Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding: Enables Fine-Pitch Connections for 3D Applications, Including Image Sensors, Memory and 3D SoCs

Abstract:
Ziptronix Inc. and EV Group ("EVG") today announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers. The results were achieved by implementing Ziptronix's DBI® Hybrid Bonding technology on an EVG Gemini® FB production fusion bonder and SmartView®NT bond aligner. This approach can be used to manufacture fine-pitch 3D ICs for a variety of applications including stacked memory, advanced image sensors and stacked systems-on-chip (SoCs).

Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding: Enables Fine-Pitch Connections for 3D Applications, Including Image Sensors, Memory and 3D SoCs

Research Triangle Park, NC | Posted on May 27th, 2014

"The performance of DBI Hybrid Bonding technology is not limited by connection pitch, but requires the right alignment and placement tool with an ability to scale that has been a challenge to find until now," said Paul Enquist, CTO and VP Engineering at Ziptronix. "EVG's fusion bonding equipment has been optimized to achieve consistent submicron post-bond alignment accuracy. This advancement in alignment accuracy provides a clear path to high-volume manufacturing (HVM) of our technology."

Pitch scaling on next-generation 3D technologies is expected to continue for many years to come. Fine-pitch hybrid bonding is already in use in high-performance 3D memory products, and has been announced for HVM of 3D image sensors. DBI Hybrid Bonding can be used at the die or wafer level; however, wafer-level bonding enables a great cost benefit by bonding all the die at once. With much of the processing for DBI Hybrid Bonding taking place at wafer scale, there is the added benefit of low cost-of-ownership.

"Demonstrating submicron accuracy is critical to achieving fine-pitch connections in HVM for a wider variety of applications," said Paul Lindner, Executive Technology Director at EVG. "As the industry pushes to realize 3D ICs, joint efforts such as our work with Ziptronix to develop manufacturing approaches offer customers a tremendous value-add."

Ziptronix Direct Bond Interconnect (DBI®) Hybrid Bonding is a conductor/dielectric bonding technology that includes a variety of metal/oxide and/or nitride combinations, does not use adhesives and is currently the most suitable for volume manufacturing in the marketplace. It allows for strong, room temperature dielectric bonding, low temperature conductive bonding and finer-pitch interconnect over Cu/Cu or other metal bonding because the bond occurs between both the dielectric and the conductive surfaces, which effectively bonds the entire substrate interface area.

EVG's SmartView®NT Automated Bond Alignment System for Universal Alignment offers a proprietary method of face-to-face wafer-level alignment, which is key to achieving the required accuracy in multiple wafer stacking for leading-edge technologies. In addition to improving alignment capabilities on its SmartView®NT bond aligner to reach submicron accuracies, EVG has optimized it so that surfaces can be prepared simultaneously for bonding, electrical connectivity and mechanical strength.

The companies will showcase this technology at ECTC 2014, from May 27-30, 2014, in Lake Buena Vista, Florida. To learn more about Ziptronix DBI Hybrid Bonding visit booth #121 and for information on EVG Equipment Solutions for Fusion Bonding visit booth #413.

####

About Ziptronix
A pioneer in the development of low-temperature direct bond technology, Ziptronix offers patented technology for wafer- or die-level bonding. Its ZiBond® Direct Bonding and DBI® Hybrid Bonding technologies deliver the industry's most scalable, manufacturable and lowest total cost-of-ownership solutions for 3D stacking. The company's intellectual property has been licensed for a variety of semiconductor applications including BSI sensors, RF front ends, pico-projectors, memories and 3D integrated circuits. Founded in 2000 as a venture-backed spinoff of RTI International, the company has been issued more than 40 U.S. patents and more than 35 international patents, with more than 50 U.S. and international patent applications pending

About EV Group (EVG)

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.

For more information, please click here

Copyright © Marketwire

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Metal oxide sandwiches: New option to manipulate properties of interfaces February 8th, 2016

Canadian physicists discover new properties of superconductivity February 8th, 2016

Leading bugs to the death chamber: A kinder face of cholesterol February 8th, 2016

From allergens to anodes: Pollen derived battery electrodes February 8th, 2016

Hardware

Discovery of the specific properties of graphite-based carbon materials February 6th, 2016

Researchers discover new phase of boron nitride and a new way to create pure c-BN February 5th, 2016

Weaving a new story for COFS and MOFs: First materials to be woven at the atomic and molecular levels created at Berkeley January 24th, 2016

Polymer nanowires that assemble in perpendicular layers could offer route to tinier chip components January 23rd, 2016

MEMS

Vesper Collaborates with GLOBALFOUNDRIES to Deliver First Piezoelectric MEMS Microphones: Acoustic sensing company works with top foundry to support mass-market consumer products January 21st, 2016

MEMS & Sensors Industry Group Previews “Internet of MEMS & Sensors” at CES 2016 -- Global industry association invites CE OEMS/integrators to conference track on January 7 January 6th, 2016

SITRI and Accelink Announce Cooperative Agreement on Opto-Electronic Communication December 31st, 2015

Nanodevices at one-hundredth the cost: New techniques for building microelectromechanical systems show promise December 20th, 2015

Chip Technology

Metal oxide sandwiches: New option to manipulate properties of interfaces February 8th, 2016

The iron stepping stones to better wearable tech without semiconductors February 8th, 2016

Organic crystals allow creating flexible electronic devices: The researchers from the Faculty of Physics of the Moscow State University have grown organic crystals that allow creating flexible electronic devices February 5th, 2016

Scientists guide gold nanoparticles to form 'diamond' superlattices: DNA scaffolds cage and coax nanoparticles into position to form crystalline arrangements that mimic the atomic structure of diamond February 4th, 2016

Announcements

Scientists create laser-activated superconductor February 8th, 2016

Canadian physicists discover new properties of superconductivity February 8th, 2016

Leading bugs to the death chamber: A kinder face of cholesterol February 8th, 2016

From allergens to anodes: Pollen derived battery electrodes February 8th, 2016

Patents/IP/Tech Transfer/Licensing

Joint Efforts by Iranian, Malaysian Scientists Produce Antibacterial Coatings for Isolated Areas February 4th, 2016

Silicon-based metamaterials could bring photonic circuits February 1st, 2016

Therapeutic Solutions International Licenses Dexosome Clinical Stage Cancer Immunotherapy Product From Gustave Roussy European Cancer Centre: FDA Cleared Immuno-Oncology Technology to Resume Clinical Development for Solid Tumor Patients January 27th, 2016

Light-activated nanoparticles prove effective against antibiotic-resistant 'superbugs' January 19th, 2016

Events/Classes

Nanotech Security to Present at the Optical Document Security Conference February 11, 2016 February 4th, 2016

New research uses nanotechnology to prevent preterm birth: March of Dimes honors abstract on prematurity at SMFM Annual Meeting February 2nd, 2016

NBC LEARN DEBUTS SIX-PART VIDEO SERIES, “NANOTECHNOLOGY: SUPER SMALL SCIENCE” Produced by NBC Learn in partnership with the National Science Foundation, and narrated by NBC News/MSNBC’s Kate Snow, series highlights leading research in nanotechnology January 25th, 2016

Leti to Host Workshop on New Photonics Applications During SPIE Photonics West: Researchers also Will Present Four Invited Papers At Feb. 13-18 Conference, 14 Papers, Overall January 25th, 2016

Alliances/Trade associations/Partnerships/Distributorships

Vesper Collaborates with GLOBALFOUNDRIES to Deliver First Piezoelectric MEMS Microphones: Acoustic sensing company works with top foundry to support mass-market consumer products January 21st, 2016

Imec and Cloudtag Collaborate on High Quality Frictionless Wearables for Lifestyle Coaching: Next-generation health and fitness tracker Cloudtag TrackTM launched at CES 2016 January 7th, 2016

Technical partnership at the top – Oxford Instruments and Zurich Instruments announce a technical collaboration for low temperature physics January 7th, 2016

Production of Graphene Oxide Nanosheets to Economize Fuel Cells January 1st, 2016

Printing/Lithography/Inkjet/Inks

Teijin to Participate in Nano Tech 2016 January 21st, 2016

New bimetallic alloy nanoparticles for printed electronic circuits: Production of oxidation-resistant copper alloy nanoparticles by electrical explosion of wire for printed electronics January 5th, 2016

Photonic “sintering” may create new solar, electronics manufacturing technologies December 1st, 2015

Screen Printable Functionalised Graphene Ink November 3rd, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic