Nanotechnology Now







Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > SEMATECH to Showcase Advanced Technologies and Manufacturing Methods at SEMICON West 2011: Presentations and public workshops will share data, strategies, and best practices in advanced materials, lean manufacturing methods, and 3D interconnects

Abstract:
Through a wide range of lectures and workshop sessions, SEMATECH and International SEMATECH Manufacturing Initiative (ISMI) will present a variety of technology solutions and manufacturing methods from July 11-15 at SEMICON West in San Francisco, CA.

SEMATECH to Showcase Advanced Technologies and Manufacturing Methods at SEMICON West 2011: Presentations and public workshops will share data, strategies, and best practices in advanced materials, lean manufacturing methods, and 3D interconnects

Albany, NY | Posted on June 22nd, 2011

SEMATECH and ISMI experts will report their latest advances in new materials and device structures and lithography with a special focus on addressing key opportunities and challenges in 3D interconnect technology.

"Both SEMATECH and ISMI recognize that the industry needs innovative and practical solutions for continued scaling of semiconductor technologies that can easily be incorporated into real-world manufacturing environments," said Dan Armbrust, president and CEO, SEMATECH. "This year's SEMICON West will be an important forum for our industry to come together and find best ways to address complex technology challenges. We look forward to sharing our technical knowledge and best practices to help drive our industry forward."

Several SEMATECH experts are scheduled to speak on the SEMICON West TechXPOT Stage, in the North and South Halls of the Moscone Center, including:

· Raj Jammy, SEMATECH's vice president of Emerging Technologies, "Heterogeneous Integration of High Mobility Ge/III-V Channels on Si," July 12 at 11 a.m.

· David Gilmer, SEMATECH's project engineer of Advanced Memory Technologies, "Metal-Oxide based RRAM Materials and Development," July 12 at 11:30 a.m.

· Stefan Wurm, SEMATECH's associate director of Lithography, "EUV Mask Infrastructure (EMI) Partnership," July 13 at 11:05 a.m.

· Sitaram Arkalgud, SEMATECH's director of Interconnect, will co-moderate panel session 1 in the 3D in the Deep Submicron Era, July 13 at 1:50 p.m.

· Chris Hobbs, SEMATECH's CMOS scaling program manager of Front End Process, "Non-Planar CMOS Device Challenges and Opportunities," July 14 at the NCCAVS Advanced Process and Integration in Semiconductor Technologies session.

Additionally, SEMATECH and ISMI experts will host and present at various public workshops, at the Marriott Marquis, during SEMICON West:

· Equipment suppliers will identify opportunities and bridge understandings on enabling 3D technology in the wafer handling process space at the workshop Enabling 3D: Temporary Bonding Workshop on July 11 at 1 p.m.

· Equipment suppliers and end users will meet to address topics such as SEMI S23 reporting and goals, applying high temperature process cooling water on process tools, and idle mode interface for process equipment subsystems at the ISMI Equipment Energy Workshop on July 12 at 8 a.m.

· Equipment suppliers will share their plans on how new and existing wafer metrology technologies can be used, modified, or enhanced to measure and improve 3D interconnect processes at SEMATECH's 3D Metrology Workshop on July 13 at 12:00 p.m.

· Co-sponsored by SEMI and ISMI, the EDA Workshop will focus on the equipment data acquisition (EDA) interface requirements and implementation for the 0710 standards freeze level. Participants will be able to discuss with industry experts how the changes for the new freeze level can be implemented and evaluated on July 13 at 1 p.m.

· A day-long preview of this year's International Technology Roadmap for Semiconductors will be offered at the Summer ITRS Public Conference on July 13.

· Hosted by SEMATECH, in collaboration with Fraunhofer IZFP, the fifth workshop on Stress Management for 3D ICs using Through Silicon Vias will discuss product-level reliability, including product qualification, product level test requirements, and failure analysis on July 14 at 9 a.m.

· Co-organizing and/or speaking at various SEMI standards workshops in 3D interconnect, lithography, and manufacturing.

Some of SEMATECH's and ISMI's most prominent technologists in the nanoelectronics industry will be attending SEMICON West. To arrange for meeting attendance or interviews with executives and technical experts, please contact

####

About SEMATECH
For over 20 years, SEMATECH® (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.
Twitter: www.twitter.com/sematechnews

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road | Suite 2200
Albany, NY | 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Patent for the Novel Cancer Therapies – Ceramide Nanoliposomes March 4th, 2015

Magnetic vortices in nanodisks reveal information: Researchers from Dresden and Jülich use microwaves to read out information from smallest storage devices March 4th, 2015

CiQUS researchers obtain high-quality perovskites over large areas by a chemical method March 4th, 2015

Arrowhead to Present at 2015 Barclays Global Healthcare Conference March 4th, 2015

Chip Technology

Experiment and theory unite at last in debate over microbial nanowires: New model and experiments settle debate over metallic-like conductivity of microbial nanowires in bacterium March 4th, 2015

Magnetic vortices in nanodisks reveal information: Researchers from Dresden and Jülich use microwaves to read out information from smallest storage devices March 4th, 2015

Cambrios and Heraeus Jointly Create New, High-Conductivity Transparent Conductors: Two Companies' Combined Products Dramatically Extend Flexible Substrate Capabilities for Next-Generation Mass-Market Technology Products March 3rd, 2015

The taming of magnetic vortices: Unified theory for skyrmion-materials March 3rd, 2015

Memory Technology

Magnetic vortices in nanodisks reveal information: Researchers from Dresden and Jülich use microwaves to read out information from smallest storage devices March 4th, 2015

The taming of magnetic vortices: Unified theory for skyrmion-materials March 3rd, 2015

Insight into inner magnetic layers: Measurements at BESSY II have shown how spin filters forming within magnetic sandwiches influence tunnel magnetoresistance -- results that can help in designing spintronic component- February 17th, 2015

Dance of the nanovortices February 2nd, 2015

Announcements

Experiment and theory unite at last in debate over microbial nanowires: New model and experiments settle debate over metallic-like conductivity of microbial nanowires in bacterium March 4th, 2015

Magnetic vortices in nanodisks reveal information: Researchers from Dresden and Jülich use microwaves to read out information from smallest storage devices March 4th, 2015

CiQUS researchers obtain high-quality perovskites over large areas by a chemical method March 4th, 2015

Arrowhead to Present at 2015 Barclays Global Healthcare Conference March 4th, 2015

Tools

Keysight Technologies Shifts to Direct Sales of High-Performance Products in North America March 3rd, 2015

Forbidden quantum leaps possible with high-res spectroscopy March 2nd, 2015

International research partnership tricks the light fantastic March 2nd, 2015

Important step towards quantum computing: Metals at atomic scale March 2nd, 2015

Alliances/Partnerships/Distributorships

Keysight Technologies Shifts to Direct Sales of High-Performance Products in North America March 3rd, 2015

Cambrios and Heraeus Jointly Create New, High-Conductivity Transparent Conductors: Two Companies' Combined Products Dramatically Extend Flexible Substrate Capabilities for Next-Generation Mass-Market Technology Products March 3rd, 2015

Imec, Murata, and Huawei Introduce Breakthrough Solution for TX-to-RX Isolation in Reconfigurable, Multiband Front-End Modules for Mobile Phones: Electrical-Balance Duplexers Pave the Way to Integrated Solution for TX-to-RX Isolation March 1st, 2015

Imec Demonstrates Compact Wavelength-Division Multiplexing CMOS Silicon Photonics Transceiver March 1st, 2015

Printing/Lithography/Inkjet/Inks

Maximum Precision in 3D Printing: New complete solution makes additive manufacturing standard for microfabrication February 26th, 2015

SUNY Poly CNSE Researchers and Corporate Partners to Present Forty Papers at Globally Recognized Lithography Conference: SUNY Poly CNSE Research Group Awarded Both ‘Best Research Paper’ and ‘Best Research Poster’ at SPIE Advanced Lithography 2015 forum February 25th, 2015

World’s first compact rotary 3D printer-cum-scanner unveiled at AAAS by NTU Singapore start-up: With production funded by crowdsourcing, the first unit will be delivered to the United States in March February 16th, 2015

3-D printing with custom molecules creates low-cost mechanical sensor February 10th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2015 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE