Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > sp3 Diamond Technologies Awarded New Patents for Thermal Management in Semiconductor and Laser Applications

Abstract:
sp3 Diamond Technologies, Inc., a leading supplier of diamond products, deposition equipment and services, today announced that it has been awarded two patents by the United States Patent and Trademark Office for its DiaMatch™ coefficient of thermal expansion (CTE) matched heat spreader technology. The diamond-based multilayered structure outlined in the patents solves several technical challenges to deliver the high heat spreading and CTE matching required for reliable semiconductor and laser packaging.

sp3 Diamond Technologies Awarded New Patents for Thermal Management in Semiconductor and Laser Applications

Santa Clara, CA | Posted on September 25th, 2012

"In 2007, we received Phase II SBIR funding from the Missile Defense Agency to develop a thermal management solution that enables the next generation of high power lasers and semiconductors. We had established solid IP in this area and began providing solutions with great potential that target current and future high-power semiconductor and laser applications," stated Dwain Aidala, president and COO of sp3 Diamond Technologies. "We are currently in the process of identifying the right thermal management or specialized material partners to further develop this technology into a fully productized offering."

U.S. Patent Nos. 8,105,693 and 8,147,927 cover a multilayered structure including at least one diamond layer and methods of making these multilayered structures, respectively. The technology detailed in the patents is ideally suited for mounting large semiconductor chips such as high-power transistors and laser diodes where CTE matching is required.

The proliferation of diamond use in technology has seen a dramatic increase in recent years. Formed in 1993, sp3 Diamond Technologies has been a driving force in that commercialization.

"We experienced our best year ever in 2011 due in large part to two markets," continued Aidala. "We saw our diamond heat spreaders adopted in multiple applications, most notably in wireless base stations where the thermal properties of diamond are paying huge dividends. In CMP pad conditioning we sold five times more CVD diamond deposition tools than the previous year. Diamond is being adopted. While our CVD diamond equipment and our heat spreaders remain our primary focus, we see tremendous opportunity for diamond applications in the future. The potential for diamond layers in the SOI-based process alone creates fantastic growth opportunities."

####

About sp3 Diamond Technologies, Inc.
sp3 Diamond Technologies provides CVD hot filament diamond deposition reactors and diamond-based solutions for electronics thermal management and enhanced wear and cutting surfaces to companies worldwide, across a broad spectrum of industries. By supplying wafer-scale diamond-on-substrate products and services utilizing nano and microcrystalline diamond morphology, sp3 is expanding the commercial reach of polycrystalline CVD diamond.

Founded in 1993 and headquartered in Santa Clara, California, USA, sp3 Diamond Technologies is a subsidiary of sp3 Inc., a privately owned, full service provider of products and services relating to thin film and freestanding diamond deposition and other diamond materials. sp3 Diamond Technologies provides diamond products for advanced thermal applications, diamond coating and material services, hot filament CVD reactors, and deposition consulting services.

About sp3’s DiaMatch Multilayered CTE-Matched Diamond

Semiconductor devices require packaging with high thermal conductivity to prevent overheating and to maintain useful operation of the device. Existing materials generally deliver good thermal characteristics but poor CTE matching, or are well-matched to most semiconductor materials, but do not offer high enough thermal conductivity for today’s devices. sp3’s DiaMatch technology bridges this gap by offering variable CTE-matching, copper-level thermal conductivity, a choice of conductive or insulating die attach surfaces, precise edges and no compositional variability from point to point in the material.

The new patents detail a multilayered structure of thin diamond layers and high thermal conductivity metal layers and the methods of making the structure. The multilayered structure has a variable CTE, which depends on the various layer thicknesses and can be different on each side. This allows the structure to safely bond to common semiconductor materials such as silicon, silicon carbide, gallium arsenide, and gallium nitride while providing the thermal management benefits of diamond.

For more information, please click here

Contacts:
Headquarters:
sp3 Diamond Technologies
1605 Wyatt Drive
Santa Clara, CA 95054
Tel: +1-877-773-9940
Tel: +1-408-492-0630
Fax: +1-408-492-0633

Copyright © sp3 Diamond Technologies, Inc.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Scientific breakthrough in rechargeable batteries: Researchers from Singapore and Québec Team Up to Develop Next-Generation Materials to Power Electronic Devices and Electric Vehicles February 28th, 2015

First detailed microscopy evidence of bacteria at the lower size limit of life: Berkeley Lab research provides comprehensive description of ultra-small bacteria February 28th, 2015

Leti to Offer Updates on Silicon Photonics Successes at OFC in LA February 27th, 2015

Moving molecule writes letters: Caging of molecules allows investigation of equilibrium thermodynamics February 27th, 2015

Chip Technology

New nanowire structure absorbs light efficiently: Dual-type nanowire arrays can be used in applications such as LEDs and solar cells February 25th, 2015

SUNY Poly CNSE Researchers and Corporate Partners to Present Forty Papers at Globally Recognized Lithography Conference: SUNY Poly CNSE Research Group Awarded Both ‘Best Research Paper’ and ‘Best Research Poster’ at SPIE Advanced Lithography 2015 forum February 25th, 2015

Ultra-thin nanowires can trap electron 'twisters' that disrupt superconductors February 24th, 2015

Silicon Catalyst Announces Partnership With imec to Support Semiconductor Start-Ups February 23rd, 2015

Announcements

Scientific breakthrough in rechargeable batteries: Researchers from Singapore and Québec Team Up to Develop Next-Generation Materials to Power Electronic Devices and Electric Vehicles February 28th, 2015

First detailed microscopy evidence of bacteria at the lower size limit of life: Berkeley Lab research provides comprehensive description of ultra-small bacteria February 28th, 2015

Leti to Offer Updates on Silicon Photonics Successes at OFC in LA February 27th, 2015

Moving molecule writes letters: Caging of molecules allows investigation of equilibrium thermodynamics February 27th, 2015

Tools

Hiden CATLAB Microreactor System at ARABLAB 2015 | Visit us on Booth 1011 February 26th, 2015

Renishaw and Bruker team up for a workshop on TERS and co-localised AFM Raman February 26th, 2015

Maximum Precision in 3D Printing: New complete solution makes additive manufacturing standard for microfabrication February 26th, 2015

Real-time observation of bond formation by using femtosecond X-ray liquidography February 26th, 2015

Patents/IP/Tech Transfer/Licensing

New Paper-like Material Could Boost Electric Vehicle Batteries: Researchers create silicon nanofibers 100 times thinner than human hair for potential applications in batteries for electric cars and personal electronics February 20th, 2015

Nanotech Discoveries Move from Lab to Marketplace with Lintec Deal: Licensing Partnership Brings Together University Technology, New Richardson-Based Facility Directed by Alumni February 9th, 2015

Graphenea granted patent on graphene transfer February 9th, 2015

Toronto-based Environmental Technology Pioneer Green Earth Nano Science Expands in EU February 6th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE