- About Us
- Career Center
- Nano-Social Network
- Nano Consulting
- My Account
|Logic IC stacked on DRAM IC, connected using TSVs and microbumps|
Imec and its 3D integration partners have proven the potential of 3D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications. Imec's applied 3D EDA (electronic design automation) tools including thermal models have proven to be valuable means to design next-generation 3D stacked ICs.
The 3D stack resembles as close as possible to future commercial chips. It consists of imec's proprietary logic CMOS IC on top of which a commercial DRAM is stacked using through-silicon vias (TSVs) and micro-bumps. Heaters were integrated to test the impact of hotspot on DRAM refresh times. And, the chip contains test structures for monitoring thermo-mechanical stress in a 3D stack, ESD (electro-static discharge) hazards, electrical characteristics of TSVs and micro-bumps, fault models for TSVs, etc.
Imec's 3D integrated DRAM-on-logic demonstrator showed that a minimum die thickness of 50µm is required to deal with local hot spots on the logic die, which are generated by local power dissipation. Due to the strongly reduced lateral heat spreading capability of thin die, these hot spots are higher in temperature and more confined if the die thickness is reduced.
The hot spots on the logic die cause local temperature increases in the memory die. This may cause a reduction in retention time of the DRAM devices. However, imec's 3D stacked demonstrator has proven that the DRAM may not be thermally isolated from the logic die since the DRAM die also acts as an effective heat spreader for the logic die. As such the intensity of the hot spot is reduced and thereby the temperature rise in the DRAM device is strongly limited.
The results of the various experiments allowed us to calibrate our thermal models which are implemented in 3D EDA tools. They have proven to be valuable means to design next-generation 3D stacked ICs. The design of the 3D chip is realized together with many players in the 3D integration supply chain.
"We are excited to achieve this milestone in collaboration with our 3D integration partners including memory suppliers and IC manufacturers. This test-chip and our 3D design tools and thermal models are an important step for the introduction of 3D technology in DRAM-on-logic for mobile applications;" said Luc Van den hove, president and CEO imec. "To boost the performance towards high-end applications, imec will set up a cooling research program."
This work was executed in collaboration with imec's key partners in its core CMOS programs Globalfoundries, INTEL, Micron, Panasonic, Samsung, TSMC, Fujitsu, Sony, Amkor and Qualcomm.
Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China and Japan. Its staff of about 1,900 people includes over 550 industrial residents and guest researchers. In 2010, imec's revenue (P&L) was 285 million euro. Further information on imec can be found at www.imec.be.
Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shangai) Co. Ltd.).
For more information, please click here
External Communications Director
T: +32 16 28 18 80
Mobile: +32 474 30 28 66
Maestro Marketing & PR
T : +1 408 996 9975
M : +1 408 529 4210
Copyright © IMECIf you have a comment, please Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
|Related News Press|
News and information
Gigantic ultrafast spin currents: Scientists from TU Wien (Vienna) are proposing a new method for creating extremely strong spin currents. They are essential for spintronics, a technology that could replace today's electronics May 25th, 2016
Novel gene therapy shows potential for lung repair in asthma May 18th, 2016
Nanometrics Announces Upcoming Investor Events May 10th, 2016
The next generation of carbon monoxide nanosensors May 26th, 2016
Revealing the nature of magnetic interactions in manganese oxide: New technique for probing local magnetic interactions confirms 'superexchange' model that explains how the material gets its long-range magnetic order May 25th, 2016