Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding: Enables Fine-Pitch Connections for 3D Applications, Including Image Sensors, Memory and 3D SoCs

Abstract:
Ziptronix Inc. and EV Group ("EVG") today announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers. The results were achieved by implementing Ziptronix's DBI® Hybrid Bonding technology on an EVG Gemini® FB production fusion bonder and SmartView®NT bond aligner. This approach can be used to manufacture fine-pitch 3D ICs for a variety of applications including stacked memory, advanced image sensors and stacked systems-on-chip (SoCs).

Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding: Enables Fine-Pitch Connections for 3D Applications, Including Image Sensors, Memory and 3D SoCs

Research Triangle Park, NC | Posted on May 27th, 2014

"The performance of DBI Hybrid Bonding technology is not limited by connection pitch, but requires the right alignment and placement tool with an ability to scale that has been a challenge to find until now," said Paul Enquist, CTO and VP Engineering at Ziptronix. "EVG's fusion bonding equipment has been optimized to achieve consistent submicron post-bond alignment accuracy. This advancement in alignment accuracy provides a clear path to high-volume manufacturing (HVM) of our technology."

Pitch scaling on next-generation 3D technologies is expected to continue for many years to come. Fine-pitch hybrid bonding is already in use in high-performance 3D memory products, and has been announced for HVM of 3D image sensors. DBI Hybrid Bonding can be used at the die or wafer level; however, wafer-level bonding enables a great cost benefit by bonding all the die at once. With much of the processing for DBI Hybrid Bonding taking place at wafer scale, there is the added benefit of low cost-of-ownership.

"Demonstrating submicron accuracy is critical to achieving fine-pitch connections in HVM for a wider variety of applications," said Paul Lindner, Executive Technology Director at EVG. "As the industry pushes to realize 3D ICs, joint efforts such as our work with Ziptronix to develop manufacturing approaches offer customers a tremendous value-add."

Ziptronix Direct Bond Interconnect (DBI®) Hybrid Bonding is a conductor/dielectric bonding technology that includes a variety of metal/oxide and/or nitride combinations, does not use adhesives and is currently the most suitable for volume manufacturing in the marketplace. It allows for strong, room temperature dielectric bonding, low temperature conductive bonding and finer-pitch interconnect over Cu/Cu or other metal bonding because the bond occurs between both the dielectric and the conductive surfaces, which effectively bonds the entire substrate interface area.

EVG's SmartView®NT Automated Bond Alignment System for Universal Alignment offers a proprietary method of face-to-face wafer-level alignment, which is key to achieving the required accuracy in multiple wafer stacking for leading-edge technologies. In addition to improving alignment capabilities on its SmartView®NT bond aligner to reach submicron accuracies, EVG has optimized it so that surfaces can be prepared simultaneously for bonding, electrical connectivity and mechanical strength.

The companies will showcase this technology at ECTC 2014, from May 27-30, 2014, in Lake Buena Vista, Florida. To learn more about Ziptronix DBI Hybrid Bonding visit booth #121 and for information on EVG Equipment Solutions for Fusion Bonding visit booth #413.

####

About Ziptronix
A pioneer in the development of low-temperature direct bond technology, Ziptronix offers patented technology for wafer- or die-level bonding. Its ZiBond® Direct Bonding and DBI® Hybrid Bonding technologies deliver the industry's most scalable, manufacturable and lowest total cost-of-ownership solutions for 3D stacking. The company's intellectual property has been licensed for a variety of semiconductor applications including BSI sensors, RF front ends, pico-projectors, memories and 3D integrated circuits. Founded in 2000 as a venture-backed spinoff of RTI International, the company has been issued more than 40 U.S. patents and more than 35 international patents, with more than 50 U.S. and international patent applications pending

About EV Group (EVG)

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.

For more information, please click here

Copyright © Marketwire

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

A first glimpse inside a macroscopic quantum state March 28th, 2015

DFG to Establish One Clinical Research Unit and Five Research Units: New Projects to Investigate Complications in Pregnancy, Particle Physics, Nanoparticles, Implants and Transport Planning / Approximately 13 Million Euros in Funding for an Initial Three-Year Period March 28th, 2015

Chemists make new silicon-based nanomaterials March 27th, 2015

UT Dallas engineers twist nanofibers to create structures tougher than bulletproof vests March 27th, 2015

Hardware

NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015

Iranian Researchers Present Model to Determine Dynamic Behavior of Nanostructures March 24th, 2015

Scientists discover gecko secret March 16th, 2015

New technology may double radio frequency data capacity: Columbia engineers invent nanoscale IC that enables simultaneous transmission and reception at the same frequency in a wireless radio March 14th, 2015

MEMS

ASIC Development for MEMS Applications: A Platform Approach March 25th, 2015

STMicroelectronics Executive Vice-President Benedetto Vigna Awarded IEEE Frederik Philips Award March 12th, 2015

MIG Takes a Roll-Up-Your-Sleeves Approach with Revamped MEMS/Sensors Technical Event -- MIG welcomes technologists to MEMS Technical Congress, emphasizes working groups and breakout sessions on emerging MEMS & sensors, tech transfer and integration March 6th, 2015

French Institutes IRT Nanoelec and CMP Team up to Offer World’s First Service for Post-process 3D Technologies on Multi-Project-Wafer March 5th, 2015

Chip Technology

State-of-the-art online system unveiled to pinpoint metrology software accuracy March 27th, 2015

SUNY POLY CNSE to Host First Ever Northeast Semi Supply Conference (NESCO) Conference Will Connect New and Emerging Innovators in the Northeastern US and Canada with Industry Leaders and Strategic Investors to Discuss Future Growth Opportunities in NYS March 25th, 2015

NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015

Building shape inspires new material discovery March 24th, 2015

Announcements

A first glimpse inside a macroscopic quantum state March 28th, 2015

DFG to Establish One Clinical Research Unit and Five Research Units: New Projects to Investigate Complications in Pregnancy, Particle Physics, Nanoparticles, Implants and Transport Planning / Approximately 13 Million Euros in Funding for an Initial Three-Year Period March 28th, 2015

Designer's toolkit for dynamic DNA nanomachines: Arm-waving nanorobot signals new flexibility in DNA origami March 27th, 2015

Using magnetic fields to understand high-temperature superconductivity: Los Alamos explores experimental path to potential 'next theory of superconductivity' March 27th, 2015

Patents/IP/Tech Transfer/Licensing

Novel nanoparticle therapy promotes wound healing March 27th, 2015

New processing technology converts packing peanuts to battery components March 22nd, 2015

Silicon Impulse, New Leti IC Design Platform, Offers One-Stop-Shop For Ultra-low-power Technologies: End-to-end Design Accelerator Platform Targets Energy-efficient Internet of Things Applications and New Devices Using FD-SOI Technology, while Expanding Ecosystem March 10th, 2015

Patent for the Novel Cancer Therapies – Ceramide Nanoliposomes March 4th, 2015

Events/Classes

State-of-the-art online system unveiled to pinpoint metrology software accuracy March 27th, 2015

LAMDAMAP 2015 hosted by the University March 26th, 2015

SUNY POLY CNSE to Host First Ever Northeast Semi Supply Conference (NESCO) Conference Will Connect New and Emerging Innovators in the Northeastern US and Canada with Industry Leaders and Strategic Investors to Discuss Future Growth Opportunities in NYS March 25th, 2015

NNI Publishes Workshop Report Assessing the Status of EHS Risk Science: Report examines progress three years after the release of the 2011 NNI EHS Research Strategy March 23rd, 2015

Alliances/Partnerships/Distributorships

NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015

Young NTU Singapore spin-off clinches S$4.3 million joint venture with Chinese commercial giant March 23rd, 2015

Halas, Nordlander awarded Optical Society's R.W. Wood Prize: Rice University researchers recognized for pioneering nanophotonics March 21st, 2015

EU Funded PCATDES Project has completed its half-period with success March 19th, 2015

Printing/Lithography/Inkjet/Inks

Haydale Announce Dedicated Graphene Inks Manufacturing Capability March 25th, 2015

NC State researchers create 'nanofiber gusher': Report method of fabricating larger amounts of nanofibers in liquid March 19th, 2015

'Additive manufacturing' could greatly improve diabetes management March 17th, 2015

Advantest to Exhibit at SEMICON China in Shanghai, China, March 17-19: Showcasing Broad Portfolio of Semiconductor Products, Technologies and Solutions March 10th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE