Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Kinetic Technologies Selects Dongbu HiTek to Manufacture LED Driver ICs Destined for Smart Phone Applications: Korean foundry has begun volume production using its groundbreaking low-voltage BCDMOS process at the 0.18-micron node

Abstract:
Dongbu HiTek today announced that it has begun volume production of LED Driver ICs for Kinetic Technologies, a high-performance analog and mixed-signal fabless company. Implemented with the Korean foundry's specialized low voltage BCDMOS process at the 0.18-micron node (BD180LV), Kinetic's LED Driver ICs are ideal for backlighting smart phone displays and providing the camera's flash feature.

Kinetic Technologies Selects Dongbu HiTek to Manufacture LED Driver ICs Destined for Smart Phone Applications: Korean foundry has begun volume production using its groundbreaking low-voltage BCDMOS process at the 0.18-micron node

Seoul, Korea | Posted on May 27th, 2014

"Our BD180LV process continues to set the high-performance standard for advanced mixed-signal technologies that promise to shrink the size of chips for handheld consumer products," said Jae Song, Dongbu HiTek EVP of marketing. He noted that Dongbu HiTek is leveraging its specialized BCDMOS to implement an expanding range of power management chips such as the LED Driver IC, input protection switches and DC/DC converters for Kinetic. "We look forward to extending our foundry partnership with Kinetic into manufacturing power management chips for AMOLED displays and buck converters as well as other applications."

Dongbu HiTek's BD180LV process was formally launched about four years ago at the International Symposium on Power Semiconductor Devices in Hiroshima, Japan. In a technical paper presented at that time, the company disclosed impressive BD180LV breakdown characteristics for 24V nLDMOS, noting, "The Ids-Vds curve shows very stable characteristics up to 27.5V with actual off-state and on-state breakdown voltages of 36V and 33V, respectively. At 5.0Vgs and 0.1Vds, the Rsp was 0.0145 ohms square millimeter - the lowest ever reported in the semiconductor industry." Since then, the Korean foundry has consistently improved its BD180LV process to maintain its best-in-class achievement.

####

About Dongbu HiTek
Dongbu HiTek Co., Ltd. specializes in developing superb analog and mixed-signal processing technologies. The company adds high value to advanced ICs with a processing portfolio that encompasses Analog CMOS, BCDMOS, High Voltage CMOS, CMOS Power Amplifier (PA), CMOS Image Sensor (CIS), Display Driver IC (DDI), Touch Screen Controller IC and Embedded Flash technologies. With its best-in-class BCDMOS technology, the company manufactures power management chips that serve numerous applications ranging from home and handheld electronics to automotive and industrial systems. Currently processing technologies at nodes ranging from 0.35 microns to 90 nanometers, the company complements its world class foundry capabilities with top quality design support, prototype verification and packaging/module development. Headquartered in Seoul, Dongbu HiTek publicly trades its stock under 000990 on the Korea Stock Exchange.

For more information, please click here

Contacts:
Dongbu HiTek USA
Elizabeth Estrella-Basilio
Phone: +1.408.238.8822

Copyright © Dongbu HiTek

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Self-assembling particles brighten future of LED lighting January 18th, 2017

Dressing a metal in various colors: DGIST research developed a technology to coat metal with several nanometers of semiconducting materials January 17th, 2017

Nanoparticle exposure can awaken dormant viruses in the lungs January 17th, 2017

Nanoscale view of energy storage January 16th, 2017

Wireless/telecommunications/RF/Antennas/Microwaves

New laser based on unusual physics phenomenon could improve telecommunications, computing January 12th, 2017

Illinois team advances GaN-on-Silicon for scalable high electron mobility transistors January 10th, 2017

The researchers created a tiny laser using nanoparticles January 5th, 2017

Shape matters when light meets atom: Mapping the interaction of a single atom with a single photon may inform design of quantum devices December 4th, 2016

Chip Technology

Dressing a metal in various colors: DGIST research developed a technology to coat metal with several nanometers of semiconducting materials January 17th, 2017

Seeing the quantum future... literally: What if big data could help you see the future and prevent your mobile phone from breaking before it happened? January 16th, 2017

NUS researchers achieve major breakthrough in flexible electronics: New classes of printable electrically conducting polymer materials make better electrodes for plastic electronics and advanced semiconductor devices January 14th, 2017

Nanoscale Modifications can be used to Engineer Electrical Contacts for Nanodevices January 13th, 2017

Announcements

Self-assembling particles brighten future of LED lighting January 18th, 2017

Dressing a metal in various colors: DGIST research developed a technology to coat metal with several nanometers of semiconducting materials January 17th, 2017

Nanoparticle exposure can awaken dormant viruses in the lungs January 17th, 2017

Nanoscale view of energy storage January 16th, 2017

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project