Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Top quality Cu diffusion barriers from Picosun in the ENIAC JU project ESiP

Abstract:
Picosun Oy, leading Atomic Layer Deposition (ALD) equipment manufacturer, reports excellent process results for copper diffusion barrier deposition. ALD materials for copper diffusion barriers were investigated in the project ESiP (Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test), running from May 2010 to June 2013.

Top quality Cu diffusion barriers from Picosun in the ENIAC JU project ESiP

Espoo, Finland | Posted on June 10th, 2013

In ESiP, Picosun worked in close collaboration especially with VTT Technical Research Centre of Finland, developing processes for copper diffusion barriers for Through-Silicon-Via (TSV) structures. Several different barrier materials were investigated and evaluated, e.g. tantalum oxide (Ta2O5), titanium nitride (TiN), titanium-aluminium carbonitride (TiAlCN), ruthenium (Ru), and tantalum nitride (TaN). Based on the studies made at VTT, TaN proved to be the best option for diffusion barrier application. With the results of the ESiP project Picosun's leading ALD reactor design ensures that the TaN process can now run safely and be introduced to industrial manufacturing. The TaN films deposited in the PICOSUN™ ALD tool showed high uniformity and conformality. The process is also cost-efficient because of the low price of the precursors.

"We are proud to take part in a project such as ESiP - the project addresses directly the challenges in European electronics and IC industry today and collects together the finest expertise in the field. ALD process development is in central role in our position as the leading provider of ALD solutions. The now optimized, efficient, safe, and cost-effective TaN process for copper diffusion barriers enables integration of Picosun ALD technology in the next generation TSV manufacturing," states Juhana Kostamo, Managing Director of Picosun.

The project ESiP was funded by ENIAC Joint Undertaking* and Tekes - The Finnish Funding Agency for Technology and Innovation. With its 41 partners, bringing together the biggest actors in micro- and nanoelectronics from nine EU countries, the project is the largest international R&D consortium Picosun has participated in this far.

The goal of the project ESiP, which was managed by Infineon Technologies, was to secure Europe's competitiveness on the global micro- and nanoelectronics market. One of the technological solutions for this can be found from the "More than Moore" approach. This approach pushes innovation not only by downscaling the individual electronic component size, but also by developing novel solutions for high density silicon multi-chip packaging, package stacking methods, and failure and reliability testing of the new devices - the core target of the project ESiP. This "System-in-Package" (SiP) technology allows realization of highly sophisticated, highly integrated, and highly miniaturized multifunctional micro- and nanoelectronic devices. Application areas for these novel devices can be found e.g. from the sensor, communication, automotive and healthcare industries.

TSV structures are a central part of upcoming and future SiP devices. The active layers stacked on top of each other often need to be connected and this is realized with TSV trenches the insides of which are coated with conducting material such as copper. Diffusion barriers are needed to prevent copper diffusion into underlying semiconductor material which could render the whole device nonfunctional.

*The ENIAC Joint Undertaking (JU) is a European, public-private partnership focusing on nanoelectronics that brings together ENIAC Member/Associated States, the European Commission, and AENEAS (an association representing European R&D actors in this field). www.eniac.eu/web/index.php

####

About Picosun Oy
Picosun Oy is a Finland-based, globally operating manufacturer of state-of-the-art ALD systems, representing continuity to almost four decades of pioneering, exclusive and groundbreaking ALD reactor design and manufacturing. Today, PICOSUN™ ALD systems are in daily production use in numerous prominent industries across the globe.

For more information, please click here

Contacts:
Juhana Kostamo
Phone: +358 50 321 1955
Fax: +358 9 297 6116

Copyright © Picosun Oy

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Fast, efficient sperm tails inspire nanobiotechnology December 5th, 2016

Journal Nanotechnology Progress International (JONPI) Volume 6, issue 2 coming out soon! December 5th, 2016

Infrared instrumentation leader secures exclusive use of Vantablack coating December 5th, 2016

Construction of practical quantum computers radically simplified: Scientists invent ground-breaking new method that puts quantum computers within reach December 5th, 2016

Govt.-Legislation/Regulation/Funding/Policy

Construction of practical quantum computers radically simplified: Scientists invent ground-breaking new method that puts quantum computers within reach December 5th, 2016

Shape matters when light meets atom: Mapping the interaction of a single atom with a single photon may inform design of quantum devices December 4th, 2016

Research Study: MetaSOLTM Shatters Solar Panel Efficiency Forecasts with Innovative New Coating: Coating Provides 1.2 Percent Absolute Enhancement to Triple Junction Solar Cells December 2nd, 2016

Deep insights from surface reactions: Researchers use Stampede supercomputer to study new chemical sensing methods, desalination and bacterial energy production December 2nd, 2016

Chip Technology

Construction of practical quantum computers radically simplified: Scientists invent ground-breaking new method that puts quantum computers within reach December 5th, 2016

Shape matters when light meets atom: Mapping the interaction of a single atom with a single photon may inform design of quantum devices December 4th, 2016

Quantum obstacle course changes material from superconductor to insulator December 1st, 2016

Bumpy surfaces, graphene beat the heat in devices: Rice University theory shows way to enhance heat sinks in future microelectronics November 29th, 2016

Announcements

Fast, efficient sperm tails inspire nanobiotechnology December 5th, 2016

Journal Nanotechnology Progress International (JONPI) Volume 6, issue 2 coming out soon! December 5th, 2016

Infrared instrumentation leader secures exclusive use of Vantablack coating December 5th, 2016

Construction of practical quantum computers radically simplified: Scientists invent ground-breaking new method that puts quantum computers within reach December 5th, 2016

Tools

Deep insights from surface reactions: Researchers use Stampede supercomputer to study new chemical sensing methods, desalination and bacterial energy production December 2nd, 2016

Controlled electron pulses November 30th, 2016

Scientists shrink electron gun to matchbox size: Terahertz technology has the potential to enable new applications November 25th, 2016

News from Quorum: The Agricultural Research Service of the USDA uses a Quorum Cryo-SEM preparation system for the study of mites, ticks and other soft bodied organisms November 22nd, 2016

Alliances/Trade associations/Partnerships/Distributorships

Infrared instrumentation leader secures exclusive use of Vantablack coating December 5th, 2016

Leti and Grenoble Partners Demonstrate World’s 1st Qubit Device Fabricated in CMOS Process: Paper by Leti, Inac and University of Grenoble Alpes Published in Nature Communications November 28th, 2016

Mechanism for sodium storage in 2-D material: Tin selenide is an effective host for storing sodium ions, making it a promising material for sodium ion batteries October 27th, 2016

Enterprise In Space Partners with Sketchfab and 3D Hubs for NewSpace Education October 13th, 2016

Research partnerships

Deep insights from surface reactions: Researchers use Stampede supercomputer to study new chemical sensing methods, desalination and bacterial energy production December 2nd, 2016

Quantum obstacle course changes material from superconductor to insulator December 1st, 2016

Novel silicon etching technique crafts 3-D gradient refractive index micro-optics November 28th, 2016

Single photon converter -- a key component of quantum internet November 28th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project