Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding: Enables Fine-Pitch Connections for 3D Applications, Including Image Sensors, Memory and 3D SoCs

Abstract:
Ziptronix Inc. and EV Group ("EVG") today announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers. The results were achieved by implementing Ziptronix's DBI® Hybrid Bonding technology on an EVG Gemini® FB production fusion bonder and SmartView®NT bond aligner. This approach can be used to manufacture fine-pitch 3D ICs for a variety of applications including stacked memory, advanced image sensors and stacked systems-on-chip (SoCs).

Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding: Enables Fine-Pitch Connections for 3D Applications, Including Image Sensors, Memory and 3D SoCs

Research Triangle Park, NC | Posted on May 27th, 2014

"The performance of DBI Hybrid Bonding technology is not limited by connection pitch, but requires the right alignment and placement tool with an ability to scale that has been a challenge to find until now," said Paul Enquist, CTO and VP Engineering at Ziptronix. "EVG's fusion bonding equipment has been optimized to achieve consistent submicron post-bond alignment accuracy. This advancement in alignment accuracy provides a clear path to high-volume manufacturing (HVM) of our technology."

Pitch scaling on next-generation 3D technologies is expected to continue for many years to come. Fine-pitch hybrid bonding is already in use in high-performance 3D memory products, and has been announced for HVM of 3D image sensors. DBI Hybrid Bonding can be used at the die or wafer level; however, wafer-level bonding enables a great cost benefit by bonding all the die at once. With much of the processing for DBI Hybrid Bonding taking place at wafer scale, there is the added benefit of low cost-of-ownership.

"Demonstrating submicron accuracy is critical to achieving fine-pitch connections in HVM for a wider variety of applications," said Paul Lindner, Executive Technology Director at EVG. "As the industry pushes to realize 3D ICs, joint efforts such as our work with Ziptronix to develop manufacturing approaches offer customers a tremendous value-add."

Ziptronix Direct Bond Interconnect (DBI®) Hybrid Bonding is a conductor/dielectric bonding technology that includes a variety of metal/oxide and/or nitride combinations, does not use adhesives and is currently the most suitable for volume manufacturing in the marketplace. It allows for strong, room temperature dielectric bonding, low temperature conductive bonding and finer-pitch interconnect over Cu/Cu or other metal bonding because the bond occurs between both the dielectric and the conductive surfaces, which effectively bonds the entire substrate interface area.

EVG's SmartView®NT Automated Bond Alignment System for Universal Alignment offers a proprietary method of face-to-face wafer-level alignment, which is key to achieving the required accuracy in multiple wafer stacking for leading-edge technologies. In addition to improving alignment capabilities on its SmartView®NT bond aligner to reach submicron accuracies, EVG has optimized it so that surfaces can be prepared simultaneously for bonding, electrical connectivity and mechanical strength.

The companies will showcase this technology at ECTC 2014, from May 27-30, 2014, in Lake Buena Vista, Florida. To learn more about Ziptronix DBI Hybrid Bonding visit booth #121 and for information on EVG Equipment Solutions for Fusion Bonding visit booth #413.

####

About Ziptronix
A pioneer in the development of low-temperature direct bond technology, Ziptronix offers patented technology for wafer- or die-level bonding. Its ZiBond® Direct Bonding and DBI® Hybrid Bonding technologies deliver the industry's most scalable, manufacturable and lowest total cost-of-ownership solutions for 3D stacking. The company's intellectual property has been licensed for a variety of semiconductor applications including BSI sensors, RF front ends, pico-projectors, memories and 3D integrated circuits. Founded in 2000 as a venture-backed spinoff of RTI International, the company has been issued more than 40 U.S. patents and more than 35 international patents, with more than 50 U.S. and international patent applications pending

About EV Group (EVG)

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.

For more information, please click here

Copyright © Marketwire

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Keeping electric car design on the right road: A closer look at the life-cycle impacts of lithium-ion batteries and proton exchange membrane fuel cells December 9th, 2016

Further improvement of qubit lifetime for quantum computers: New technique removes quasiparticles from superconducting quantum circuits December 9th, 2016

Chemical trickery corrals 'hyperactive' metal-oxide cluster December 8th, 2016

Scientists track chemical and structural evolution of catalytic nanoparticles in 3-D: Up-close, real-time, chemical-sensitive 3-D imaging offers clues for reducing cost/improving performance of catalysts for fuel-cell-powered vehicles and other applications December 8th, 2016

Exotic insulator may hold clue to key mystery of modern physics: Johns Hopkins-led research shows material living between classical and quantum worlds December 8th, 2016

