Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes

Abstract:
CEA-Leti said today that Europe is strongly positioned to design and manufacture volume silicon photonics devices because of the success of the recently completed HELIOS program. The €8.5 million European Commission project developed a complete design and fabrication supply chain for integrating a photonic layer with a CMOS circuit, using microelectronics fabrication processes.

HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes

Grenoble, France | Posted on May 14th, 2013

HELIOS, which was coordinated by Leti, also demonstrated a complete design flow, integrating both silicon photonics device design and electronic/photonic system design in an EDA-compatible framework (see www.helios-project.eu)

"It is strategically important for Europe to maintain photonic chip-design and chip-integrating functions to compete with other countries and to encourage innovation by European microelectronics companies," said Leti CEO Laurent Malier. "HELIOS's success in creating the essential building blocks for integrating photonics with CMOS circuits and making the process available to a variety of users underscores the key role that broad European technological cooperation plays in a very competitive global business environment."

Thomas Skordas, head of the EC's photonics unit, said HELIOS has shown the large potential silicon photonics has in many different applications, such as data communications.

"The technology roadmap of silicon photonics becomes clearer now. Europe will have to move fast to become competitive in this new field," Skordas said. "Strategies for the industrialisation of silicon photonics are currently being discussed in the context of Horizon 2020, the EU's new framework program for research and innovation for 2014-2020."

Silicon photonics is seen as key to developing optical telecommunications or for optical interconnects in microelectronic circuits, because of the cost advantages of integrating photonic and electronic functions on the same chip. CMOS photonics may lead to low-cost solutions for a range of applications such as optical communications, optical interconnections between semiconductor chips and circuit boards, optical signal processing, optical sensing, and biological applications.

Launched by the European Commission in 2008, HELIOS focused on developing essential building blocks like efficient optical sources (silicon-based and heterogeneous integration of III-V on silicon), integrated lasers, high-speed modulators and photo-detectors. The project, which had 20 members, also combined and packaged these building blocks to demonstrate complex functions that address a variety of industrial needs.

These include a 10Gb/s modulator integrated with an electronic BiCMOS driver, a 16x10 Gb/s transceiver for WDM-PON applications, a photonic QAM-10Gb/s wireless transmission system and a mixed analog-and-digital transceiver module for multi-function antennas.

The building blocks also led to results exceeding the original specifications, positioning the partners at the leading edge in their fields:

· High-performance passive devices were obtained and introduced in the demonstrators (rib/strip waveguides transitions with less than 0.2dB losses, grating couplers with 1.6dB losses, inverted taper couplers with 1dB losses, AWG and micro-ring based de-multiplexers).

· The wafer-level integration of laser by III-V/Si bonding led to the demonstration of single-mode operation with 3dBm output power, 30dB SMSR, Ith < 35mA in CW.

· 40G carrier depletion Si modulators were demonstrated in MZI, Ring, slow wave, interdigitated modulators configuration.

· An integrated tunable laser-Mach-Zehnder modulator working at 10Gb/s.

The work of the HELIOS consortium led to more than 170 publications and communications in peer-review journals and international conferences. Detailed information is available on www.helios-project.eu

HELIOS program members:

- CEA-Leti, coordinator (France)

- IMEC (Belgium)

- CNRS (France)

- Alcatel Thales III-V lab (France)

- University of Surrey (UK)

- IMM (Italy)

- University of Paris-Sud (France)

- University of Valencia (Spain)

- University of Trento (Italy)

- University of Barcelona (Spain)

- 3S Photonics (France)

- IHP (Germany)

- University of Berlin (Germany)

- Thales (France)

- DAS Photonics (Spain)

- ams AG (Austria)

- University of Vienna (Austria)

- Phoenix BV (Netherlands)

- Photline Technologies (France)

- University of Southampton (UK)

####

About CEA-Leti
Leti is an institute of CEA, a French research-and-technology organization with activities in energy, IT, healthcare, defence and security. Leti is focused on creating value and innovation through technology transfer to its industrial partners. It specializes in nanotechnologies and their applications, from wireless devices and systems, to biology, healthcare and photonics. NEMS and MEMS are at the core of its activities. An anchor of the MINATEC campus, CEA-Leti operates 8,000-m˛ of state-of-the-art clean room space on 200mm and 300mm wafer platforms. It employs 1,700 scientists and engineers including 320 Ph.D. students and 200 assignees from partner companies. CEA-Leti owns more than 2,200 patent families.

