Nanotechnology Now - Press Release: FEI’s New Themis Z S/TEM Sets New Standards for High Performance Imaging and Analysis: Themis Z S/TEM, the latest in the Themis line, delivers the highest resolution, fastest analysis and best light element imaging commercially available

Home > Press > FEI’s New Themis Z S/TEM Sets New Standards for High Performance Imaging and Analysis: Themis Z S/TEM, the latest in the Themis line, delivers the highest resolution, fastest analysis and best light element imaging commercially available

Abstract:
FEI (NASDAQ: FEIC) today released its new Themis™ Z scanning/transmission electron microscope (S/TEM), once again raising the bar for imaging and analysis. The Themis Z is an automated STEM that offers the industry leading specifications for image resolution, analytical speed and quality, and light element imaging sensitivity. The new instrument will be featured at the upcoming Microscopy and Microanalysis meeting, July 24-28 in Columbus, Ohio. FEI expects to ship the first instruments in Q1 2017.

FEI’s New Themis Z S/TEM Sets New Standards for High Performance Imaging and Analysis: Themis Z S/TEM, the latest in the Themis line, delivers the highest resolution, fastest analysis and best light element imaging commercially available

Hillsboro, OR | Posted on July 14th, 2016

“Our Titan and Themis S/TEMs have led the market in performance for the last decade,” said FEI’s Trisha Rice, vice president and general manager of FEI’s Materials Science Business. “The Themis Z continues along that path, while at the same time, automating and simplifying operations to allow reproducible achievement of ultimate performance specifications to the broadest range of users and over the widest range of materials.”

The Themis Z S/TEM delivers the highest available specified performance in three critical areas as compared to other commercially available offerings:

Image resolution - Improvements in system stability and automated tuning routines allow the Themis Z to reproducibly deliver the high image resolution at high and low beam energies in both STEM and TEM modes for all users. In addition to the resolution and impressive analytical performance, a generous pole gap configuration provides the space to do more applications like three-dimensional (3D) tomography and allows excellent performance for in situ experiments.

Analytical speed and quality – A portfolio of energy dispersive x-ray (EDX) systems allows users to configure their system based on their primary characterization needs. When speed matters most, the new ‘Dual X’ detector system combines large solid angle and high count rates with low-noise, high-energy resolution. Its symmetrical design ensures high-quality 3D chemical mapping and accurate quantification. When spectral quality is first priority and versatility is important – for instance, to accommodate in-situ holders – the Super X system’s low noise and excellent energy resolution provide a powerful solution.

Light element imaging – The new iDPC detector uses up to 90 percent of transmitted electrons to offer higher sensitivity to lighter elements compared to annular bright field (ABF) imaging techniques, while still preserving atomic-scale resolution and direct image interpretation.

For more information about FEI’s Themis Z, please visit: https://www.fei.com/themis-z/

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About FEI Company
FEI Company (Nasdaq: FEIC) designs, manufactures and supports a broad range of high-performance microscopy workflow solutions that provide images and answers at the micro-, nano- and picometer scales. Its innovation and leadership enable customers in industry and science to increase productivity and make breakthrough discoveries. Headquartered in Hillsboro, Ore., USA, FEI has over 2,800 employees and sales and service operations in more than 50 countries around the world. More information can be found at: www.fei.com.

FEI Safe Harbor Statement

This news release contains forward-looking statements that include statements regarding the performance capabilities and benefits of the Themis Z solution. Factors that could affect these forward-looking statements include but are not limited to our ability to manufacture, ship, deliver and install the tools, solutions or software as expected; failure of the product or technology to perform as expected; unexpected technology problems and challenges; changes to the technology; the inability of FEI, its suppliers or project partners to make the technological advances required for the technology to achieve anticipated results; and the inability of the customer to deploy the tools or develop and deploy the expected new applications. Please also refer to our Form 10-K, Forms 10-Q, Forms 8-K and other filings with the U.S. Securities and Exchange Commission for additional information on these factors and other factors that could cause actual results to differ materially from the forward-looking statements. FEI assumes no duty to update forward-looking statements.

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Sandy Fewkes (media contact)
MindWrite Communications, Inc.
+1 408 224 4024

FEI
Jason Willey (investors and analysts)
Sr. Director, Investor Relations & Corporate Development
+1 503 726 2533

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