Nanotechnology Now - Press Release: Leti and Agilent to Present Results on Millimeter-Wave Short-Range Communication Integrated Systems Jan. 23 at IEEE SiRF Conference

Home > Press > Leti and Agilent to Present Results on Millimeter-Wave Short-Range Communication Integrated Systems Jan. 23 at IEEE SiRF Conference

Abstract:
CEA-Leti and Agilent Technologies will present their recent research results in the field of embedded integrated systems at the IEEE Silicon Monolithic Integrated Circuits in RF Systems (SiRF) Conference in Austin, Texas, Jan. 21-23.

Leti and Agilent to Present Results on Millimeter-Wave Short-Range Communication Integrated Systems Jan. 23 at IEEE SiRF Conference

Grenoble, France | Posted on January 19th, 2013

The achievement, a low-power monolithic millimeter-wave short-range and high-data-rate communication system, was made possible thanks to the CEA-Leti's 10 years of experience in ultra-wideband (UWB) and high-frequency links. To be converted into a functional and market-ready integrated system, this original communication technology also requires specific design methodologies. Leti's solution, which supposes efficient analysis of closely related active, passive and radiation phenomena, was developed with Agilent's coherent design flow.

"With on-chip high-gain integrated antennas, a real co-design between the receiver/transmitter circuits and the antennas is necessary for a global optimization of the system's performances," said Leti researcher Laurent Dussopt.

"Finding the best trade-off between transmission range and battery life is critical in low-power applications. Since Agilent's Advanced Design System (ADS) and EMPro share the same database, a seamless co-design between circuit simulations and the full 3D finite element method provides an advantage over classical methods to determine the optimum operating conditions," said Marc Petersen, product manager, EM & Electro-Thermal Solutions at Agilent.

Leti developed a packaged 60GHz low-power transceiver, with integrated antennas on high-resistive CMOS SOI 65nm process from STMicroelectronics, for short-range communication. The transceiver uses an on-off keying UWB pulse modulation and delivers 2.2Gbit/s with less than 100mW in the range of 10cm. This component, which has potential use in hand-held multimedia applications, will be presented at the Leti-Agilent session on Jan. 23, during the IEEE SiRF conference.

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About CEA-Leti
Leti is an institute of CEA, a French research-and-technology organization with activities in energy, IT, healthcare, defence and security. Leti is focused on creating value and innovation through technology transfer to its industrial partners. It specializes in nanotechnologies and their applications, from wireless devices and systems, to biology, healthcare and photonics. NEMS and MEMS are at the core of its activities. An anchor of the MINATEC campus, CEA-Leti operates 8,000-m² of state-of-the-art clean room space on 200mm and 300mm wafer platforms. It employs 1,700 scientists and engineers including 240 Ph.D. students and 200 assignees from partner companies. CEA-Leti owns more than 1,880 patent families.

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Contacts:
CEA-Leti:
+33 4 38 78 31 95

Agency:
+33 1 70 29 08 59

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