Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > EV Group Boosts High-Volume Manufacturing Performance Across Product Lines With New XT Frame Equipment Platform

EV GROUP (EVG) XT FRAME PLATFORM EVG's new XT Frame platform. (PRNewsFoto/EV Group (EVG)) ST. FLORIAN, AUSTRIA
EV GROUP (EVG) XT FRAME PLATFORM EVG's new XT Frame platform. (PRNewsFoto/EV Group (EVG)) ST. FLORIAN, AUSTRIA

Abstract:
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new equipment platform, dubbed the XT Frame, that extends process throughput and tool functionality for virtually all of its current volume-manufacturing product offerings. Specifically designed to address new requirements from its high-volume manufacturing (HVM) customers, the XT Frame can accommodate up to nine process modules—doubling EVG's previous maximum processing capability for significantly increased throughput. In addition, customers have greater flexibility in combining different process modules on a single tool platform. Products built on the new XT Frame platform are available immediately.

EV Group Boosts High-Volume Manufacturing Performance Across Product Lines With New XT Frame Equipment Platform

St. Florian, Austria | Posted on December 6th, 2011

An increasing number of device types, including components for high-volume consumer products such as smart phones and handsets, are being produced at the wafer level—driving the need for new solutions to increase production throughput in the fab. EVG's new XT Frame platform provides an equipment front-end module with an ultra-fast handling system, enough module spaces for the parallel processing of several wafers, as well as up to four FOUP (front opening unified pod) load ports. This, combined with a material buffer in the form of a local FOUP storage system (LFSS), enables highly efficient continuous mode operation. Moreover, the new design addresses additional customer requirements such as high process flexibility through the combination of different types of process modules on the same piece of equipment, easy upgradeability, further improved serviceability and a small overall footprint in the fab.

"The XT Frame equipment platform is a significant step forward for EV Group's product offerings for high-volume manufacturing environments," stated Paul Lindner, executive technology director for EV Group. "We are committed to developing innovative solutions that push the performance envelope in order to solve our customers' most pressing technology challenges while lowering their manufacturing costs. We see an immediate need for greater volume manufacturing capability in the advanced packaging and 3D interconnect space, which is why we've chosen our EVG®850TB/DB system as the first tool to be built on the XT Frame platform."

The new XT Frame architecture is an extension of EVG's field-proven standard equipment platform, which provides up to five process modules. The standard equipment platform has also just recently been upgraded to provide enhanced automation capabilities and increased system throughput. As an example, EVG's new flagship model in the GEMINI FB fusion wafer bonder family, launched at SEMICON Taiwan 2011, is now also available with an optional equipment front end module, a faster handling system and a local material buffer.

EVG's XT Frame platform supports solutions across all of the company's addressable markets, but is especially beneficial for advanced packaging/3D interconnect applications with TSVs (through-silicon vias). In this area, the new platform can, for example, further enhance the performance of EVG's benchmark temporary bonding/debonding and thin wafer processing systems. Demo capabilities for the XT Frame are now available on the EVG®850TB/DB, which can also accommodate EVG's new EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) modules to support ZoneBOND™ technology.

Those interested in learning more about EVG's new XT Frame equipment platform can visit the company in Chiba City, Japan where EVG will be exhibiting at SEMICON Japan, December 7-9, at booth #6B-606.

####

About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple-i approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.

For more information, please click here

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

A nanoscale wireless communication system via plasmonic antennas: Greater control affords 'in-plane' transmission of waves at or near visible light August 27th, 2016

Forces of nature: Interview with microscopy innovators Gerd Binnig and Christoph Gerber August 26th, 2016

A promising route to the scalable production of highly crystalline graphene films August 26th, 2016

Graphene under pressure August 26th, 2016

MEMS

STMicroelectronics Earns MEMS Manufacturer of the Year Award August 1st, 2016

Integration of novel materials with silicon chips makes new 'smart' devices possible July 25th, 2016

New research unveils graphene 'moth eyes' to power future smart technologies: New ultra-thin, patterned graphene sheets will be essential in designing future technologies such as 'smart wallpaper' and Internet-of-things applications March 1st, 2016

Vesper Collaborates with GLOBALFOUNDRIES to Deliver First Piezoelectric MEMS Microphones: Acoustic sensing company works with top foundry to support mass-market consumer products January 21st, 2016

Chip Technology

A nanoscale wireless communication system via plasmonic antennas: Greater control affords 'in-plane' transmission of waves at or near visible light August 27th, 2016

A promising route to the scalable production of highly crystalline graphene films August 26th, 2016

Analog DNA circuit does math in a test tube: DNA computers could one day be programmed to diagnose and treat disease August 25th, 2016

Silicon nanoparticles trained to juggle light: Research findings prove the capabilities of silicon nanoparticles for flexible data processing in optical communication systems August 25th, 2016

Announcements

A nanoscale wireless communication system via plasmonic antennas: Greater control affords 'in-plane' transmission of waves at or near visible light August 27th, 2016

Forces of nature: Interview with microscopy innovators Gerd Binnig and Christoph Gerber August 26th, 2016

A promising route to the scalable production of highly crystalline graphene films August 26th, 2016

Graphene under pressure August 26th, 2016

Tools

Nanofiber scaffolds demonstrate new features in the behavior of stem and cancer cells August 25th, 2016

50 years after the release of the film 'Fantastic Voyage,' science upstages fiction: Science upstages fiction with nanorobotic agents designed to travel in the human body to treat cancer August 25th, 2016

University of Puerto Rico and NASA back in the news – XEI reports August 23rd, 2016

Spider silk: Mother Nature's bio-superlens August 22nd, 2016

Events/Classes

Stretchy supercapacitors power wearable electronics August 25th, 2016

Semblant to Present at China Mobile Manufacturing Forum 2016 August 25th, 2016

Nanoparticles that speed blood clotting may someday save lives August 23rd, 2016

Impressive List of Doctors, Scientists Coming to Vail for Scientific Summit: The Second Vail Scientific Summit Convenes the Greatest Minds in Regenerative Medicine and Science August 17th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic