Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > EV Group Boosts High-Volume Manufacturing Performance Across Product Lines With New XT Frame Equipment Platform

EV GROUP (EVG) XT FRAME PLATFORM EVG's new XT Frame platform. (PRNewsFoto/EV Group (EVG)) ST. FLORIAN, AUSTRIA
EV GROUP (EVG) XT FRAME PLATFORM EVG's new XT Frame platform. (PRNewsFoto/EV Group (EVG)) ST. FLORIAN, AUSTRIA

Abstract:
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new equipment platform, dubbed the XT Frame, that extends process throughput and tool functionality for virtually all of its current volume-manufacturing product offerings. Specifically designed to address new requirements from its high-volume manufacturing (HVM) customers, the XT Frame can accommodate up to nine process modules—doubling EVG's previous maximum processing capability for significantly increased throughput. In addition, customers have greater flexibility in combining different process modules on a single tool platform. Products built on the new XT Frame platform are available immediately.

EV Group Boosts High-Volume Manufacturing Performance Across Product Lines With New XT Frame Equipment Platform

St. Florian, Austria | Posted on December 6th, 2011

An increasing number of device types, including components for high-volume consumer products such as smart phones and handsets, are being produced at the wafer level—driving the need for new solutions to increase production throughput in the fab. EVG's new XT Frame platform provides an equipment front-end module with an ultra-fast handling system, enough module spaces for the parallel processing of several wafers, as well as up to four FOUP (front opening unified pod) load ports. This, combined with a material buffer in the form of a local FOUP storage system (LFSS), enables highly efficient continuous mode operation. Moreover, the new design addresses additional customer requirements such as high process flexibility through the combination of different types of process modules on the same piece of equipment, easy upgradeability, further improved serviceability and a small overall footprint in the fab.

"The XT Frame equipment platform is a significant step forward for EV Group's product offerings for high-volume manufacturing environments," stated Paul Lindner, executive technology director for EV Group. "We are committed to developing innovative solutions that push the performance envelope in order to solve our customers' most pressing technology challenges while lowering their manufacturing costs. We see an immediate need for greater volume manufacturing capability in the advanced packaging and 3D interconnect space, which is why we've chosen our EVG®850TB/DB system as the first tool to be built on the XT Frame platform."

The new XT Frame architecture is an extension of EVG's field-proven standard equipment platform, which provides up to five process modules. The standard equipment platform has also just recently been upgraded to provide enhanced automation capabilities and increased system throughput. As an example, EVG's new flagship model in the GEMINI FB fusion wafer bonder family, launched at SEMICON Taiwan 2011, is now also available with an optional equipment front end module, a faster handling system and a local material buffer.

EVG's XT Frame platform supports solutions across all of the company's addressable markets, but is especially beneficial for advanced packaging/3D interconnect applications with TSVs (through-silicon vias). In this area, the new platform can, for example, further enhance the performance of EVG's benchmark temporary bonding/debonding and thin wafer processing systems. Demo capabilities for the XT Frame are now available on the EVG®850TB/DB, which can also accommodate EVG's new EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) modules to support ZoneBOND™ technology.

Those interested in learning more about EVG's new XT Frame equipment platform can visit the company in Chiba City, Japan where EVG will be exhibiting at SEMICON Japan, December 7-9, at booth #6B-606.

####

About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple-i approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.

For more information, please click here

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

New ASTM Standards Will Help Educate Present and Future Nanotechnology Workforces April 26th, 2015

Heat makes electrons’ spin in magnetic superconductors April 26th, 2015

QD Vision Wins 2015 Bronze Edison Award for Color IQ™ Quantum Dot Technology April 26th, 2015

SEFCU, SUNY Poly CNSE Announce Winning Student-Led Teams in the 6th Annual $500,000 New York Business Plan Competition April 25th, 2015

MEMS

Phonons, arise! Small electric voltage alters conductivity in key materials April 22nd, 2015

Iranian Scientists Evaluate Dynamic Interaction between 2 Carbon Nanotubes April 14th, 2015

ASIC Development for MEMS Applications: A Platform Approach March 25th, 2015

STMicroelectronics Executive Vice-President Benedetto Vigna Awarded IEEE Frederik Philips Award March 12th, 2015

Chip Technology

Surface matters: Huge reduction of heat conduction observed in flat silicon channels April 23rd, 2015

Drexel materials scientists putting a new spin on computing memory April 22nd, 2015

Printing Silicon on Paper, with Lasers April 21st, 2015

Advances in molecular electronics: Lights on -- molecule on: Researchers from Dresden and Konstanz succeed in light-controlled molecule switching April 20th, 2015

Announcements

New ASTM Standards Will Help Educate Present and Future Nanotechnology Workforces April 26th, 2015

Heat makes electrons’ spin in magnetic superconductors April 26th, 2015

QD Vision Wins 2015 Bronze Edison Award for Color IQ™ Quantum Dot Technology April 26th, 2015

SEFCU, SUNY Poly CNSE Announce Winning Student-Led Teams in the 6th Annual $500,000 New York Business Plan Competition April 25th, 2015

Tools

Fast and accurate 3-D imaging technique to track optically trapped particles April 24th, 2015

ORNL reports method that takes quantum sensing to new level April 23rd, 2015

Quantum 'paparazzi' film photons in the act of pairing up April 22nd, 2015

Richards-Kortum elected to American Academy of Arts and Sciences: April 22nd, 2015

Events/Classes

New ASTM Standards Will Help Educate Present and Future Nanotechnology Workforces April 26th, 2015

SEFCU, SUNY Poly CNSE Announce Winning Student-Led Teams in the 6th Annual $500,000 New York Business Plan Competition April 25th, 2015

Richards-Kortum elected to American Academy of Arts and Sciences: April 22nd, 2015

Harris & Harris Group Sponsors NYC American Heart Association's Health Sciences Innovation Investment Forum: Co-founder of Harris & Harris Group Portfolio Company TARA Biosystems to Speak About the Value of Tissue Engineering Technology April 21st, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project