For more information, please click here

Contacts:
CEA-Leti
+33 4 38 78 02.26


Agency
+33 1 70 29 08 59

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

A toolkit for transformable materials: How to design materials with reprogrammable shape and function January 20th, 2017

Explaining how 2-D materials break at the atomic level January 20th, 2017

New research helps to meet the challenges of nanotechnology: Research helps to make the most of nanoscale catalytic effects for nanotechnology January 20th, 2017

Ultra-precise chip-scale sensor detects unprecedentedly small changes at the nanoscale January 20th, 2017

Govt.-Legislation/Regulation/Funding/Policy

A toolkit for transformable materials: How to design materials with reprogrammable shape and function January 20th, 2017

'5-D protein fingerprinting' could give insights into Alzheimer's, Parkinson's January 19th, 2017

Strength of hair inspires new materials for body armor January 18th, 2017

Self-assembling particles brighten future of LED lighting January 18th, 2017

Chip Technology

Explaining how 2-D materials break at the atomic level January 20th, 2017

New research helps to meet the challenges of nanotechnology: Research helps to make the most of nanoscale catalytic effects for nanotechnology January 20th, 2017

Ultra-precise chip-scale sensor detects unprecedentedly small changes at the nanoscale January 20th, 2017

Nanometrics to Announce Fourth Quarter and Full Year Financial Results on February 7, 2017 January 19th, 2017

Sensors

New research helps to meet the challenges of nanotechnology: Research helps to make the most of nanoscale catalytic effects for nanotechnology January 20th, 2017

Ultra-precise chip-scale sensor detects unprecedentedly small changes at the nanoscale January 20th, 2017

Chemists Cook up New Nanomaterial and Imaging Method: Nanomaterials can store all kinds of things, including energy, drugs and other cargo January 19th, 2017

Nanoscale Modifications can be used to Engineer Electrical Contacts for Nanodevices January 13th, 2017

Announcements

A toolkit for transformable materials: How to design materials with reprogrammable shape and function January 20th, 2017

New research helps to meet the challenges of nanotechnology: Research helps to make the most of nanoscale catalytic effects for nanotechnology January 20th, 2017

Ultra-precise chip-scale sensor detects unprecedentedly small changes at the nanoscale January 20th, 2017

Chemists Cook up New Nanomaterial and Imaging Method: Nanomaterials can store all kinds of things, including energy, drugs and other cargo January 19th, 2017

Patents/IP/Tech Transfer/Licensing

Keystone Nano Announces The US FDA Has Awarded Orphan Drug Designation For Ceramides For The Treatment Of Liver Cancer November 8th, 2016

Leti to Tackle Tomorrow's Research Strategies with Stanford University’s SystemX Alliance: French R&D Center Is the First Research Institute to Join the Collaboration and Provides Bridges Between Academia and Industry, Leveraging Alliance’s Potential October 4th, 2016

Picosun patents ALD nanolaminate to prevent electronics from overheating September 28th, 2016

NIST Patents Single-Photon Detector for Potential Encryption and Sensing Apps September 16th, 2016

Industrial

Chemists Cook up New Nanomaterial and Imaging Method: Nanomaterials can store all kinds of things, including energy, drugs and other cargo January 19th, 2017

New laser based on unusual physics phenomenon could improve telecommunications, computing January 12th, 2017

Supersonic spray yields new nanomaterial for bendable, wearable electronics: Film of self-fused nanowires clear as glass, conducts like metal November 23rd, 2016

Industrial Nanotech, Inc. Announces Plans to Spin Off New Product Line to Major Paint Compan November 9th, 2016

Photonics/Optics/Lasers

Recreating conditions inside stars with compact lasers: Scientists offer a new path to creating the extreme conditions found in stars, using ultra-short laser pulses irradiating nanowires January 12th, 2017

New laser based on unusual physics phenomenon could improve telecommunications, computing January 12th, 2017

Researcher's discovery of new crystal structure holds promise for optoelectronic devices January 6th, 2017

The researchers created a tiny laser using nanoparticles January 5th, 2017

Alliances/Trade associations/Partnerships/Distributorships

GLOBALFOUNDRIES Expands Partner Program to Speed Time-to-Market of FDX™ Solutions: Increased support affirms FDXcelerator™ Program’s vital role in promoting broader deployment of GLOBALFOUNDRIES’ FDX™ portfolio December 15th, 2016

Infrared instrumentation leader secures exclusive use of Vantablack coating December 5th, 2016

Leti and Grenoble Partners Demonstrate World’s 1st Qubit Device Fabricated in CMOS Process: Paper by Leti, Inac and University of Grenoble Alpes Published in Nature Communications November 28th, 2016

Mechanism for sodium storage in 2-D material: Tin selenide is an effective host for storing sodium ions, making it a promising material for sodium ion batteries October 27th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project