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Home > Press > FEI Introduces Two New DualBeams for Materials Science: New Scios and Helios DualBeam FIB/SEM systems offer unique capabilities for materials research including metals and nanodevice applications

Abstract:
FEI (NASDAQ: FEIC) today introduced two new DualBeam systems that feature innovative detection suites that provide high-quality imaging and fast analysis over the broadest range of samples. The new Scios™ DualBeam™ is specifically positioned for fast two-dimensional (2D) and three-dimensional (3D) characterization. The Helios NanoLab™ 660 DualBeam adds capabilities for specialized applications, such as the fabrication of prototypes for nanometer-scale devices.

FEI Introduces Two New DualBeams for Materials Science: New Scios and Helios DualBeam FIB/SEM systems offer unique capabilities for materials research including metals and nanodevice applications

Hillsboro, OR | Posted on July 17th, 2013

"These new systems make it easier to image challenging materials," said Trisha Rice, vice president and general manager of FEI's Materials Science Business Unit. "Their new detectors are able to reveal the subtle details in surface contrast. The electron optics innovations in Scios make it especially powerful for investigation of challenging materials, like insulating or magnetic materials. The Helios NanoLab 660, with its advanced combination of patterning engine, MultiChem™ gas delivery system, and Tomahawk™ ion optics, provides unprecedented capabilities for fabricating prototypes of complex nanodevices, enabling researchers to pioneer developments in devices like antennas and nanofluidic systems."

Rice added, "The DualBeam focused ion beam/scanning electron microscope (FIB/SEM) has long been the standard for preparation of ultrathin samples for transmission electron microscopy (TEM). TEM usage is growing rapidly as researchers seek to understand structure-function relationships down to the atomic level. These new DualBeam instruments are designed to support efficient TEM workflows by producing samples that meet any TEM application requirement, from nanoscale analysis to atomic resolution imaging. This tight integration will become even more apparent in coming TEM product launches--stay tuned."

For researchers working with materials that are difficult to image without coatings or preparation, the Scios offers technology innovations to mitigate these challenges. The new electron column is designed to handle characterization routines for both magnetic and non-magnetic samples. Its high-current capability provides fast X-ray analysis and can also be used to improve FIB milling accuracy on non-conductive samples by neutralizing accumulated charge.

The Scios also includes the new Trinity™ detector suite, comprising of three highly-efficient, in-lens detectors designed to detect electrons of different types and energies. Manipulating the detectors and mixing their signals allows the operator to selectively enhance material contrast, topographic contrast, edge detection, surface specificity and much more. This gives the user immediate access to a greater range of visual data from their sample for rapid characterization of materials.

The Helios NanoLab 660 DualBeam incorporates FEI's second-generation extreme high-resolution scanning electron microscope (XHR SEM) technology, using proprietary electron optical and detector technologies to deliver sub-nanometer imaging resolution over the widest range of accelerating voltages (0.5-30 kV). This allows researchers working with delicate or beam-sensitive materials to have access to fine structural, nanoscale details without damaging their sample. Up to 100 nA SEM beam current enables fast analysis, and new in-lens detectors allow simultaneous topographic and materials contrast imaging, along with energy filtering. The Tomahawk FIB column guarantees the tightest beam at high and low currents, for fast, precise large-volume removal and polishing, respectively; and exceptional low-energy performance to remove surface damage, which is especially useful when preparing samples for atomic-scale TEM imaging.

NanoBuilder™ 2.0, a second-generation nanoprototyping toolset being introduced on the Helios NanoLab 660 DualBeam, simplifies and accelerates the fabrication workflow for nano- and micro-scale device prototypes. Starting with a CAD design, the NanoBuilder software directs FIB milling and deposition to build intricate 3D structures with features ranging in size from nanometers to millimeters.

These two new DualBeams join FEI's Versa 3D™ system, configurable for dynamic experiments, to provide a portfolio of complementary FIB/SEM solutions for materials research applications.

For more information about FEI's DualBeam portfolio, please visit www.fei.com/products/dualbeams/ or contact your local sales representative.

####

About FEI Company
FEI (Nasdaq: FEIC) is a leading supplier of scientific instruments for nanoscale applications and solutions for industry and science. With more than 60 years of technological innovation and leadership, FEI has set the performance standard in transmission electron microscopes (TEM), scanning electron microscopes (SEM) and DualBeams™, which combine a SEM with a focused ion beam (FIB). FEI has over 2,500 employees and sales and service operations in more than 50 countries around the world. More information can be found at: www.fei.com.

FEI Safe Harbor Statement

This news release contains forward-looking statements that include statements regarding the performance capabilities and benefits of the Scios DualBeam, Trinity detector suite, and Helios NanoLab 660 DualBeam. Factors that could affect these forward-looking statements include but are not limited to failure of the product or technology to perform as expected and achieve anticipated results or cost savings, unexpected technology problems and challenges, changes to the technology, the inability of FEI, its suppliers or project partners to make the technological advances required for the technology to achieve anticipated results, the inability of customers to develop and deploy the expected new applications and our ability to manufacture, ship and deliver the tools or software as expected. Please also refer to our Form 10-K, Forms 10-Q, Forms 8-K and other filings with the U.S. Securities and Exchange Commission for additional information on these factors and other factors that could cause actual results to differ materially from the forward-looking statements. FEI assumes no duty to update forward-looking statements.

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Contacts:
Sandy Fewkes
(media contact)
MindWrite Communications, Inc.
+1 408 224 4024


FEI Company
Fletcher Chamberlin
(investors and analysts)
Investor Relations
+1 503 726 7710

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