Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SEMATECH to showcase innovations in high-k metal gate reliability, non-planar devices and resistive rams at IEDM 2011: Technical papers demonstrate emerging solutions for critical material and device gaps in next generation device technologies

Abstract:
Engineers from SEMATECH are scheduled to present four technical papers and participate in a panel discussion at the 57th annual IEEE International Electron Devices Meeting (IEDM), December 5-7, 2011, at the Hilton in Washington, DC.

SEMATECH to showcase innovations in high-k metal gate reliability, non-planar devices and resistive rams at IEDM 2011: Technical papers demonstrate emerging solutions for critical material and device gaps in next generation device technologies

Albany, NY | Posted on October 13th, 2011

Highlighting significant breakthroughs that address the growing need for higher performance and low power devices, SEMATECH experts will report on high mobility channel materials, improved high-k metal gate reliability advancements, advanced non-planar device doping approaches, and resistive RAM (RRAM) memory technologies for scaled CMOS and memory beyond the 15nm node.
SEMATECH Presentations:

Title: Comprehensive Physical Modeling of Forming and Switching Operations in HfO2 RRAM Devices
When: Tuesday, December 6, 4 p.m.
Where: Jefferson Room

This paper will examine a novel physical model of RRAM devices that describes the creation of conductive filaments during forming and electrical transport in high and low resistance states.


Title: Improved High-k/Metal Gate Lifetime via Improved SILC Understanding and Mitigation
When: Tuesday, December 6, 3:10 p.m.
Where: Lincoln Room

This paper will identify, for the first time, key factors impacting stress-induced leakage current (SILC) through a comprehensive reliability study of high-k/ metal gate nMOSFETs, including several process changes that promise to mitigate SILC. An approach to reducing SILC, thereby improving device lifetime, will be proposed.


Title: ALD Beryllium Oxide: Novel Barrier Layer for High Performance Gate Stacks on Si and High Mobility Substrates
When: Wednesday, December 7, 9:30 a.m.
Where: Columbia 5 and 7

This paper will analyze BeO films epitaxially grown on Si and GaAs substrates using a conventional atomic layer deposition (ALD) technique. Their superior physical and electrical properties demonstrate the feasibility of employing this novel oxide as a gate dielectric and barrier layer in a manufacturing environment.


Title: 300mm FinFET Results Utilizing Conformal, Damage Free, Ultra Shallow Junction (Xj~5nm) Formed with Molecular Monolayer Doping Technique
When: Wednesday, December 7, 3:15 p.m.
Where: Columbia 5 and 7

This paper will demonstrate a new, conformal, damage-free doping technique (monolayer doping) for 20nm FinFETs. This technique is a promising candidate to address key FinFET scaling issues such as series resistance and short channel control for the 15nm node and beyond.

Panel Session:

Title: Is 3 Dimensional Integration at Best a Niche Play?
When: Tuesday, December 6, 8:00 p.m.
Location: International Ballroom Center

Sitaram Arkalgud, director of SEMATECH's Interconnect division, will join other distinguished industry experts, including Shekhar Borkar of Intel, SiYoung Choi of Samsung, John Lau of ITRI, and Jan Vardaman of Techsearch, Inc. The panel, moderated by IBM Fellow Subramanian Iyer, will explore critical 3D interconnect issues from each panelist's perspective and open the discussion to audience participation.


The IEDM conference draws an international audience of industry professionals for an intensive exploration of design, manufacturing, physics, and modeling of semiconductors and other electronic devices. The conference spotlights leading work from the world's top electronics scientists and engineers; it is one of many industry forums SEMATECH uses to collaborate with scientists and engineers from corporations, universities, and other research institutions, many of whom are research partners.

####

About SEMATECH
For over 20 years, SEMATECH® (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road, Suite 2200
Albany, NY 12203
o: 518-649-1041
m: 518-487-8256

www.twitter.com/sematechnews

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Atomic structure of ultrasound material not what anyone expected February 21st, 2018

Oxford Instruments announces Dr Kate Ross as winner of the 2018 Lee Osheroff Richardson Science Prize for North and South America February 20th, 2018

Computers aid discovery of new, inexpensive material to make LEDs with high color quality February 20th, 2018

Unconventional superconductor may be used to create quantum computers of the future: They have probably succeeded in creating a topological superconductor February 19th, 2018

Chip Technology

Photonic chip guides single photons, even when there are bends in the road February 16th, 2018

Graphene on toast, anyone? Rice University scientists create patterned graphene onto food, paper, cloth, cardboard February 13th, 2018

Liquid crystal molecules form nano rings: Quantized self-assembly enables design of materials with novel properties February 7th, 2018

Nanometrics Selected for Fab-Wide Process Control Metrology by Domestic China 3D-NAND Manufacturer: Latest Fab Win Includes Comprehensive Suite for Substrate, Thin Film and Critical Dimension Metrology February 7th, 2018

Announcements

Atomic structure of ultrasound material not what anyone expected February 21st, 2018

Oxford Instruments announces Dr Kate Ross as winner of the 2018 Lee Osheroff Richardson Science Prize for North and South America February 20th, 2018

Computers aid discovery of new, inexpensive material to make LEDs with high color quality February 20th, 2018

Unconventional superconductor may be used to create quantum computers of the future: They have probably succeeded in creating a topological superconductor February 19th, 2018

Events/Classes

European & Korean Project To Demo World’s First 5G Platform During Winter Games February 15th, 2018

Leti’s Chief Scientist Presents Optimistic Vision for Neuromorphic Hardware and Ultra-Low-Power Microdevices for Edge Computing at ISSCC: Leti’s Chief Scientist Presents Optimistic Vision for Neuromorphic Hardware and Ultra-Low-Power Microdevices That Are Based on Novel Emerging February 13th, 2018

Leti Chief Scientist Barbara De Salvo Will Help Kick Off ISSCC 2018 with Opening-Day Keynote: In Addition, Leti Scientists Will Present and Demo New Technology for Piezoelectric Energy Harvesting February 8th, 2018

Leti Presents Optical-Equipment Curving Technology that Improves Performance, Cuts Costs: ‘Disruptive Approach’ for Imaging Applications Presented in Paper At Photonics West and Demonstrated in Leti’s Booth February 2nd, 2018

Alliances/Trade associations/Partnerships/Distributorships

New era in high field superconducting magnets – opening new frontiers in science, nanotechnology and materials discovery January 9th, 2018

Leti Field Trials Demonstrate New Multicarrier Waveform for Rural, Maritime Broadband Radio: Field Trial in Orkney Islands Used New Filtered Multicarrier Waveform at 700MHz Band with Flexible Bandwidth Usage (Fragmented and Continuous Spectrum) December 18th, 2017

A new product to help combat mouldy walls, thanks to technology developed at the ICN2 December 14th, 2017

JPK Instruments announce partnership with Swiss company, Cytosurge AG. The partnership makes Cytosurge’s FluidFM® technology available on the JPK NanoWizard® AFM platform December 8th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project