Hardware

Chemical trickery corrals 'hyperactive' metal-oxide cluster December 8th, 2016

MEMS

Vesper a Finalist for Two ACE Awards: Ultimate Products and Innovator of the Year -- Industry’s first piezoelectric MEMS microphone and Vesper CTO Bobby Littrell recognized for prestigious electronics-industry awards November 10th, 2016

Semiconductor-free microelectronics are now possible, thanks to metamaterials November 9th, 2016

Researchers surprised at the unexpected hardness of gallium nitride: A Lehigh University team discovers that the widely used semiconducting material is almost as wear-resistant as diamonds October 31st, 2016

Leti Scientists Participating in Sessions on Med Tech, Automotive Technologies, MEMS, Si-photonics and Lithography at SEMICON Europa: Teams also Will Demonstrate Technology Advances in Telecom, Data Fusion, Energy, Silicon Photonics and 3D Integration October 18th, 2016

Chip Technology

Further improvement of qubit lifetime for quantum computers: New technique removes quasiparticles from superconducting quantum circuits December 9th, 2016

Chemical trickery corrals 'hyperactive' metal-oxide cluster December 8th, 2016

Leti IEDM 2016 Paper Clarifies Correlation between Endurance, Window Margin and Retention in RRAM for First Time: Paper Presented at IEDM 2016 Offers Ways to Reconcile High-cycling Requirements and Instability at High Temperatures in Resistive RAM December 6th, 2016

Tokyo Institute of Technology research: 3D solutions to energy savings in silicon power transistors December 6th, 2016

Announcements

Keeping electric car design on the right road: A closer look at the life-cycle impacts of lithium-ion batteries and proton exchange membrane fuel cells December 9th, 2016

Further improvement of qubit lifetime for quantum computers: New technique removes quasiparticles from superconducting quantum circuits December 9th, 2016

Researchers peer into atom-sized tunnels in hunt for better battery: May improve lithium ion for larger devices, like cars December 8th, 2016

Scientists track chemical and structural evolution of catalytic nanoparticles in 3-D: Up-close, real-time, chemical-sensitive 3-D imaging offers clues for reducing cost/improving performance of catalysts for fuel-cell-powered vehicles and other applications December 8th, 2016

Patents/IP/Tech Transfer/Licensing

Keystone Nano Announces The US FDA Has Awarded Orphan Drug Designation For Ceramides For The Treatment Of Liver Cancer November 8th, 2016

Leti to Tackle Tomorrow's Research Strategies with Stanford University’s SystemX Alliance: French R&D Center Is the First Research Institute to Join the Collaboration and Provides Bridges Between Academia and Industry, Leveraging Alliance’s Potential October 4th, 2016

Picosun patents ALD nanolaminate to prevent electronics from overheating September 28th, 2016

NIST Patents Single-Photon Detector for Potential Encryption and Sensing Apps September 16th, 2016

Events/Classes

Arrowhead Pharmaceuticals to Webcast Fiscal 2016 Year End Results December 7th, 2016

In IEDM 2016 Keynote, Leti CEO Says ‘Hyperconnectivity’, Human-focused Research and the IOT Promise Profound, Positive Changes December 7th, 2016

IEDM: Leti CEO Marie Semeria to Give Opening-day Keynote on Impact of ‘Hyperconnectivity’ and IoT: Speech to Portray Key Role Nonprofit Research and Technology Organizations Play in Making Technology More Efficient and Ensuring Safety and Security November 29th, 2016

Leti and Grenoble Partners Demonstrate World’s 1st Qubit Device Fabricated in CMOS Process: Paper by Leti, Inac and University of Grenoble Alpes Published in Nature Communications November 28th, 2016

Alliances/Trade associations/Partnerships/Distributorships

Infrared instrumentation leader secures exclusive use of Vantablack coating December 5th, 2016

Leti and Grenoble Partners Demonstrate World’s 1st Qubit Device Fabricated in CMOS Process: Paper by Leti, Inac and University of Grenoble Alpes Published in Nature Communications November 28th, 2016

Mechanism for sodium storage in 2-D material: Tin selenide is an effective host for storing sodium ions, making it a promising material for sodium ion batteries October 27th, 2016

Enterprise In Space Partners with Sketchfab and 3D Hubs for NewSpace Education October 13th, 2016

Printing/Lithography/Inkjet/Inks/Bio-printing

Bumpy surfaces, graphene beat the heat in devices: Rice University theory shows way to enhance heat sinks in future microelectronics November 29th, 2016

Engineers develop new magnetic ink to print self-healing devices that heal in record time November 7th, 2016

Iran to hold intl. school on application of nanomaterials in medicine September 20th, 2016

Tailored probes for atomic force microscopes: 3-D laser lithography enhances microscope for studying nanostructures in biology and engineering/ publication in Applied Physics Letters August 11th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project