Nanotechnology Now





Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > AI Technology (AIT) Introduces Novel High Temperature Large Area Underfill with Proven Stress Absorption

Abstract:
AI Technology, Inc. (AIT) is proud to introduce a new generation of Flip-Chip Underfill solution that combines a High Tg of >240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices. MC7885-UFS is a proven unique underfill adhesive that fills under large area chips and cures without voids and internal stresses for ultimate reliability.

AI Technology (AIT) Introduces Novel High Temperature Large Area Underfill with Proven Stress Absorption

Princeton, NJ | Posted on August 15th, 2014

MC7885-UFS is a novel underfill paste that underfills large area flip-chip components to provide an excellent thermal interface allowing high power devices to dissipate heat to both sides of the package.

MC7885-UFS is designed for use in both chip-on-board underfill and standard flip-chip underfill component applications to reduce stress. MC7885-UFS can withstand temperatures up to 350ºC without thermal degradation. Its unique chemistry results in very low moisture absorption and high strength protection. The cured underfill has less than 20ppm/°C in coefficient of thermal expansion and higher than 6 GPa in modulus.

The differences and benefits between MC7885-UFS and traditional underfills include:
More than 5 times higher thermal conductivity than that of traditional underfills
Tg at >240°C in comparison to traditional underfills with a Tg around 140°C
Tg close to lead-free soldering temperature reduces tensile and shear stress
Proven additional stress protection with outstanding engineered molecular stress absorption without compromising performance by using low glass transition underfills

MC7885-UFS has an easy cure schedule. Most curing can be done at 120°C, or the operator can increase temperature to 150°C to cure in less time.

Please speak to one of our Application Engineers about sampling AI Technology's MC7885-UFS and put it on the top of your testing list for your new generation of flip-chip devices.

####

About AI Technology, Inc. (AIT)
Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985,
AI Technology, Inc. (AIT) has been one of the leading forces in development and patented applications of advanced materials and adhesive solutions for electronic interconnection and packaging. AI Technology, Inc. (AIT) offers some of the most reliable adhesives and underfills for die bonding for the largest dies, stack-chip packaging with dicing die-attach film (DDAF), flip-chip bonding and underfilling and high temperature die bonding for single and multiple-chip modules for applications beyond 230°C. The company continues to provide the best adhesive solution for component and substrate bonding for both military and commercial applications. AIT’s thermal interface material solutions, including our patented phase-change thermal pads, thermal greases and gels and thermal adhesives have set many bench marks of performance and reliability for power semiconductors, modules, computers and communication electronics.

For an application analysis: www.aitechnology.com/analysis/

For more information, please click here

Contacts:
70 Washington Rd.
Princeton Jct. NJ 08550
P: (609) 799 – 9388
F: (609) 799 – 9308


Media Contact
Amy Grossman
(609) 799-9388, x144

Copyright © AI Technology, Inc. (AIT)

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

SouthWest NanoTechnologies Introduces AgeNT™ Transparent Conductor System at SID Display Week, Booth #543 May 28th, 2015

New technique speeds nanoMRI imaging: Multiplexing technique for nanoscale magnetic resonance imaging developed by researchers in Switzerland cuts normal scan time from two weeks to two days May 28th, 2015

Squeezed quantum cats May 28th, 2015

New chip makes testing for antibiotic-resistant bacteria faster, easier: Researchers at the University of Toronto design diagnostic chip to reduce testing time from days to one hour, allowing doctors to pick the right antibiotic the first time May 28th, 2015

Chip Technology

New chip makes testing for antibiotic-resistant bacteria faster, easier: Researchers at the University of Toronto design diagnostic chip to reduce testing time from days to one hour, allowing doctors to pick the right antibiotic the first time May 28th, 2015

Collaboration could lead to biodegradable computer chips May 28th, 2015

Technology for Tomorrow’s Market Opportunities and Challenges: LetiDays Grenoble Presents the Possibilities: June 24-25 Event Includes Focus on IoT-Augmented Mobility and Leti’s Latest Results on Silicon Technologies, Sensors, Health Applications and Smart Cities May 27th, 2015

Physicists solve quantum tunneling mystery: ANU media release: An international team of scientists studying ultrafast physics have solved a mystery of quantum mechanics, and found that quantum tunneling is an instantaneous process May 27th, 2015

Announcements

Chemists discover key reaction mechanism behind the highly touted sodium-oxygen battery May 28th, 2015

New technique speeds nanoMRI imaging: Multiplexing technique for nanoscale magnetic resonance imaging developed by researchers in Switzerland cuts normal scan time from two weeks to two days May 28th, 2015

Squeezed quantum cats May 28th, 2015

New chip makes testing for antibiotic-resistant bacteria faster, easier: Researchers at the University of Toronto design diagnostic chip to reduce testing time from days to one hour, allowing doctors to pick the right antibiotic the first time May 28th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project