first step towards creating effective organic semiconductors, which use significantly less water and energy, and produce far less waste than their inorganic counterparts February 16th, 2024

Announcements

NRL charters Navy’s quantum inertial navigation path to reduce drift April 5th, 2024

Innovative sensing platform unlocks ultrahigh sensitivity in conventional sensors: Lan Yang and her team have developed new plug-and-play hardware to dramatically enhance the sensitivity of optical sensors April 5th, 2024

Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024

A simple, inexpensive way to make carbon atoms bind together: A Scripps Research team uncovers a cost-effective method for producing quaternary carbon molecules, which are critical for drug development April 5th, 2024

Events/Classes

Researchers demonstrate co-propagation of quantum and classical signals: Study shows that quantum encryption can be implemented in existing fiber networks January 20th, 2023

CEA & Partners Present ‘Powerful Step Towards Industrialization’ Of Linear Si Quantum Dot Arrays Using FDSOI Material at VLSI Symposium: Invited paper reports 3-step characterization chain and resulting methodologies and metrics that accelerate learning, provide data on device pe June 17th, 2022

June Conference in Grenoble, France, to Explore Pathways to 6G Applications, Including ‘Internet of Senses’, Sustainability, Extended Reality & Digital Twin of Physical World: Organized by CEA-Leti, the Joint EuCNC and 6G Summit Sees Telecom Sector as an ‘Enabler for a Sustainabl June 1st, 2022

How a physicist aims to reduce the noise in quantum computing: NAU assistant professor Ryan Behunin received an NSF CAREER grant to study how to reduce the noise produced in the process of quantum computing, which will make it better and more practical April 1st, 2022

Alliances/Trade associations/Partnerships/Distributorships

Manchester graphene spin-out signs $1billion game-changing deal to help tackle global sustainability challenges: Landmark deal for the commercialisation of graphene April 14th, 2023

Chicago Quantum Exchange welcomes six new partners highlighting quantum technology solutions, from Chicago and beyond September 23rd, 2022

CEA & Partners Present ‘Powerful Step Towards Industrialization’ Of Linear Si Quantum Dot Arrays Using FDSOI Material at VLSI Symposium: Invited paper reports 3-step characterization chain and resulting methodologies and metrics that accelerate learning, provide data on device pe June 17th, 2022

University of Illinois Chicago joins Brookhaven Lab's Quantum Center June 10th, 2022

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project