Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SEMATECH to Showcase Advances in EUV Extendibility and Metrology Techniques for Defect Inspection at SPIE 2014: Papers demonstrate leadership in the development of EUV lithography infrastructure and mask and resist technology

Abstract:
SEMATECH experts will present world-leading research and development results on extreme ultraviolet (EUV) manufacturability and extendibility, and related areas of metrology at the SPIE Advanced Lithography 2014 conferences taking place February 23-27 in San Jose, CA.

SEMATECH to Showcase Advances in EUV Extendibility and Metrology Techniques for Defect Inspection at SPIE 2014: Papers demonstrate leadership in the development of EUV lithography infrastructure and mask and resist technology

Albany, NY | Posted on February 20th, 2014

Among the global semiconductor community's leading gatherings, the SPIE conference series attracts thousands of specialists in various aspects of lithography and related metrology, two of the most challenging areas of advanced microchip production.

"Although serious challenges remain to further enable EUV pilot line readiness and advance EUV extendibility, steady progress has been realized and we are looking forward to sharing our results on some of the most critical aspects of the development of EUV infrastructure," said Michael Lercel, director of Lithography, Metrology, and Nanodefectivity at SEMATECH. "SEMATECH lithographers will recount achievements in multiple areas of EUV infrastructure, including resist and mask blank development, and the results presented will be instrumental in driving timely creation of the remaining infrastructure required to bring EUV to production."

Next to meeting EUV productivity targets, defect-free EUV mask blanks are the most important element needed to enable EUV HVM introduction. SEMATECH's mask blank technologists will share the progress made at SEMATECH's Mask Blank Development Center in eliminating so-called "killer-type" mask blanks defects. Achieving this goal is critical to enable early adopters of EUV lithography.

The development of resist materials depends on the availability of high resolution micro-exposure tools. SEMATECH researchers will report on current performance and progress in upgrading these tools with the higher numerical aperture lenses needed to meet requirements for sub 10 nm resist materials development. In addition, recent results from SEMATECH's new imaging materials platform research will be reported.

In an invited paper addressing key infrastructure gaps for EUV in the area of mask metrology, Carl Zeiss and SEMATECH will share the results from the integration of the industry's first-ever commercial actinic aerial image metrology (AIMS™) EUV system.

"In partnership with Carl Zeiss, SEMATECH's EUV Mask Infrastructure initiative has made impressive advances through collaborative research with chip manufacturers. The AIMS™ tool is already producing mask-scale aerial images for 16 nm half-pitch node," said Michael Goldstein, EMI program manager and senior principal physicist at SEMATECH. "These results demonstrate that significant progress is being made in the development of critical metrology tools required to fabricate defect-free masks."

Other SEMATECH papers will showcase advances in metrology techniques and applications, including critical dimension atomic force microscopy (CD-AFM), critical dimension X-ray scattering (CD-SAXS), 3D characterization of directed self-assembly (DSA) by scatterometry, and a through-focus scanning optical microscopy (TSOM) technique being explored for future defect inspection and high-volume manufacturing of high-aspect ratio features. Critical dimension scanning electron microscopy (CD-SEM) limits and extendibility will also be analyzed, as well as improvements to CD-SEM roughness measurement strategy.

For a complete list of these and other presentations at SPIE please visit bit.ly/1eKaYgO.

####

About SEMATECH
For over 25 years, SEMATECH®, the international consortium of leading semiconductor device, equipment, and materials manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Through our unwavering commitment to foster collaboration across the nanoelectronics industry, we help our members and partners address critical industry transitions, drive technical consensus, pull research into the industry mainstream, improve manufacturing productivity, and reduce risk and time to market.

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Marketing Communications
O: 518-649-1041

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem in China: More than $100M investment to establish a center of excellence for FDXTM FD-SOI design May 23rd, 2017

Zap! Graphene is bad news for bacteria: Rice, Ben-Gurion universities show laser-induced graphene kills bacteria, resists biofouling May 22nd, 2017

Leti Will Demo World’s-first WVGA 10-µm Pitch GaN Microdisplays for Augmented Reality Video at Display Week in Los Angles: Invited Paper also Will Present Leti’s Success with New Augmented Reality Technology That Reduces Pixel Pitch to Less than 5 Microns May 22nd, 2017

Graphene-nanotube hybrid boosts lithium metal batteries: Rice University prototypes store 3 times the energy of lithium-ion batteries May 19th, 2017

Chip Technology

GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem in China: More than $100M investment to establish a center of excellence for FDXTM FD-SOI design May 23rd, 2017

Plasmon-powered upconversion nanocrystals for enhanced bioimaging and polarized emission: Plasmonic gold nanorods brighten lanthanide-doped upconversion superdots for improved multiphoton bioimaging contrast and enable polarization-selective nonlinear emissions for novel nanoscal May 19th, 2017

Oddball enzyme provides easy path to synthetic biomaterials May 17th, 2017

Racyics Launches ‘makeChip’ Design Service Platform for GLOBALFOUNDRIES’ 22FDX® Technology: Racyics will provide IP and design services as a part of the foundry’s FDXcelerator™ Partner Program May 11th, 2017

Announcements

GLOBALFOUNDRIES and Chengdu Partner to Expand FD-SOI Ecosystem in China: More than $100M investment to establish a center of excellence for FDXTM FD-SOI design May 23rd, 2017

Zap! Graphene is bad news for bacteria: Rice, Ben-Gurion universities show laser-induced graphene kills bacteria, resists biofouling May 22nd, 2017

Leti Will Demo World’s-first WVGA 10-µm Pitch GaN Microdisplays for Augmented Reality Video at Display Week in Los Angles: Invited Paper also Will Present Leti’s Success with New Augmented Reality Technology That Reduces Pixel Pitch to Less than 5 Microns May 22nd, 2017

Graphene-nanotube hybrid boosts lithium metal batteries: Rice University prototypes store 3 times the energy of lithium-ion batteries May 19th, 2017

Events/Classes

Leti Will Demo World’s-first WVGA 10-µm Pitch GaN Microdisplays for Augmented Reality Video at Display Week in Los Angles: Invited Paper also Will Present Leti’s Success with New Augmented Reality Technology That Reduces Pixel Pitch to Less than 5 Microns May 22nd, 2017

Oxford Instruments Asylum Research and Microscopy and Analysis Present the Webinar: “Video-Rate Atomic Force Microscopy Enables New Research Opportunities” May 9th, 2017

Graphene flagship steers towards higher technology readiness level May 4th, 2017

Precision NanoSystems @ CLINAM 2017 May 3rd, 2017

Alliances/Trade associations/Partnerships/Distributorships

California Research Alliance by BASF establishes more than 25 research projects in three years April 26th, 2017

BASF and Landa partner to create revolutionary pigments for automotive coatings: The alliance combines BASF innovations with Landa nano-pigment technology April 5th, 2017

Leti Announces EU/South Korean Project for World’s First 5G-system Prototype: Coinciding with the 2018 Winter Games in PyeongChang, Korea, Prototype Will Be First Time State-of-the-art Terrestrial Wireless Communication Is Seamlessly Combined with Disruptive Satellite Communicati April 4th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform: Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

Printing/Lithography/Inkjet/Inks/Bio-printing

Liquid metal nano printing set to revolutionize electronics: Creating integrated circuits just atoms thick February 18th, 2017

New stem cell technique shows promise for bone repair January 25th, 2017

NUS researchers achieve major breakthrough in flexible electronics: New classes of printable electrically conducting polymer materials make better electrodes for plastic electronics and advanced semiconductor devices January 14th, 2017

Nanowire 'inks' enable paper-based printable electronics: Highly conductive films make functional circuits without adding high heat January 4th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project