Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding: Enables Fine-Pitch Connections for 3D Applications, Including Image Sensors, Memory and 3D SoCs

Abstract:
Ziptronix Inc. and EV Group ("EVG") today announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers. The results were achieved by implementing Ziptronix's DBI® Hybrid Bonding technology on an EVG Gemini® FB production fusion bonder and SmartView®NT bond aligner. This approach can be used to manufacture fine-pitch 3D ICs for a variety of applications including stacked memory, advanced image sensors and stacked systems-on-chip (SoCs).

Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding: Enables Fine-Pitch Connections for 3D Applications, Including Image Sensors, Memory and 3D SoCs

Research Triangle Park, NC | Posted on May 27th, 2014

"The performance of DBI Hybrid Bonding technology is not limited by connection pitch, but requires the right alignment and placement tool with an ability to scale that has been a challenge to find until now," said Paul Enquist, CTO and VP Engineering at Ziptronix. "EVG's fusion bonding equipment has been optimized to achieve consistent submicron post-bond alignment accuracy. This advancement in alignment accuracy provides a clear path to high-volume manufacturing (HVM) of our technology."

Pitch scaling on next-generation 3D technologies is expected to continue for many years to come. Fine-pitch hybrid bonding is already in use in high-performance 3D memory products, and has been announced for HVM of 3D image sensors. DBI Hybrid Bonding can be used at the die or wafer level; however, wafer-level bonding enables a great cost benefit by bonding all the die at once. With much of the processing for DBI Hybrid Bonding taking place at wafer scale, there is the added benefit of low cost-of-ownership.

"Demonstrating submicron accuracy is critical to achieving fine-pitch connections in HVM for a wider variety of applications," said Paul Lindner, Executive Technology Director at EVG. "As the industry pushes to realize 3D ICs, joint efforts such as our work with Ziptronix to develop manufacturing approaches offer customers a tremendous value-add."

Ziptronix Direct Bond Interconnect (DBI®) Hybrid Bonding is a conductor/dielectric bonding technology that includes a variety of metal/oxide and/or nitride combinations, does not use adhesives and is currently the most suitable for volume manufacturing in the marketplace. It allows for strong, room temperature dielectric bonding, low temperature conductive bonding and finer-pitch interconnect over Cu/Cu or other metal bonding because the bond occurs between both the dielectric and the conductive surfaces, which effectively bonds the entire substrate interface area.

EVG's SmartView®NT Automated Bond Alignment System for Universal Alignment offers a proprietary method of face-to-face wafer-level alignment, which is key to achieving the required accuracy in multiple wafer stacking for leading-edge technologies. In addition to improving alignment capabilities on its SmartView®NT bond aligner to reach submicron accuracies, EVG has optimized it so that surfaces can be prepared simultaneously for bonding, electrical connectivity and mechanical strength.

The companies will showcase this technology at ECTC 2014, from May 27-30, 2014, in Lake Buena Vista, Florida. To learn more about Ziptronix DBI Hybrid Bonding visit booth #121 and for information on EVG Equipment Solutions for Fusion Bonding visit booth #413.

####

About Ziptronix
A pioneer in the development of low-temperature direct bond technology, Ziptronix offers patented technology for wafer- or die-level bonding. Its ZiBond® Direct Bonding and DBI® Hybrid Bonding technologies deliver the industry's most scalable, manufacturable and lowest total cost-of-ownership solutions for 3D stacking. The company's intellectual property has been licensed for a variety of semiconductor applications including BSI sensors, RF front ends, pico-projectors, memories and 3D integrated circuits. Founded in 2000 as a venture-backed spinoff of RTI International, the company has been issued more than 40 U.S. patents and more than 35 international patents, with more than 50 U.S. and international patent applications pending

About EV Group (EVG)

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.

For more information, please click here

Copyright © Marketwire

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Radiation-guided nanoparticles zero in on metastatic cancer July 1st, 2016

Synthesized microporous 3-D graphene-like carbons: IBS research team create carbon synthesis using zeolites as a template July 1st, 2016

No need in supercomputers: Russian scientists suggest a PC to solve complex problems tens of times faster than with massive supercomputers June 30th, 2016

Surprising qualities of insulator ring surfaces: Surface phenomena in ring-shaped topological insulators are just as controllable as those in spheres made of the same material June 30th, 2016

How cancer cells spread and squeeze through tiny blood vessels (video) June 30th, 2016

Hardware

No need in supercomputers: Russian scientists suggest a PC to solve complex problems tens of times faster than with massive supercomputers June 30th, 2016

MEMS

New research unveils graphene 'moth eyes' to power future smart technologies: New ultra-thin, patterned graphene sheets will be essential in designing future technologies such as 'smart wallpaper' and Internet-of-things applications March 1st, 2016

Vesper Collaborates with GLOBALFOUNDRIES to Deliver First Piezoelectric MEMS Microphones: Acoustic sensing company works with top foundry to support mass-market consumer products January 21st, 2016

MEMS & Sensors Industry Group Previews “Internet of MEMS & Sensors” at CES 2016 -- Global industry association invites CE OEMS/integrators to conference track on January 7 January 6th, 2016

SITRI and Accelink Announce Cooperative Agreement on Opto-Electronic Communication December 31st, 2015

Chip Technology

Surprising qualities of insulator ring surfaces: Surface phenomena in ring-shaped topological insulators are just as controllable as those in spheres made of the same material June 30th, 2016

How cancer cells spread and squeeze through tiny blood vessels (video) June 30th, 2016

New, better way to build circuits for world's first useful quantum computers June 28th, 2016

Soft decoupling of organic molecules on metal June 23rd, 2016

Announcements

Radiation-guided nanoparticles zero in on metastatic cancer July 1st, 2016

Synthesized microporous 3-D graphene-like carbons: IBS research team create carbon synthesis using zeolites as a template July 1st, 2016

No need in supercomputers: Russian scientists suggest a PC to solve complex problems tens of times faster than with massive supercomputers June 30th, 2016

Surprising qualities of insulator ring surfaces: Surface phenomena in ring-shaped topological insulators are just as controllable as those in spheres made of the same material June 30th, 2016

Patents/IP/Tech Transfer/Licensing

New 'ukidama' nanoparticle structure revealed June 14th, 2016

Rice wins award to recruit cancer researcher: $2 million CPRIT grant aims to bring MIT researcher Omid Veiseh to Houston June 7th, 2016

Nanobiotix receives US$1m milestone payment from PharmaEngine: First patient injected with NBTXR3 in soft tissue sarcoma registration phase in Asia May 31st, 2016

Programmable materials find strength in molecular repetition May 23rd, 2016

Events/Classes

Nanometrics to Participate in the 8th Annual CEO Investor Summit: Investor Event Held Concurrently with SEMICON West 2016 in San Francisco June 22nd, 2016

Leti Innovation Day in Lyon Will Explore New Security Challenges and Responses for a Safe Connected World June 15th, 2016

Call for NanoArt and Art-Science-Technology Papers June 9th, 2016

Novel gene therapy shows potential for lung repair in asthma May 18th, 2016

Alliances/Trade associations/Partnerships/Distributorships

FEI and University of Liverpool Announce QEMSCAN Research Initiative: University of Liverpool will utilize FEI’s QEMSCAN technology to gain a better insight into oil and gas reserves & potentially change the approach to evaluating them June 22nd, 2016

French Research Team Helps Extend MRI Detection of Diseases & Lower Health-Care Costs: CEA, INSERM and G2ELab Brings Grenoble Region’s Expertise In Advanced Medicine & Magnetism Applications to H2020 IDentIFY Project June 21st, 2016

Research showing why hierarchy exists will aid the development of artificial intelligence June 13th, 2016

UK NANOSAFETY GROUP publishes 2nd Edition of guidance to support safe working with nanomaterials May 30th, 2016

Printing/Lithography/Inkjet/Inks

Nanoscientists develop the 'ultimate discovery tool': Rapid discovery power is similar to what gene chips offer biology June 25th, 2016

Perovskite solar cells surpass 20 percent efficiency: EPFL researchers are pushing the limits of perovskite solar cell performance by exploring the best way to grow these crystals June 13th, 2016

'On-the-fly' 3-D print system prints what you design, as you design it June 1st, 2016

Physicists create first metamaterial with rewritable magnetic ordering May 23rd, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic