Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > SEMATECH and Dainippon screen collaborate to advance techniqes for achieving ultra-shallow junctions: Partnership combines strengths to enable steep and ultra-shallow junction formation for sub 14 nm semiconductor manufacturing

Abstract:
SEMATECH, a global consortium of the world's leading chip manufacturers, today announced that it has entered into a partnership to accelerate development and commercialization of advanced semiconductor doping technology with Dainippon Screen Mfg. Co., Ltd. (Screen), a leading producer of semiconductor manufacturing equipment. SEMATECH and Screen will collaborate on techniques for monolayer doping and activation methods that are compatible with ultra-shallow junctions for planar and non-planar device technologies (e.g., FinFETs, nanowires, memories) in silicon and non-silicon high mobility materials.

SEMATECH and Dainippon screen collaborate to advance techniqes for achieving ultra-shallow junctions: Partnership combines strengths to enable steep and ultra-shallow junction formation for sub 14 nm semiconductor manufacturing

Albany, NY | Posted on December 19th, 2011

To achieve faster transistor speeds and lower power dissipation, device fabrication will require innovative solutions to minimize leakage resulting from process damage and electrostatic control. Ultra-shallow, abrupt, damage-free junctions with high active dopant concentrations are essential for better off-state leakage control in modern highly scaled nano-electronics. With the advent of non-planar device architectures and high mobility compound semiconductors, doping conformality and minimal lattice damage are increasingly important, and cooperative research efforts are needed to meet ITRS roadmap requirements. A promising defect-free and conformal doping alternative, monolayer doping, will be investigated, and developed for commercial use.

"We are very pleased to collaborate with SEMATECH and its leading-edge industry partners on advanced doping techniques for next generation devices," said Tadahiro Suhara, President of the Semiconductor Equipment Company at Screen. "We believe that this alliance could be a key driver for improving annealing processes and address associated defect issues for manufacturers to continue scaling of CMOS devices."

"This partnership with Screen is a key component of our overall strategy to develop critical infrastructure needed for major industry transitions. Innovative process technologies like monolayer doping are essential to enable transitions to non-planar and to non-silicon high mobility channels, while minimizing processing induced damage, cost and complexity," said Dan Armbrust, president and CEO of SEMATECH. "SEMATECH and Screen will combine our strengths and technical insights to bring innovative solutions for next generation device manufacturers."

####

About SEMATECH
For 20 years, SEMATECH® (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

About Dainippon Screen Mfg. Co., Ltd.:

Dainippon Screen, established in 1943, is a leading supplier of flat panel display and semiconductor equipment. Screen is currently involved in manufacturing production equipment in a variety of fields, including FPDs, semiconductors, printed circuit boards, and printing and prepress equipment such as thermal CtP recorders and on-demand printing systems. For more information, please visit: www.screen.co.jp

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Quantum networks: Back and forth are not equal distances! July 28th, 2015

Smart hydrogel coating creates 'stick-slip' control of capillary action July 27th, 2015

Industrial Nanotech, Inc. Provides Update on PCAOB Audited Financials July 27th, 2015

Global Corrosion Resistant Nano Coatings Market To 2015: Acute Market Reports July 27th, 2015

Chip Technology

Quantum networks: Back and forth are not equal distances! July 28th, 2015

Superfast fluorescence sets new speed record: Plasmonic device has speed and efficiency to serve optical computers July 27th, 2015

Spintronics: Molecules stabilizing magnetism: Organic molecules fixing the magnetic orientation of a cobalt surface/ building block for a compact and low-cost storage technology/ publication in Nature Materials July 25th, 2015

Penn researchers discover new chiral property of silicon, with photonic applications July 25th, 2015

Announcements

Quantum networks: Back and forth are not equal distances! July 28th, 2015

Reshaping the solar spectrum to turn light to electricity: UC Riverside researchers find a way to use the infrared region of the sun's spectrum to make solar cells more efficient July 27th, 2015

Industrial Nanotech, Inc. Provides Update on PCAOB Audited Financials July 27th, 2015

Global Corrosion Resistant Nano Coatings Market To 2015: Acute Market Reports July 27th, 2015

Alliances/Trade associations/Partnerships/Distributorships

Dais Analytic's Business Affiliate in China Announces Ten-Year Strategic Energy Efficiency Business Arrangement With COFCO: Dais Beijing to Perform Feasibility Study on Over 80 Buildings to Improve Efficiencies as Part of Overall Hotel Energy-Savings Project July 23rd, 2015

Leti and Diabeloop Project Aims at Developing Artificial Pancreas for Diabetes Treatment July 22nd, 2015

Imec and Panasonic Demonstrate Breakthrough RRAM Cell July 16th, 2015

Imec introduces self-assembled monomolecular organic films to seal ultra-porous low- k materials: Method prevents leakage of barrier precursors during the interconnect metallization scheme July 15th, 2015

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project