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Home > Press > Toward a better material for hip replacement and other joint implants

Toward a better material for hip replacement and other joint implants
Credit: Photodisc/Thinkstock
Toward a better material for hip replacement and other joint implants

Credit: Photodisc/Thinkstock

Abstract:
In an advance toward a new generation of improved hip and other joint replacements, scientists are describing development of a potential implant material that flexes more like natural bone, fosters the growth of bone that keeps implants firmly in place and is less likely to fail and require repeat surgery. Their study on these so-called tantalum nanotube materials appears in ACS Applied Material & Interfaces.

Toward a better material for hip replacement and other joint implants

Washington, DC | Posted on September 19th, 2012

Hongyi Li, Jinshu Wang and Zhenting Zhang explain that the metal tantalum has advantages over titanium, stainless steel and other metals used in the current generation of bone implants. For example, tantalum implants are more porous than titanium, encouraging bone growth and making the implants rougher and more elastic, like natural bone. So far, however, tantalum has found use mainly in devices that bridge fractures and other defects in bone, rather than in hip joint replacements and other joint implants. The scientists set out to find a new coating for tantalum to make better implants.

The results suggest that a film of tantalum oxide nanotubes — each more than 1,000 times thinner than a human hair — can help tantalum joint replacements integrate better with existing bone. The coating improves the anticorrosion, biocompatibility and other beneficial aspects of pure tantalum. The films also helped spur bone growth in tests with animal bone cells used as stand-ins for human bone.

The authors acknowledge funding from the National Natural Science Foundation of China, the Beijing Municipal Commission of Education Foundation, the Guangxi Natural Science Foundation, the State Key Laboratory of Electronic Thin Films and Integrated Devices, and the City Board of Education Technology Innovation Platform.

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For more information, please click here

Contacts:
Hongyi Li, Ph.D.
Beijing University of Technology
Beijing 100124
China
Phone: +86 10 67391101
Fax: +86 10 67391101

or
Jinshu Wang, Ph.D.
Beijing University of Technology
Beijing 100124
China
Phone: +86 10 67391101
Fax: +86 10 67391101

or
Zhenting Zhang, Ph.D.
Capital Medical University
Beijing 100050
China
Phone: +86 10 67099279
Fax: +86 10 67391101

Copyright © American Chemical Society (ACS)

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