Nanotechnology Now - Press Release: "SEMATECH and Dainippon screen collaborate to advance techniqes for achieving ultra-shallow junctions: Partnership combines strengths to enable steep and ultra-shallow junction formation for sub 14 nm semiconductor manufacturing "

Home > Press > SEMATECH and Dainippon screen collaborate to advance techniqes for achieving ultra-shallow junctions: Partnership combines strengths to enable steep and ultra-shallow junction formation for sub 14 nm semiconductor manufacturing

Abstract:
SEMATECH, a global consortium of the world's leading chip manufacturers, today announced that it has entered into a partnership to accelerate development and commercialization of advanced semiconductor doping technology with Dainippon Screen Mfg. Co., Ltd. (Screen), a leading producer of semiconductor manufacturing equipment. SEMATECH and Screen will collaborate on techniques for monolayer doping and activation methods that are compatible with ultra-shallow junctions for planar and non-planar device technologies (e.g., FinFETs, nanowires, memories) in silicon and non-silicon high mobility materials.

SEMATECH and Dainippon screen collaborate to advance techniqes for achieving ultra-shallow junctions: Partnership combines strengths to enable steep and ultra-shallow junction formation for sub 14 nm semiconductor manufacturing

Albany, NY | Posted on December 19th, 2011

To achieve faster transistor speeds and lower power dissipation, device fabrication will require innovative solutions to minimize leakage resulting from process damage and electrostatic control. Ultra-shallow, abrupt, damage-free junctions with high active dopant concentrations are essential for better off-state leakage control in modern highly scaled nano-electronics. With the advent of non-planar device architectures and high mobility compound semiconductors, doping conformality and minimal lattice damage are increasingly important, and cooperative research efforts are needed to meet ITRS roadmap requirements. A promising defect-free and conformal doping alternative, monolayer doping, will be investigated, and developed for commercial use.

"We are very pleased to collaborate with SEMATECH and its leading-edge industry partners on advanced doping techniques for next generation devices," said Tadahiro Suhara, President of the Semiconductor Equipment Company at Screen. "We believe that this alliance could be a key driver for improving annealing processes and address associated defect issues for manufacturers to continue scaling of CMOS devices."

"This partnership with Screen is a key component of our overall strategy to develop critical infrastructure needed for major industry transitions. Innovative process technologies like monolayer doping are essential to enable transitions to non-planar and to non-silicon high mobility channels, while minimizing processing induced damage, cost and complexity," said Dan Armbrust, president and CEO of SEMATECH. "SEMATECH and Screen will combine our strengths and technical insights to bring innovative solutions for next generation device manufacturers."

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About SEMATECH
For 20 years, SEMATECHŽ (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

About Dainippon Screen Mfg. Co., Ltd.:

Dainippon Screen, established in 1943, is a leading supplier of flat panel display and semiconductor equipment. Screen is currently involved in manufacturing production equipment in a variety of fields, including FPDs, semiconductors, printed circuit boards, and printing and prepress equipment such as thermal CtP recorders and on-demand printing systems. For more information, please visit: www.screen.co.jp

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Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

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