Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > EV Group Boosts High-Volume Manufacturing Performance Across Product Lines With New XT Frame Equipment Platform

EV GROUP (EVG) XT FRAME PLATFORM EVG's new XT Frame platform. (PRNewsFoto/EV Group (EVG)) ST. FLORIAN, AUSTRIA
EV GROUP (EVG) XT FRAME PLATFORM EVG's new XT Frame platform. (PRNewsFoto/EV Group (EVG)) ST. FLORIAN, AUSTRIA

Abstract:
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new equipment platform, dubbed the XT Frame, that extends process throughput and tool functionality for virtually all of its current volume-manufacturing product offerings. Specifically designed to address new requirements from its high-volume manufacturing (HVM) customers, the XT Frame can accommodate up to nine process modules—doubling EVG's previous maximum processing capability for significantly increased throughput. In addition, customers have greater flexibility in combining different process modules on a single tool platform. Products built on the new XT Frame platform are available immediately.

EV Group Boosts High-Volume Manufacturing Performance Across Product Lines With New XT Frame Equipment Platform

St. Florian, Austria | Posted on December 6th, 2011

An increasing number of device types, including components for high-volume consumer products such as smart phones and handsets, are being produced at the wafer level—driving the need for new solutions to increase production throughput in the fab. EVG's new XT Frame platform provides an equipment front-end module with an ultra-fast handling system, enough module spaces for the parallel processing of several wafers, as well as up to four FOUP (front opening unified pod) load ports. This, combined with a material buffer in the form of a local FOUP storage system (LFSS), enables highly efficient continuous mode operation. Moreover, the new design addresses additional customer requirements such as high process flexibility through the combination of different types of process modules on the same piece of equipment, easy upgradeability, further improved serviceability and a small overall footprint in the fab.

"The XT Frame equipment platform is a significant step forward for EV Group's product offerings for high-volume manufacturing environments," stated Paul Lindner, executive technology director for EV Group. "We are committed to developing innovative solutions that push the performance envelope in order to solve our customers' most pressing technology challenges while lowering their manufacturing costs. We see an immediate need for greater volume manufacturing capability in the advanced packaging and 3D interconnect space, which is why we've chosen our EVG®850TB/DB system as the first tool to be built on the XT Frame platform."

The new XT Frame architecture is an extension of EVG's field-proven standard equipment platform, which provides up to five process modules. The standard equipment platform has also just recently been upgraded to provide enhanced automation capabilities and increased system throughput. As an example, EVG's new flagship model in the GEMINI FB fusion wafer bonder family, launched at SEMICON Taiwan 2011, is now also available with an optional equipment front end module, a faster handling system and a local material buffer.

EVG's XT Frame platform supports solutions across all of the company's addressable markets, but is especially beneficial for advanced packaging/3D interconnect applications with TSVs (through-silicon vias). In this area, the new platform can, for example, further enhance the performance of EVG's benchmark temporary bonding/debonding and thin wafer processing systems. Demo capabilities for the XT Frame are now available on the EVG®850TB/DB, which can also accommodate EVG's new EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) modules to support ZoneBOND™ technology.

Those interested in learning more about EVG's new XT Frame equipment platform can visit the company in Chiba City, Japan where EVG will be exhibiting at SEMICON Japan, December 7-9, at booth #6B-606.

####

About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple-i approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.

For more information, please click here

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Camouflaged nanoparticles used to deliver killer protein to cancer June 17th, 2018

Squeezing light at the nanoscale: Ultra-confined light could detect harmful molecules June 17th, 2018

Physicists devise method to reveal how light affects materials: The new method adds to the understanding of the fundamental laws governing the interaction of electrons and light June 15th, 2018

Tripling the Energy Storage of Lithium-Ion Batteries: Scientists have synthesized a new cathode material from iron fluoride that surpasses the capacity limits of traditional lithium-ion batteries June 14th, 2018

MEMS

HTA to Present European Strategy for Competitive Micro- and Nanotechnologies & Smart Systems: Special Event in Brussels on April 24 Gathers Research Institutes’ CEOs, European Commissioners and Key European Industrials April 17th, 2018

New approach to measuring stickiness could aid micro-device design March 8th, 2018

MEMS chips get metatlenses: Combining metasurface lenses with MEMS technology could add high-speed scanning and enhance focusing capability of optical systems February 21st, 2018

First Capacitive Transducer with 13nm Gap July 27th, 2017

Chip Technology

Making quantum puddles: Physicists discover how to create the thinnest liquid films ever June 13th, 2018

Leti Presenting Strategic Vision and Hosting a Workshop at SEMICON West: “From Electrons to Photons” Leti Workshop and CEO Media Briefing Set for Tuesday, July 10 in W Hotel, San Francisco June 12th, 2018

Nanometrics Updates Time of Webcast at Stifel 2018 Cross Sector Insight Conference June 12th, 2018

Does nanoconfinement affect the interaction between two materials placed in contact? It ispossible to estimate how nanoconfinement affects the number of contacts formed by two materials placed in intimate contact and, hence, the interfacial interactions June 7th, 2018

Announcements

Camouflaged nanoparticles used to deliver killer protein to cancer June 17th, 2018

Squeezing light at the nanoscale: Ultra-confined light could detect harmful molecules June 17th, 2018

Physicists devise method to reveal how light affects materials: The new method adds to the understanding of the fundamental laws governing the interaction of electrons and light June 15th, 2018

Tripling the Energy Storage of Lithium-Ion Batteries: Scientists have synthesized a new cathode material from iron fluoride that surpasses the capacity limits of traditional lithium-ion batteries June 14th, 2018

Tools

Nanometrics Updates Time of Webcast at Stifel 2018 Cross Sector Insight Conference June 12th, 2018

Nano-saturn: Supramolecular complex formation: Anthracene macrocycle and C60 fullerene June 8th, 2018

Detecting the birth and death of a phonon June 7th, 2018

Scientists use photonic chip to make virtual movies of molecular motion June 6th, 2018

Events/Classes

Leti Presenting Strategic Vision and Hosting a Workshop at SEMICON West: “From Electrons to Photons” Leti Workshop and CEO Media Briefing Set for Tuesday, July 10 in W Hotel, San Francisco June 12th, 2018

180 Degree Capital Corp. to Provide Live Remote Access to Its Annual Meeting of Shareholders on June 12, 2018 June 12th, 2018

Nanometrics Updates Time of Webcast at Stifel 2018 Cross Sector Insight Conference June 12th, 2018

Arrowhead Pharmaceuticals to Present at Upcoming June 2018 Conferences May 31st, 2018

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project