Nanotechnology Now

Our NanoNews Digest Sponsors



Heifer International

Wikipedia Affiliate Button


android tablet pc

Home > Press > SEMATECH to Showcase Advanced Technologies and Manufacturing Methods at SEMICON West 2011: Presentations and public workshops will share data, strategies, and best practices in advanced materials, lean manufacturing methods, and 3D interconnects

Abstract:
Through a wide range of lectures and workshop sessions, SEMATECH and International SEMATECH Manufacturing Initiative (ISMI) will present a variety of technology solutions and manufacturing methods from July 11-15 at SEMICON West in San Francisco, CA.

SEMATECH to Showcase Advanced Technologies and Manufacturing Methods at SEMICON West 2011: Presentations and public workshops will share data, strategies, and best practices in advanced materials, lean manufacturing methods, and 3D interconnects

Albany, NY | Posted on June 22nd, 2011

SEMATECH and ISMI experts will report their latest advances in new materials and device structures and lithography with a special focus on addressing key opportunities and challenges in 3D interconnect technology.

"Both SEMATECH and ISMI recognize that the industry needs innovative and practical solutions for continued scaling of semiconductor technologies that can easily be incorporated into real-world manufacturing environments," said Dan Armbrust, president and CEO, SEMATECH. "This year's SEMICON West will be an important forum for our industry to come together and find best ways to address complex technology challenges. We look forward to sharing our technical knowledge and best practices to help drive our industry forward."

Several SEMATECH experts are scheduled to speak on the SEMICON West TechXPOT Stage, in the North and South Halls of the Moscone Center, including:

· Raj Jammy, SEMATECH's vice president of Emerging Technologies, "Heterogeneous Integration of High Mobility Ge/III-V Channels on Si," July 12 at 11 a.m.

· David Gilmer, SEMATECH's project engineer of Advanced Memory Technologies, "Metal-Oxide based RRAM Materials and Development," July 12 at 11:30 a.m.

· Stefan Wurm, SEMATECH's associate director of Lithography, "EUV Mask Infrastructure (EMI) Partnership," July 13 at 11:05 a.m.

· Sitaram Arkalgud, SEMATECH's director of Interconnect, will co-moderate panel session 1 in the 3D in the Deep Submicron Era, July 13 at 1:50 p.m.

· Chris Hobbs, SEMATECH's CMOS scaling program manager of Front End Process, "Non-Planar CMOS Device Challenges and Opportunities," July 14 at the NCCAVS Advanced Process and Integration in Semiconductor Technologies session.

Additionally, SEMATECH and ISMI experts will host and present at various public workshops, at the Marriott Marquis, during SEMICON West:

· Equipment suppliers will identify opportunities and bridge understandings on enabling 3D technology in the wafer handling process space at the workshop Enabling 3D: Temporary Bonding Workshop on July 11 at 1 p.m.

· Equipment suppliers and end users will meet to address topics such as SEMI S23 reporting and goals, applying high temperature process cooling water on process tools, and idle mode interface for process equipment subsystems at the ISMI Equipment Energy Workshop on July 12 at 8 a.m.

· Equipment suppliers will share their plans on how new and existing wafer metrology technologies can be used, modified, or enhanced to measure and improve 3D interconnect processes at SEMATECH's 3D Metrology Workshop on July 13 at 12:00 p.m.

· Co-sponsored by SEMI and ISMI, the EDA Workshop will focus on the equipment data acquisition (EDA) interface requirements and implementation for the 0710 standards freeze level. Participants will be able to discuss with industry experts how the changes for the new freeze level can be implemented and evaluated on July 13 at 1 p.m.

· A day-long preview of this year's International Technology Roadmap for Semiconductors will be offered at the Summer ITRS Public Conference on July 13.

· Hosted by SEMATECH, in collaboration with Fraunhofer IZFP, the fifth workshop on Stress Management for 3D ICs using Through Silicon Vias will discuss product-level reliability, including product qualification, product level test requirements, and failure analysis on July 14 at 9 a.m.

· Co-organizing and/or speaking at various SEMI standards workshops in 3D interconnect, lithography, and manufacturing.

Some of SEMATECH's and ISMI's most prominent technologists in the nanoelectronics industry will be attending SEMICON West. To arrange for meeting attendance or interviews with executives and technical experts, please contact

####

About SEMATECH
For over 20 years, SEMATECH® (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.
Twitter: www.twitter.com/sematechnews

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road | Suite 2200
Albany, NY | 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Fonon Announces 3D Metal Sintering Technology: Emerging Additive Nano Powder Manufacturing Technology August 28th, 2014

Ultra-Low Frequency Vibration Isolation Stabilizes Scanning Tunneling Microscopy at UCLA’s Nano-Research Group August 28th, 2014

Novel 'butterfly' molecule could build new sensors, photoenergy conversion devices August 28th, 2014

New technique uses fraction of measurements to efficiently find quantum wave functions August 28th, 2014

Chip Technology

Fonon Announces 3D Metal Sintering Technology: Emerging Additive Nano Powder Manufacturing Technology August 28th, 2014

Scientists craft atomically seamless, thinnest-possible semiconductor junctions August 26th, 2014

RMIT delivers $30m boost to micro and nano-tech August 26th, 2014

Competition for Graphene: Berkeley Lab Researchers Demonstrate Ultrafast Charge Transfer in New Family of 2D Semiconductors August 26th, 2014

Memory Technology

Promising Ferroelectric Materials Suffer From Unexpected Electric Polarizations: Brookhaven Lab scientists find surprising locked charge polarizations that impede performance in next-gen materials that could otherwise revolutionize data-driven devices August 18th, 2014

Can our computers continue to get smaller and more powerful? University of Michigan computer scientist reviews frontier technologies to determine fundamental limits of computer scaling August 13th, 2014

An Inkjet-Printed Field-Effect Transistor for Label-Free Biosensing August 11th, 2014

Rice's silicon oxide memories catch manufacturers' eye: Use of porous silicon oxide reduces forming voltage, improves manufacturability July 10th, 2014

Announcements

Leading European communications companies and research organizations have launched an EU project developing the future 5th Generation cellular mobile networks August 28th, 2014

Ultra-Low Frequency Vibration Isolation Stabilizes Scanning Tunneling Microscopy at UCLA’s Nano-Research Group August 28th, 2014

Novel 'butterfly' molecule could build new sensors, photoenergy conversion devices August 28th, 2014

New technique uses fraction of measurements to efficiently find quantum wave functions August 28th, 2014

Tools

Ultra-Low Frequency Vibration Isolation Stabilizes Scanning Tunneling Microscopy at UCLA’s Nano-Research Group August 28th, 2014

Measure Both Elastic and Viscous Properties with AFM Using Asylum Research’s Exclusive AM-FM Viscoelastic Mapping Mode August 28th, 2014

Malvern specialists to deliver inaugural short course on polymer characterization at Interplas 2014 August 27th, 2014

Scientists craft atomically seamless, thinnest-possible semiconductor junctions August 26th, 2014

Alliances/Partnerships/Distributorships

Leading European communications companies and research organizations have launched an EU project developing the future 5th Generation cellular mobile networks August 28th, 2014

JPK expands availability of instrumentation in the USA – appointing new distributors – launched a new web site to support the US market - AFM now available to US users August 26th, 2014

Sunblock poses potential hazard to sea life August 20th, 2014

SouthWest NanoTechnologies Appoints Matteson-Ridolfi for U.S. Distribution of its SMW™ Specialty Multiwall Carbon Nanotubes August 13th, 2014

Printing/Lithography/Inkjet/Inks

RMIT delivers $30m boost to micro and nano-tech August 26th, 2014

SouthWest NanoTechnologies Appoints Matteson-Ridolfi for U.S. Distribution of its SMW™ Specialty Multiwall Carbon Nanotubes August 13th, 2014

An Inkjet-Printed Field-Effect Transistor for Label-Free Biosensing August 11th, 2014

SEMATECH and Newly Merged SUNY CNSE/SUNYIT Launch New Patterning Center to Further Advance Materials Development: Center to Provide Access to Critical Tools that Support Semiconductor Technology Node Development August 7th, 2014

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More














ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







© Copyright 1999-2014 7th Wave, Inc. All Rights Reserved PRIVACY POLICY :: CONTACT US :: STATS :: SITE MAP :: ADVERTISE