Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > International Symposium on EUV Lithography and Lithographic Extentions showcase potential technical solutions and explore innovative alternative patterning technologies

Abstract:
EUVL continues to maintain the lithography roadmap for the next several technology nodes, and directed self-assembly is gaining momentum.

International Symposium on EUV Lithography and Lithographic Extentions showcase potential technical solutions and explore innovative alternative patterning technologies

Miami, FL | Posted on November 1st, 2011

As reported at the 2011 International Extreme Ultraviolet Lithography (EUVL) and Lithography Extensions (LE) Symposia, Oct. 17-21, in Miami, FL SEMATECH engineers and the industry at large continue to evolve the infrastructure that will enable lithography for cost-effective manufacturing. This year's EUVL symposium was co-organized by SEMATECH in cooperation with EIDEC and IMEC; the Lithography Extensions Symposium was held in cooperation with IMEC.
The week-long duo of lithography events attracted a record-breaking attendance of over 550 top experts and researchers discussing progress on extending current technologies while building the infrastructure for future solutions. A combined set of 86 technical papers and 79 posters reported steady, measured progress in many key areas. Presenters additionally highlighted various technology, infrastructure, and business challenges that the industry needs to address to successfully insert EUVL into manufacturing at the 22 nm half-pitch node.
Progress reported at the EUVL symposium included EUV scanners being shipped over the past year and pilot lines being ramped-up to enable first product use on critical layers as early as 2013. With chip manufacturers integrating EUVL technology into their fabs, the industry is now focused on resolving the remaining challenges to EUVL high volume manufacturing. This was evident from the paper and poster topics, the majority of which were related to manufacturing introduction and addressing remaining engineering challenges:

∑ The EUVL symposium plenary address "Transform Designs to Chips with Sub-20nm Technologies" by Joshua Li of NVIDIA highlighted the design-driven challenges for lithography technologies to meet fabless company device performance and cost targets for sub-20 nm manufacturing.

∑ The EUVL symposium keynote address "EUV Readiness and ASML NXE3100 Performance" by Han-Ku Cho of Samsung assessed the pilot line readiness of EUV lithography and outlined the time-table and performance requirements needed to introduce the technology into high volume manufacturing (HVM) for DRAM products in 2013.

∑ Blank and mask makers continue to reduce mask defects, and IC makers including GLOBALFOUNDRIES, IBM, Intel, Toshiba, and TSMC are demonstrating progress in developing defect avoidance and mitigation strategies that will allow them to use masks with a few residual defects. Current mask defect levels are soon expected to support DRAM for pilot line operation, while lower mask defect levels are required to meet logic/foundry requirements.

∑ Over the past year, the industry has put programs in place that will close the infrastructure gaps for EUV blank/mask inspection and defect review by 2014/15; most notably is the development of an AIMS tool led by SEMATECH through the EUV Mask Infrastructure partnership.

∑ Several chemically amplified resist (CAR) materials achieving sub-20 nm resolutions were demonstrated by researchers from the member companies in SEMATECH's Resist Program. A 15 nm half-pitch resolving CAR was exposed on SEMATECH's microexposure tool (MET) at Lawrence Berkeley National Laboratory by JSR, and a nanoparticle resist material developed in a SEMATECH research program with Cornell University has demonstrated mid-20 nm half-pitch resolution at excellent photosensitivity on SEMATECH's MET in Albany, NY.

∑ SEMATECH researchers and research partners highlighted the key role the consortium has played in achieving significant advances in the fundamental understanding and reduction of mask blank defects in mask manufacturing and use as well as in achieving breakthroughs in EUV resist materials development.

∑ Emily Gallagher of IBM won the best paper award for her presentation on EUV mask readiness, "EUV Masks: Ready or Not?" The best poster award winner was Hyung-Cheol Lee et al., from Hanyang University for their work on "Realistic Thermal Effect of Extreme Ultraviolet Pellicle."

∑ Lastly, the EUVL Symposium Steering Committee identified three remaining focus areas that the industry must work on to enable EUVL manufacturing insertion:

1. Long-term reliable source operation with 200 W at intermediate focus

2. Mask yield and defect inspection/review infrastructure

3. Simultaneous achievement of resist resolution, sensitivity, and LER

The Lithography Extensions Symposium included innovative patterning techniques that have the potential to cost-effectively extend resolution capabilities.
Key highlights include the following:

∑ Directed self-assembly (DSA) is making significant progress towards potential commercial application in semiconductor manufacturing. A variety of techniques including chemo-epitaxy, graphoepitaxy, and spin-on spacer, have been demonstrated as potential DSA-based patterning approaches. Many resist and chemical suppliers, including AZ, JSR, and DOW, have active development activities both internally and with research partners.

∑ IBM reported on the application of DSA to improve the patterning capability of existing lithography systems through contact hole rectification. Initial defectivity assessments indicate that the current measured defectivity is similar to what was initially seen during the development of immersion lithography.

∑ Best paper award winner Cliff Henderson of Georgia Tech highlighted significant progress toward developing of a mesoscale model to accurately predict material interactions, which is needed to identify materials for DSA applications. Such predictive models will help design more effective DSA systems without time-consuming experimentation.

∑ Matt Malloy of SEMATECH's Nanoimprint program summarized achievements over the past 3 years, including demonstrating an overlay capability of 15 nm and imprint process defectivity of <0.1 def/cm2. This highlights the potential for achieving defect levels commensurate with manufacturing requirements.

The 2011 International EUVL and Lithography Extensions Symposia are central elements of the SEMATECH Knowledge Series - a set of public, single-focused industry meetings designed to increase global knowledge in key areas of semiconductor R&D - and represent a great success in the history of SEMATECH-sponsored conferences as these technologies have evolved from tabletop experiments to fully adopted high volume manufacturing over the past half dozen years.

####

About SEMATECH
For over 20 years, SEMATECHģ (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

FEI Celebrates Shipment of 1,000th Helios DualBeam System: FEIís Helios Family has lead the DualBeam technology race and is widely used across the semiconductor, materials science, life sciences and oil & gas industries August 31st, 2016

Colors from darkness: Researchers develop alternative approach to quantum computing August 31st, 2016

Diamonds and quantum information processing on the nano scale August 31st, 2016

Device to control 'color' of electrons in graphene provides path to future electronics August 31st, 2016

Possible Futures

Colors from darkness: Researchers develop alternative approach to quantum computing August 31st, 2016

Device to control 'color' of electrons in graphene provides path to future electronics August 31st, 2016

Graphene key to growing 2-dimensional semiconductor with extraordinary properties August 30th, 2016

Nanocatalysis for organic chemistry: This research article by Dr. Qien Xu et al. is published in Current Organic Chemistry, Volume 20, Issue 19, 2016 August 30th, 2016

Chip Technology

Colors from darkness: Researchers develop alternative approach to quantum computing August 31st, 2016

Diamonds and quantum information processing on the nano scale August 31st, 2016

Device to control 'color' of electrons in graphene provides path to future electronics August 31st, 2016

Graphene key to growing 2-dimensional semiconductor with extraordinary properties August 30th, 2016

Self Assembly

Smarter self-assembly opens new pathways for nanotechnology: Brookhaven Lab scientists discover a way to create billionth-of-a-meter structures that snap together in complex patterns with unprecedented efficiency August 9th, 2016

Magnetic atoms arranged in neat rows: FAU physicists enable one-dimensional atom chains to grow August 5th, 2016

Accurate design of large icosahedral protein nanocages pushes bioengineering boundaries: Scientists used computational methods to build ten large, two-component, co-assembling icosahedral protein complexes the size of small virus coats July 25th, 2016

WSU researchers develop shape-changing 'smart' material: Heat, light stimulate self-assembly July 4th, 2016

Announcements

FEI Celebrates Shipment of 1,000th Helios DualBeam System: FEIís Helios Family has lead the DualBeam technology race and is widely used across the semiconductor, materials science, life sciences and oil & gas industries August 31st, 2016

Colors from darkness: Researchers develop alternative approach to quantum computing August 31st, 2016

Diamonds and quantum information processing on the nano scale August 31st, 2016

Device to control 'color' of electrons in graphene provides path to future electronics August 31st, 2016

Events/Classes

Stretchy supercapacitors power wearable electronics August 25th, 2016

Semblant to Present at China Mobile Manufacturing Forum 2016 August 25th, 2016

Nanoparticles that speed blood clotting may someday save lives August 23rd, 2016

Impressive List of Doctors, Scientists Coming to Vail for Scientific Summit: The Second Vail Scientific Summit Convenes the Greatest Minds in Regenerative Medicine and Science August 17th, 2016

Nanobiotechnology

Designing ultrasound tools with Lego-like proteins August 29th, 2016

Analog DNA circuit does math in a test tube: DNA computers could one day be programmed to diagnose and treat disease August 25th, 2016

Nanofiber scaffolds demonstrate new features in the behavior of stem and cancer cells August 25th, 2016

Johns Hopkins scientists track metabolic pathways to find drug combination for pancreatic cancer August 25th, 2016

Alliances/Trade associations/Partnerships/Distributorships

Thomas Swan and NGI announce unique partnership July 28th, 2016

Starpharma initiates new DEPô drug delivery program with AstraZeneca July 27th, 2016

XEI Scientific Partners with Electron Microscopy Sciences to Promote and Sell its Products in North and South America July 25th, 2016

Leti and Korea Institute of Science and Technology to Explore Collaboration on Advanced Technologies for Digital Era July 14th, 2016

Printing/Lithography/Inkjet/Inks

Tailored probes for atomic force microscopes: 3-D laser lithography enhances microscope for studying nanostructures in biology and engineering/ publication in Applied Physics Letters August 11th, 2016

Smarter self-assembly opens new pathways for nanotechnology: Brookhaven Lab scientists discover a way to create billionth-of-a-meter structures that snap together in complex patterns with unprecedented efficiency August 9th, 2016

Nanoscientists develop the 'ultimate discovery tool': Rapid discovery power is similar to what gene chips offer biology June 25th, 2016

Perovskite solar cells surpass 20 percent efficiency: EPFL researchers are pushing the limits of perovskite solar cell performance by exploring the best way to grow these crystals June 13th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic