Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Top quality Cu diffusion barriers from Picosun in the ENIAC JU project ESiP

Abstract:
Picosun Oy, leading Atomic Layer Deposition (ALD) equipment manufacturer, reports excellent process results for copper diffusion barrier deposition. ALD materials for copper diffusion barriers were investigated in the project ESiP (Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test), running from May 2010 to June 2013.

Top quality Cu diffusion barriers from Picosun in the ENIAC JU project ESiP

Espoo, Finland | Posted on June 10th, 2013

In ESiP, Picosun worked in close collaboration especially with VTT Technical Research Centre of Finland, developing processes for copper diffusion barriers for Through-Silicon-Via (TSV) structures. Several different barrier materials were investigated and evaluated, e.g. tantalum oxide (Ta2O5), titanium nitride (TiN), titanium-aluminium carbonitride (TiAlCN), ruthenium (Ru), and tantalum nitride (TaN). Based on the studies made at VTT, TaN proved to be the best option for diffusion barrier application. With the results of the ESiP project Picosun's leading ALD reactor design ensures that the TaN process can now run safely and be introduced to industrial manufacturing. The TaN films deposited in the PICOSUN™ ALD tool showed high uniformity and conformality. The process is also cost-efficient because of the low price of the precursors.

"We are proud to take part in a project such as ESiP - the project addresses directly the challenges in European electronics and IC industry today and collects together the finest expertise in the field. ALD process development is in central role in our position as the leading provider of ALD solutions. The now optimized, efficient, safe, and cost-effective TaN process for copper diffusion barriers enables integration of Picosun ALD technology in the next generation TSV manufacturing," states Juhana Kostamo, Managing Director of Picosun.

The project ESiP was funded by ENIAC Joint Undertaking* and Tekes - The Finnish Funding Agency for Technology and Innovation. With its 41 partners, bringing together the biggest actors in micro- and nanoelectronics from nine EU countries, the project is the largest international R&D consortium Picosun has participated in this far.

The goal of the project ESiP, which was managed by Infineon Technologies, was to secure Europe's competitiveness on the global micro- and nanoelectronics market. One of the technological solutions for this can be found from the "More than Moore" approach. This approach pushes innovation not only by downscaling the individual electronic component size, but also by developing novel solutions for high density silicon multi-chip packaging, package stacking methods, and failure and reliability testing of the new devices - the core target of the project ESiP. This "System-in-Package" (SiP) technology allows realization of highly sophisticated, highly integrated, and highly miniaturized multifunctional micro- and nanoelectronic devices. Application areas for these novel devices can be found e.g. from the sensor, communication, automotive and healthcare industries.

TSV structures are a central part of upcoming and future SiP devices. The active layers stacked on top of each other often need to be connected and this is realized with TSV trenches the insides of which are coated with conducting material such as copper. Diffusion barriers are needed to prevent copper diffusion into underlying semiconductor material which could render the whole device nonfunctional.

*The ENIAC Joint Undertaking (JU) is a European, public-private partnership focusing on nanoelectronics that brings together ENIAC Member/Associated States, the European Commission, and AENEAS (an association representing European R&D actors in this field). www.eniac.eu/web/index.php

####

About Picosun Oy
Picosun Oy is a Finland-based, globally operating manufacturer of state-of-the-art ALD systems, representing continuity to almost four decades of pioneering, exclusive and groundbreaking ALD reactor design and manufacturing. Today, PICOSUN™ ALD systems are in daily production use in numerous prominent industries across the globe.

For more information, please click here

Contacts:
Juhana Kostamo
Phone: +358 50 321 1955
Fax: +358 9 297 6116

Copyright © Picosun Oy

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Automating DNA origami opens door to many new uses: Like 3-D printing did for larger objects, method makes it easy to build nanoparticles out of DNA May 30th, 2016

Simple attraction: Researchers control protein release from nanoparticles without encapsulation: U of T Engineering discovery stands to improve reliability and fabrication process for treatments to conditions such as spinal cord damage and stroke May 28th, 2016

Scientists illuminate a hidden regulator in gene transcription: New super-resolution technique visualizes important role of short-lived enzyme clusters May 27th, 2016

Doubling down on Schrödinger's cat May 27th, 2016

Govt.-Legislation/Regulation/Funding/Policy

Scientists illuminate a hidden regulator in gene transcription: New super-resolution technique visualizes important role of short-lived enzyme clusters May 27th, 2016

Doubling down on Schrödinger's cat May 27th, 2016

Harnessing solar and wind energy in one device could power the 'Internet of Things' May 26th, 2016

Thermal modification of wood and a complex study of its properties by magnetic resonance May 26th, 2016

Chip Technology

Gigantic ultrafast spin currents: Scientists from TU Wien (Vienna) are proposing a new method for creating extremely strong spin currents. They are essential for spintronics, a technology that could replace today's electronics May 25th, 2016

Diamonds closer to becoming ideal semiconductors: Researchers find new method for doping single crystals of diamond May 25th, 2016

Dartmouth team creates new method to control quantum systems May 24th, 2016

Attosecond physics: A switch for light-wave electronics May 24th, 2016

Announcements

Automating DNA origami opens door to many new uses: Like 3-D printing did for larger objects, method makes it easy to build nanoparticles out of DNA May 30th, 2016

Simple attraction: Researchers control protein release from nanoparticles without encapsulation: U of T Engineering discovery stands to improve reliability and fabrication process for treatments to conditions such as spinal cord damage and stroke May 28th, 2016

Scientists illuminate a hidden regulator in gene transcription: New super-resolution technique visualizes important role of short-lived enzyme clusters May 27th, 2016

Doubling down on Schrödinger's cat May 27th, 2016

Tools

Scientists illuminate a hidden regulator in gene transcription: New super-resolution technique visualizes important role of short-lived enzyme clusters May 27th, 2016

Light can 'heal' defects in new solar cell materials: Defects in some new electronic materials can be removed by making ions move under illumination May 24th, 2016

More light on cancer: Scientists created nanoparticles to highlight cancer cells May 21st, 2016

Nanotubes are beacons in cancer-imaging technique: Rice University researchers use spectral triangulation to pinpoint location of tumors May 21st, 2016

Alliances/Trade associations/Partnerships/Distributorships

The CEA Announces Expanded Collaboration with Intel to Advance Cutting-edge Research and Innovation in Key Digital Areas May 17th, 2016

Solliance realizes first up-scaled Perovskite based PV modules with 10% efficiency: Holst Centre, imec and ECN pave the road to upscaling Perovskite PV modules May 10th, 2016

Industrial Nanotech, Inc. Expands Distribution Network in US and Internationally May 9th, 2016

Albertan Science Lab Opens in India May 7th, 2016

Research partnerships

Finding a new formula for concrete: Researchers look to bones and shells as blueprints for stronger, more durable concrete May 26th, 2016

The next generation of carbon monoxide nanosensors May 26th, 2016

Revealing the nature of magnetic interactions in manganese oxide: New technique for probing local magnetic interactions confirms 'superexchange' model that explains how the material gets its long-range magnetic order May 25th, 2016

Light can 'heal' defects in new solar cell materials: Defects in some new electronic materials can be removed by making ions move under illumination May 24th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic