Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > SEMATECH Achieves Breakthrough Defect Reductions in EUV Mask Blanks: Technologists at SEMATECH Successfully Reduce Defects from Multi-layer Deposition of Mask Blanks, Meeting the Defect Requirements for Early Introduction of EUV

Abstract:
SEMATECH announced today that researchers have reached a significant milestone in reducing tool-generated defects from the multi-layer deposition of mask blanks used for extreme ultraviolet (EUV) lithography, pushing the technology another significant step toward readiness for high-volume manufacturing (HVM).

SEMATECH Achieves Breakthrough Defect Reductions in EUV Mask Blanks: Technologists at SEMATECH Successfully Reduce Defects from Multi-layer Deposition of Mask Blanks, Meeting the Defect Requirements for Early Introduction of EUV

Albany, NY | Posted on May 6th, 2014

Following a four-year effort to improve deposition tool hardware, process parameters and substrate cleaning techniques, technologists at SEMATECH have, for the first time, deposited EUV multilayers with zero defects per mask at 100 nm sensitivity (SiO2 equivalent). Eliminating these large "killer" defects is essential for the use of EUV in early product development. These results were achieved on a 40 bi-layer Si/Mo film stack and measured over the entire mask blank quality area of 132x132 mm2.

In addition, by subtracting out incoming substrate defects, SEMATECH has demonstrated that the multilayer deposition process itself can achieve zero defects down to 50 nm sensitivity. Coupled with novel improvements to the mask substrate cleaning process to remove incoming defects, this represents the capability to both extend EUV to future nodes by eliminating smaller "killer" defects, and as a step to reducing smaller defects (which can be mitigated) to a level where improved yield and mask cost make EUV a more cost-effective HVM technology.

"SEMATECH's comprehensive programs continue to produce the results that our members and the industry need to show that EUV lithography is manufacturable," said Kevin Cummings, SEMATECH's Lithography manager. "Our Advanced Mask Development program continues to demonstrate practical results for mask blank defect reduction, more efficient deposition and cleaning, effective reticle handling, and other areas that the industry will need for successful EUV lithography manufacturing."
Defects are generally created by the deposition process or formed by decoration of substrate defects during the multilayer deposition process. These types of defects have prevented the quality of mask blanks from keeping pace with roadmap requirements for the production of pilot line and high-volume manufacturing EUV reticles. Reducing defects in the EUV mask blank multilayer deposition system is one of the most critical technology gaps the industry needs to address to enable cost-effective insertion of this technology at the 16 nm half-pitch.

"A low defect density reflective mask blank is considered to be one of the top two critical technology gaps for the commercialization of EUV," said Frank Goodwin, manager of SEMATECH's Advanced Mask Development program. "Through sophisticated defect analysis capabilities and processes, the goal of our work is to enable model-based prediction and data-driven analysis of defect performance for process improvement and component learning. We then use these models to feed into the new deposition tool design."

SEMATECH's Advanced Mask Blank Development program is located at the SUNY College of Nanoscale Science and Engineering (CNSE) in Albany, New York to develop defect-free EUV blanks.

####

About SEMATECH
For over 25 years, SEMATECH®, the international consortium of leading semiconductor device, equipment, and materials manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Through our unwavering commitment to foster collaboration across the nanoelectronics industry, we help our members and partners address critical industry transitions, drive technical consensus, pull research into the industry mainstream, improve manufacturing productivity, and reduce risk and time to market. Information about SEMATECH can be found at www.sematech.org. Twitter: www.twitter.com/sematech

For more information, please click here

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

The next step in DNA computing: GPS mapping? May 6th, 2015

Improving Clinical Care and Patient Quality of Life in Advanced Liver Disease, d-LIVER Workshop, Milan, 27 May 2015 May 6th, 2015

Grafoid Acquires MuAnalysis Inc; Expands Its Advanced Materials Testing Capabilities May 6th, 2015

Winner Announced for NNI’s First ‘EnvisioNano’ Nanotechnology Image Contest May 6th, 2015

Chip Technology

The next step in DNA computing: GPS mapping? May 6th, 2015

Improving organic transistors that drive flexible and conformable electronics: UMass Amherst scientists advance understanding of strain effects on performance May 5th, 2015

New chip architecture may provide foundation for quantum computer: Researchers at the Georgia Tech Research Institute have developed a microfabricated ion trap architecture that holds promise for increasing the density of qubits in future quantum computers May 5th, 2015

Silicon Storage Technology and GLOBALFOUNDRIES Announce Qualification of Automotive Grade 55nm Embedded Flash Memory Technology May 5th, 2015

Announcements

The next step in DNA computing: GPS mapping? May 6th, 2015

Improving Clinical Care and Patient Quality of Life in Advanced Liver Disease, d-LIVER Workshop, Milan, 27 May 2015 May 6th, 2015

Grafoid Acquires MuAnalysis Inc; Expands Its Advanced Materials Testing Capabilities May 6th, 2015

Winner Announced for NNI’s First ‘EnvisioNano’ Nanotechnology Image Contest May 6th, 2015

Tools

Oxford Instruments Asylum Research in Conjunction with the MRS OnDemand® Webinar Series Presents: “Beyond Topography: New Advances in AFM Characterization of Polymers” May 28, 2015 May 5th, 2015

Iranian Scientists Present Model to Study Mechanical Vibrations of Structures Containing Nanocomposites May 5th, 2015

Nanometrics to Present at the B. Riley & Co. 16th Annual Investor Conference May 2nd, 2015

Time Dependant Spectroscopy of Microscopic Samples: CRAIC TimePro™ software is used with CRAIC Technologies microspectrometers to measure the kinetic UV-visible-NIR, Raman and fluorescence spectra of microscopic sample areas May 2nd, 2015

Alliances/Partnerships/Distributorships

Silicon Storage Technology and GLOBALFOUNDRIES Announce Qualification of Automotive Grade 55nm Embedded Flash Memory Technology May 5th, 2015

How can you see an atom? (video) April 10th, 2015

FibeRio and VF Corporation Form Strategic Partnership to Lead the Apparel and Footwear Markets in Nanofiber Technology April 8th, 2015

UK National Graphene Institute Selects Bruker as Official Partner: World-Leading Graphene Research Facility Purchases Multiple Bruker AFMs April 7th, 2015

Printing/Lithography/Inkjet/Inks

Northwestern scientists develop first liquid nanolaser: Technology could lead to new way of doing 'lab on a chip' medical diagnostics April 25th, 2015

New class of 3D-printed aerogels improve energy storage April 22nd, 2015

Printing Silicon on Paper, with Lasers April 21st, 2015

Advances in molecular electronics: Lights on -- molecule on: Researchers from Dresden and Konstanz succeed in light-controlled molecule switching April 20th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project