Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > EV Group Boosts High-Volume Manufacturing Performance Across Product Lines With New XT Frame Equipment Platform

EV GROUP (EVG) XT FRAME PLATFORM EVG's new XT Frame platform. (PRNewsFoto/EV Group (EVG)) ST. FLORIAN, AUSTRIA
EV GROUP (EVG) XT FRAME PLATFORM EVG's new XT Frame platform. (PRNewsFoto/EV Group (EVG)) ST. FLORIAN, AUSTRIA

Abstract:
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new equipment platform, dubbed the XT Frame, that extends process throughput and tool functionality for virtually all of its current volume-manufacturing product offerings. Specifically designed to address new requirements from its high-volume manufacturing (HVM) customers, the XT Frame can accommodate up to nine process modules—doubling EVG's previous maximum processing capability for significantly increased throughput. In addition, customers have greater flexibility in combining different process modules on a single tool platform. Products built on the new XT Frame platform are available immediately.

EV Group Boosts High-Volume Manufacturing Performance Across Product Lines With New XT Frame Equipment Platform

St. Florian, Austria | Posted on December 6th, 2011

An increasing number of device types, including components for high-volume consumer products such as smart phones and handsets, are being produced at the wafer level—driving the need for new solutions to increase production throughput in the fab. EVG's new XT Frame platform provides an equipment front-end module with an ultra-fast handling system, enough module spaces for the parallel processing of several wafers, as well as up to four FOUP (front opening unified pod) load ports. This, combined with a material buffer in the form of a local FOUP storage system (LFSS), enables highly efficient continuous mode operation. Moreover, the new design addresses additional customer requirements such as high process flexibility through the combination of different types of process modules on the same piece of equipment, easy upgradeability, further improved serviceability and a small overall footprint in the fab.

"The XT Frame equipment platform is a significant step forward for EV Group's product offerings for high-volume manufacturing environments," stated Paul Lindner, executive technology director for EV Group. "We are committed to developing innovative solutions that push the performance envelope in order to solve our customers' most pressing technology challenges while lowering their manufacturing costs. We see an immediate need for greater volume manufacturing capability in the advanced packaging and 3D interconnect space, which is why we've chosen our EVG®850TB/DB system as the first tool to be built on the XT Frame platform."

The new XT Frame architecture is an extension of EVG's field-proven standard equipment platform, which provides up to five process modules. The standard equipment platform has also just recently been upgraded to provide enhanced automation capabilities and increased system throughput. As an example, EVG's new flagship model in the GEMINI FB fusion wafer bonder family, launched at SEMICON Taiwan 2011, is now also available with an optional equipment front end module, a faster handling system and a local material buffer.

EVG's XT Frame platform supports solutions across all of the company's addressable markets, but is especially beneficial for advanced packaging/3D interconnect applications with TSVs (through-silicon vias). In this area, the new platform can, for example, further enhance the performance of EVG's benchmark temporary bonding/debonding and thin wafer processing systems. Demo capabilities for the XT Frame are now available on the EVG®850TB/DB, which can also accommodate EVG's new EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) modules to support ZoneBOND™ technology.

Those interested in learning more about EVG's new XT Frame equipment platform can visit the company in Chiba City, Japan where EVG will be exhibiting at SEMICON Japan, December 7-9, at booth #6B-606.

####

About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple-i approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.

For more information, please click here

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Silicene Labs Announces the Launch of Patent-Pending, 2D Materials Composite Index™ : The Initial 2D Materials Composite Index™ for Q2 2014 Is: 857.3; Founders Include World-Renowned Physicist and Seasoned Business and IP Professionals July 24th, 2014

Iranian Scientists Produce Transparent Nanocomposite Coatings with Longer Lifetime July 24th, 2014

Deadline Announced for Registration in 7th Int'l Nanotechnology Festival in Iran July 23rd, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

MEMS

Carbyne morphs when stretched: Rice University calculations show carbon-atom chain would go metal to semiconductor July 21st, 2014

Leti to Present Technological Platforms Targeting Industry’s Needs for the Future at Semicon West Workshop: Presentation at STS Session to Focus on Leti Advanced Lithography Programs for 1x Nodes and on Silicon Photonics at TechXPot June 25th, 2014

Mirrorcle Technologies Opens New Company Headquarters May 27th, 2014

Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding: Enables Fine-Pitch Connections for 3D Applications, Including Image Sensors, Memory and 3D SoCs May 27th, 2014

Chip Technology

A Crystal Wedding in the Nanocosmos July 23rd, 2014

Nanometrics Announces Upcoming Investor Events July 22nd, 2014

Penn Study: Understanding Graphene’s Electrical Properties on an Atomic Level July 22nd, 2014

NUS scientists use low cost technique to improve properties and functions of nanomaterials: By 'drawing' micropatterns on nanomaterials using a focused laser beam, scientists could modify properties of nanomaterials for effective applications in photonic and optoelectric applicat July 22nd, 2014

Announcements

Silicene Labs Announces the Launch of Patent-Pending, 2D Materials Composite Index™ : The Initial 2D Materials Composite Index™ for Q2 2014 Is: 857.3; Founders Include World-Renowned Physicist and Seasoned Business and IP Professionals July 24th, 2014

Iranian Scientists Produce Transparent Nanocomposite Coatings with Longer Lifetime July 24th, 2014

Deadline Announced for Registration in 7th Int'l Nanotechnology Festival in Iran July 23rd, 2014

A Crystal Wedding in the Nanocosmos July 23rd, 2014

Tools

Hysitron is Awarded TWO R&D 100 Awards for Highly Innovative Technology Developments in the Areas of Extreme Environments and Biological Mechanical Property Testing July 23rd, 2014

EPFL Research on the use of AFM based nanoscale IR spectroscopy for the study of single amyloid molecules wins poster competition at Swiss Physics Society meeting July 22nd, 2014

The Hiden EQP Plasma Diagnostic with on-board MCA July 22nd, 2014

Nanometrics Announces Upcoming Investor Events July 22nd, 2014

Events/Classes

NNCO Announces an Interactive Webinar: Progress Review on the Coordinated Implementation of the National Nanotechnology Initiative 2011 Environmental, Health, and Safety Research Strategy July 23rd, 2014

Harris & Harris Group to Host Conference Call on Second-Quarter 2014 Financial Results on August 15, 2014 July 23rd, 2014

Deadline Announced for Registration in 7th Int'l Nanotechnology Festival in Iran July 23rd, 2014

Iran to Hold 3rd Int'l Forum on Nanotechnology Economy July 22nd, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE