Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Poongsan Partners with SEMATECH to Develop High Pressure Anneal Processes for Advanced Silicon and Non-Silicon Devices: Joint effort to explore novel process techniques to improve device performance and reliability in semiconductor manufacturing for sub 20 nm technology node

Abstract:
SEMATECH today announced that Poongsan, a leading producer of annealing furnaces, has joined its Front End Processes (FEP) program, and will work with SEMATECH to explore high-pressure anneal (HPA) techniques for silicon and non-silicon channel materials to improve device performance and reliability for next-generation technologies.

Poongsan Partners with SEMATECH to Develop High Pressure Anneal Processes for Advanced Silicon and Non-Silicon Devices: Joint effort to explore novel process techniques to improve device performance and reliability in semiconductor manufacturing for sub 20 nm technology node

Albany, NY | Posted on February 21st, 2013

Today, the solid-state device community is investigating non-silicon, high-mobility materials to increase carrier mobility within the device channels and improve overall transistor performance. High-mobility channels such as germanium and III-V compounds have the potential to operate at high speeds with low operating power and may be used in mainstream semiconductor CMOS technologies in the future. However, numerous manufacturing challenges associated with high-mobility channels such as processes, tools, device test structures and environment, safety, and health issues need to be addressed before these materials-based solutions are brought to manufacturing.
Since 2006, Poongsan and SEMATECH have partnered in tool and process development projects that have successfully demonstrated the technical merits of a high pressure annealing furnace.
"Working with SEMATECH, we have demonstrated that high-pressure anneals are both effective and manufacturing-worthy approaches to high-k/Si interface defect passivation. From this work, we have gone on to develop and ship production-worthy annealing furnace tools to world-wide customers," said Dr. Bob Wu, director of sales and marketing of Poongsan. "We look forward to continuing our strategic partnership with SEMATECH as we work toward developing emerging technologies and improving products."
As a member of SEMATECH's FEP program, located at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, Poongsan will collaborate with SEMATECH's engineers and leverage SEMATECH's activities in advanced test structures, advanced materials and device electrical characterization to improve processing technologies to increase mobility and reduce interfacial defects. Specifically, SEMATECH and Poongsan will collaborate on passivation of silicon and non-silicon gate stacks and other interfaces.
"To achieve better device performance and help shape the next generations of nanoelectronics, it's necessary to partner to share know-how in materials, processing, equipment development and device technologies," said Paul Kirsch, SEMATECH's director of Front End Processes. "Poongsan's proven expertise in high-pressure annealing processes will complement our own device and process expertise. We will work together on the technical and manufacturing gaps to address the continued scaling needs of today's aggressive chip manufacturing market."
The goal of SEMATECH's FEP program is to provide novel leading-edge materials, processes, structural modules and electrical and physical characterization methods to support the continued scaling of logic and memory applications.

####

About SEMATECH
For over 25 years, SEMATECH®, the international consortium of leading semiconductor device, equipment, and materials manufacturers, in accelerating the commercialization of technology innovations into manufacturing solutions. Through our unwavering commitment to foster collaboration across the nanoelectronics industry, we help our members and partners address critical industry transitions, drive technical consensus, pull research into the industry mainstream, improve manufacturing productivity, and reduce risk and time to market.

About Poongsan

Poongsan has been a leading company for 45 years in non-ferrous metals and defense industry in Korea. Poongsan product lines include a broad spectrum of copper and copper alloy products such as sheets, strips, pipes, tubes, rods, bars, wires, precision forging products, and ammunition for military and sporting use. Additionally, Poongsan enjoys the distinction of being the world's number one supplier of coin blanks with governments around the world entrusting the company to provide the highest quality coin blanks used in minting their coins.

Semiconductor Equipment Business Division of Poongsan has been a pioneer in developing high-pressure annealing process (HPAP) and tool. This unique HPAP technology enables IC device manufactures to achieve greater electron mobility, reduced interfacial defects, and better transistor tuning abilities to meet 28 nm and 20 nm beyond technology requirements. Additional information about Poongsan’s HPAP system can be found at www.poongsan.co.kr/eng/products/high-pressure-annealing-process-system.

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
Phone: 518-649-1041
Twitter: www.twitter.com/sematech

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Roll up your screen and stow it away? Tel Aviv University researchers develop molecular backbone of super-slim, bendable digital displays March 30th, 2015

Princess Margaret scientists convert microbubbles to nanoparticles: Harnessing light to advance tumor imaging, provide platform for targeted treatment March 30th, 2015

Wrapping carbon nanotubes in polymers enhances their performance: Scientists at Japan's Kyushu University say polymer-wrapped carbon nanotubes hold much promise in biotechnology and energy applications March 30th, 2015

Tokyo Institute of Technology research: Catalyst redefines rate limitations in ammonia production March 30th, 2015

Chip Technology

Next important step toward quantum computer: Scientists at the University of Bonn have succeeded in linking 2 different quantum systems March 30th, 2015

State-of-the-art online system unveiled to pinpoint metrology software accuracy March 27th, 2015

SUNY POLY CNSE to Host First Ever Northeast Semi Supply Conference (NESCO) Conference Will Connect New and Emerging Innovators in the Northeastern US and Canada with Industry Leaders and Strategic Investors to Discuss Future Growth Opportunities in NYS March 25th, 2015

NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015

Announcements

Princess Margaret scientists convert microbubbles to nanoparticles: Harnessing light to advance tumor imaging, provide platform for targeted treatment March 30th, 2015

Wrapping carbon nanotubes in polymers enhances their performance: Scientists at Japan's Kyushu University say polymer-wrapped carbon nanotubes hold much promise in biotechnology and energy applications March 30th, 2015

Tokyo Institute of Technology research: Catalyst redefines rate limitations in ammonia production March 30th, 2015

Next important step toward quantum computer: Scientists at the University of Bonn have succeeded in linking 2 different quantum systems March 30th, 2015

Tools

'Atomic chicken-wire' is key to faster DNA sequencing March 30th, 2015

LAMDAMAP 2015 hosted by the University March 26th, 2015

FEI Technology Award of the German Neuroscience Society Goes to Benjamin Judkewitz of the University of Berlin: Bi-annual award honors excellence in brain research during the German Neuroscience Society’s Annual Meeting, held 18-21 March 2015 March 26th, 2015

Square ice filling for a graphene sandwich March 26th, 2015

Alliances/Partnerships/Distributorships

NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015

Young NTU Singapore spin-off clinches S$4.3 million joint venture with Chinese commercial giant March 23rd, 2015

Halas, Nordlander awarded Optical Society's R.W. Wood Prize: Rice University researchers recognized for pioneering nanophotonics March 21st, 2015

EU Funded PCATDES Project has completed its half-period with success March 19th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE