Nanotechnology Now

Our NanoNews Digest Sponsors





Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > Imec demonstrates 3D integrated DRAM-on-logic for low-power mobile applications

Logic IC stacked on DRAM IC, connected using TSVs and microbumps
Logic IC stacked on DRAM IC, connected using TSVs and microbumps

Abstract:
Imec and its 3D integration partners have proven the potential of 3D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications. Imec's applied 3D EDA (electronic design automation) tools including thermal models have proven to be valuable means to design next-generation 3D stacked ICs.

Imec demonstrates 3D integrated DRAM-on-logic for low-power mobile applications

Leuven, Belgium | Posted on July 11th, 2011

The 3D stack resembles as close as possible to future commercial chips. It consists of imec's proprietary logic CMOS IC on top of which a commercial DRAM is stacked using through-silicon vias (TSVs) and micro-bumps. Heaters were integrated to test the impact of hotspot on DRAM refresh times. And, the chip contains test structures for monitoring thermo-mechanical stress in a 3D stack, ESD (electro-static discharge) hazards, electrical characteristics of TSVs and micro-bumps, fault models for TSVs, etc.

Imec's 3D integrated DRAM-on-logic demonstrator showed that a minimum die thickness of 50µm is required to deal with local hot spots on the logic die, which are generated by local power dissipation. Due to the strongly reduced lateral heat spreading capability of thin die, these hot spots are higher in temperature and more confined if the die thickness is reduced.
The hot spots on the logic die cause local temperature increases in the memory die. This may cause a reduction in retention time of the DRAM devices. However, imec's 3D stacked demonstrator has proven that the DRAM may not be thermally isolated from the logic die since the DRAM die also acts as an effective heat spreader for the logic die. As such the intensity of the hot spot is reduced and thereby the temperature rise in the DRAM device is strongly limited.

The results of the various experiments allowed us to calibrate our thermal models which are implemented in 3D EDA tools. They have proven to be valuable means to design next-generation 3D stacked ICs. The design of the 3D chip is realized together with many players in the 3D integration supply chain.

"We are excited to achieve this milestone in collaboration with our 3D integration partners including memory suppliers and IC manufacturers. This test-chip and our 3D design tools and thermal models are an important step for the introduction of 3D technology in DRAM-on-logic for mobile applications;" said Luc Van den hove, president and CEO imec. "To boost the performance towards high-end applications, imec will set up a cooling research program."

This work was executed in collaboration with imec's key partners in its core CMOS programs Globalfoundries, INTEL, Micron, Panasonic, Samsung, TSMC, Fujitsu, Sony, Amkor and Qualcomm.

####

About IMEC
Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China and Japan. Its staff of about 1,900 people includes over 550 industrial residents and guest researchers. In 2010, imec's revenue (P&L) was 285 million euro. Further information on imec can be found at www.imec.be.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shangai) Co. Ltd.).

For more information, please click here

Contacts:
Katrien Marent
External Communications Director
T: +32 16 28 18 80
Mobile: +32 474 30 28 66


Barbara Kalkis
Maestro Marketing & PR
T : +1 408 996 9975
M : +1 408 529 4210

Copyright © IMEC

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Materials for the next generation of electronics and photovoltaics: MacArthur Fellow develops new uses for carbon nanotubes October 21st, 2014

Special UO microscope captures defects in nanotubes: University of Oregon chemists provide a detailed view of traps that disrupt energy flow, possibly pointing toward improved charge-carrying devices October 21st, 2014

Super stable garnet ceramics may be ideal for high-energy lithium batteries October 21st, 2014

Could I squeeze by you? Ames Laboratory scientists model molecular movement within narrow channels of mesoporous nanoparticles October 21st, 2014

Chip Technology

Materials for the next generation of electronics and photovoltaics: MacArthur Fellow develops new uses for carbon nanotubes October 21st, 2014

Nitrogen Doped Graphene Characterized by Iranian, Russian, German Scientists October 21st, 2014

Crystallizing the DNA nanotechnology dream: Scientists have designed the first large DNA crystals with precisely prescribed depths and complex 3D features, which could create revolutionary nanodevices October 20th, 2014

Imaging electric charge propagating along microbial nanowires October 20th, 2014

Announcements

Special UO microscope captures defects in nanotubes: University of Oregon chemists provide a detailed view of traps that disrupt energy flow, possibly pointing toward improved charge-carrying devices October 21st, 2014

Super stable garnet ceramics may be ideal for high-energy lithium batteries October 21st, 2014

Could I squeeze by you? Ames Laboratory scientists model molecular movement within narrow channels of mesoporous nanoparticles October 21st, 2014

Detecting Cancer Earlier is Goal of Rutgers-Developed Medical Imaging Technology: Rare earth nanocrystals and infrared light can reveal small cancerous tumors and cardiovascular lesions October 21st, 2014

Events/Classes

Ucore's McKenzie to Deliver Presentation to Rare Earths Conference in Singapore as Highlight of Fall 2014 Marketplace Schedule October 19th, 2014

Aspen Aerogels, Inc. Schedules Third Quarter 2014 Earnings Release and Conference Call for November 6, 2014 October 17th, 2014

New VDMA Association "Electronics, Micro and Nano Technologies" founded: Inaugural Meeting in Frankfurt/Main, Germany October 15th, 2014

Nanotronics Imaging Releases nSPEC® 3D, Powerful Microscope That Captures 3D Images at Nanoscale, in Lightning Speed: Company Unveils Design at American Chemical Society 2014 International Elastomer Conference October 14th, 2014

Research partnerships

Detecting Cancer Earlier is Goal of Rutgers-Developed Medical Imaging Technology: Rare earth nanocrystals and infrared light can reveal small cancerous tumors and cardiovascular lesions October 21st, 2014

Nitrogen Doped Graphene Characterized by Iranian, Russian, German Scientists October 21st, 2014

Crystallizing the DNA nanotechnology dream: Scientists have designed the first large DNA crystals with precisely prescribed depths and complex 3D features, which could create revolutionary nanodevices October 20th, 2014

IRLYNX and CEA-Leti to Streamline New CMOS-based Infrared Sensing Modules Dedicated to Human-activities Characterization October 15th, 2014

NanoNews-Digest
The latest news from around the world, FREE





  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE