Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Picosun’s new Picoflow™ diffusion enhancer expands the borders of ALD

Abstract:
ESPOO, Finland, 30th August, 2012 − Picosun Oy, Finnish, globally operating manufacturer of top-quality Atomic Layer Deposition (ALD) systems reports excellent deposition results with its new Picoflow™ diffusion enhancer feature. At customer sites in Asia and Europe, ultra-high conformality and uniformity ALD metal oxide thin films were deposited on extremely challenging high aspect ratio (HAR) trenches on silicon wafers and complicated microchannel structures on silicon chip.

Picosun’s new Picoflow™ diffusion enhancer expands the borders of ALD

Espoo, Finland | Posted on August 30th, 2012

The highest aspect ratios of the trenches were 1:300 and even 1:1000. In such deep structures conventional diffusion is not fast enough to carry the precursors to the bottom of the trench. Picosun's novel, innovative Picoflow™ diffusion enhancer feature lengthens the time the precursors stay in the reaction chamber ("stopped-flow") without risk of precursor back-diffusion to the inlets or particle formation. In addition to HAR structures, this feature is very useful also when coating powders or through-porous samples such as microchannel plates. Titanium dioxide film thickness variation down to only ±2 nm for 100 nm thick film has been achieved with Picoflow™ technology.

Microchannel silicon chips have several applications in e.g. microfluidistics, sensors and MEMS devices. With ALD thin films they can be protected, passivated or functionalized, changing the hydrophilicity, chemical, electrical or optical behaviour.

Silicon trench structures have a crucial function in today's micro- and nanoelectronics. The level of system integration and the amount of individual components in the devices has increased so much that the traditional 2D component stacking is not enough anymore. Therefore the production has moved towards 3D packaging where the components are piled on top of each other and the necessary connections are realized through so-called through-silicon-via (TSV) structures. TSVs are a prime example of trench structures and typically conductive metal films, seed layers or passivation layers are required to cover uniformly and conformally the insides of the trench. Picosun's Picoflow™ expands the possibilities of ALD in these new industrial applications for more efficient future electronics devices.

####

About Picosun Oy
Picosun Oy is Finland-based, world-wide operating manufacturer of state-of-the-art ALD systems, representing continuity to almost four decades of pioneering, exclusive ALD reactor design and manufacturing. Picosun’s global headquarters are located in Espoo, Finland, its production facilities in Kirkkonummi, Finland, its US headquarters in Detroit, Michigan, and its Asian headquarters in Singapore. Today, PICOSUN™ ALD tools are in continuous production and R&D use in numerous frontline industries and research organizations across four continents.

For more information, please click here

Contacts:
Juhana Kostamo
Phone: +358 50 321 1955
Fax: +358 9 297 6116

Copyright © Picosun Oy

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Shining rings: A new material emits white light when exposed to electricity: New synthetic approach could spark development of other dynamic materials July 24th, 2017

Ultrathin device harvests electricity from human motion July 23rd, 2017

The July 23 close fly-by of asteroid 2017 BS5 is explored in a Q&A with Dr. John S. Lewis, chief scientist at Deep Space Industries July 23rd, 2017

Scientists announce the quest for high-index materials: All-dielectric nanophotonics: The quest for better materials and fabrication techniques July 22nd, 2017

Thin films

Studying Argon Gas Trapped in Two-Dimensional Array of Tiny "Cages": Understanding how individual atoms enter and exit the nanoporous frameworks could help scientists design new materials for gas separation and nuclear waste remediation July 17th, 2017

Thinking thin brings new layering and thermal abilities to the semiconductor industry: In a breakthrough for the semiconductor industry, researchers demonstrate a new layer transfer technique called "controlled spalling" that creates many thin layers from a single gallium nitride July 11th, 2017

Nanometrics Expands Position in Advanced Memory Devices with Atlas for Thin Film Process Control: Atlas Films Systems Adopted by Multiple Customers for Advanced Memory Volume Manufacturing July 11th, 2017

ANU invention may help to protect astronauts from radiation in space July 3rd, 2017

Chip Technology

Semiliquid chains pulled out of a sea of microparticles July 20th, 2017

A firefly's flash inspires new nanolaser light July 18th, 2017

GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks: Integrated solution leverages GF’s 22FDX® technology to decrease power, area, and cost for NB-IoT and LTE-M applications July 14th, 2017

Nanometrics to Announce Second Quarter Financial Results on August 1, 2017 July 14th, 2017

Nanoelectronics

Tokyo Institute of Technology research: Antiaromatic molecule displays record electrical conductance July 19th, 2017

A firefly's flash inspires new nanolaser light July 18th, 2017

GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks: Integrated solution leverages GF’s 22FDX® technology to decrease power, area, and cost for NB-IoT and LTE-M applications July 14th, 2017

Thinking thin brings new layering and thermal abilities to the semiconductor industry: In a breakthrough for the semiconductor industry, researchers demonstrate a new layer transfer technique called "controlled spalling" that creates many thin layers from a single gallium nitride July 11th, 2017

Announcements

Shining rings: A new material emits white light when exposed to electricity: New synthetic approach could spark development of other dynamic materials July 24th, 2017

Ultrathin device harvests electricity from human motion July 23rd, 2017

The July 23 close fly-by of asteroid 2017 BS5 is explored in a Q&A with Dr. John S. Lewis, chief scientist at Deep Space Industries July 23rd, 2017

Scientists announce the quest for high-index materials: All-dielectric nanophotonics: The quest for better materials and fabrication techniques July 22nd, 2017

Tools

Scientists announce the quest for high-index materials: All-dielectric nanophotonics: The quest for better materials and fabrication techniques July 22nd, 2017

Coupling a nano-trumpet with a quantum dot enables precise position determination July 14th, 2017

Nanometrics to Announce Second Quarter Financial Results on August 1, 2017 July 14th, 2017

Nanometrics Introduces SpectraProbe Analysis Software: Advanced software and algorithms enhancing Nanometrics metrology fleet capabilities fab-wide July 13th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project