Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > SEMATECH to Showcase Advanced Technologies and Manufacturing Methods at SEMICON West 2011: Presentations and public workshops will share data, strategies, and best practices in advanced materials, lean manufacturing methods, and 3D interconnects

Abstract:
Through a wide range of lectures and workshop sessions, SEMATECH and International SEMATECH Manufacturing Initiative (ISMI) will present a variety of technology solutions and manufacturing methods from July 11-15 at SEMICON West in San Francisco, CA.

SEMATECH to Showcase Advanced Technologies and Manufacturing Methods at SEMICON West 2011: Presentations and public workshops will share data, strategies, and best practices in advanced materials, lean manufacturing methods, and 3D interconnects

Albany, NY | Posted on June 22nd, 2011

SEMATECH and ISMI experts will report their latest advances in new materials and device structures and lithography with a special focus on addressing key opportunities and challenges in 3D interconnect technology.

"Both SEMATECH and ISMI recognize that the industry needs innovative and practical solutions for continued scaling of semiconductor technologies that can easily be incorporated into real-world manufacturing environments," said Dan Armbrust, president and CEO, SEMATECH. "This year's SEMICON West will be an important forum for our industry to come together and find best ways to address complex technology challenges. We look forward to sharing our technical knowledge and best practices to help drive our industry forward."

Several SEMATECH experts are scheduled to speak on the SEMICON West TechXPOT Stage, in the North and South Halls of the Moscone Center, including:

· Raj Jammy, SEMATECH's vice president of Emerging Technologies, "Heterogeneous Integration of High Mobility Ge/III-V Channels on Si," July 12 at 11 a.m.

· David Gilmer, SEMATECH's project engineer of Advanced Memory Technologies, "Metal-Oxide based RRAM Materials and Development," July 12 at 11:30 a.m.

· Stefan Wurm, SEMATECH's associate director of Lithography, "EUV Mask Infrastructure (EMI) Partnership," July 13 at 11:05 a.m.

· Sitaram Arkalgud, SEMATECH's director of Interconnect, will co-moderate panel session 1 in the 3D in the Deep Submicron Era, July 13 at 1:50 p.m.

· Chris Hobbs, SEMATECH's CMOS scaling program manager of Front End Process, "Non-Planar CMOS Device Challenges and Opportunities," July 14 at the NCCAVS Advanced Process and Integration in Semiconductor Technologies session.

Additionally, SEMATECH and ISMI experts will host and present at various public workshops, at the Marriott Marquis, during SEMICON West:

· Equipment suppliers will identify opportunities and bridge understandings on enabling 3D technology in the wafer handling process space at the workshop Enabling 3D: Temporary Bonding Workshop on July 11 at 1 p.m.

· Equipment suppliers and end users will meet to address topics such as SEMI S23 reporting and goals, applying high temperature process cooling water on process tools, and idle mode interface for process equipment subsystems at the ISMI Equipment Energy Workshop on July 12 at 8 a.m.

· Equipment suppliers will share their plans on how new and existing wafer metrology technologies can be used, modified, or enhanced to measure and improve 3D interconnect processes at SEMATECH's 3D Metrology Workshop on July 13 at 12:00 p.m.

· Co-sponsored by SEMI and ISMI, the EDA Workshop will focus on the equipment data acquisition (EDA) interface requirements and implementation for the 0710 standards freeze level. Participants will be able to discuss with industry experts how the changes for the new freeze level can be implemented and evaluated on July 13 at 1 p.m.

· A day-long preview of this year's International Technology Roadmap for Semiconductors will be offered at the Summer ITRS Public Conference on July 13.

· Hosted by SEMATECH, in collaboration with Fraunhofer IZFP, the fifth workshop on Stress Management for 3D ICs using Through Silicon Vias will discuss product-level reliability, including product qualification, product level test requirements, and failure analysis on July 14 at 9 a.m.

· Co-organizing and/or speaking at various SEMI standards workshops in 3D interconnect, lithography, and manufacturing.

Some of SEMATECH's and ISMI's most prominent technologists in the nanoelectronics industry will be attending SEMICON West. To arrange for meeting attendance or interviews with executives and technical experts, please contact

####

About SEMATECH
For over 20 years, SEMATECH® (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.
Twitter: www.twitter.com/sematechnews

For more information, please click here

Contacts:
Erica McGill
SEMATECH
Media Relations
257 Fuller Road | Suite 2200
Albany, NY | 12203
o: 518-649-1041
m: 518-487-8256

Copyright © SEMATECH

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Personal cooling units on the horizon April 29th, 2016

Exploring phosphorene, a promising new material April 29th, 2016

Arrowhead Pharmaceuticals Files for Regulatory Clearance to Begin Phase 1/2 Study of ARC-521 April 28th, 2016

The Translational Research Center at the University Hospital of Erlangen in Germany uses the ZetaView from Particle Metrix to quantify extracellular vesicles such as exosomes April 28th, 2016

Chip Technology

Exploring phosphorene, a promising new material April 29th, 2016

Researchers create a first frequency comb of time-bin entangled qubits: Discovery is a significant step toward multi-channel quantum communication and higher capacity quantum computers April 28th, 2016

University of Illinois researchers create 1-step graphene patterning method April 27th, 2016

NREL theory establishes a path to high-performance 2-D semiconductor devices April 27th, 2016

Memory Technology

Hybrid nanoantennas -- next-generation platform for ultradense data recording April 28th, 2016

Magnetic vortices defy temperature fluctuations: Common magnetic mineral is reliable witness to Earth's history April 19th, 2016

A single-atom magnet breaks new ground for future data storage April 15th, 2016

Topology explains queer electrical current boost in non-magnetic metal: Scientists reduce resistance in PdCoO2 with magnetic fields April 12th, 2016

Announcements

Personal cooling units on the horizon April 29th, 2016

Exploring phosphorene, a promising new material April 29th, 2016

Arrowhead Pharmaceuticals Files for Regulatory Clearance to Begin Phase 1/2 Study of ARC-521 April 28th, 2016

The Translational Research Center at the University Hospital of Erlangen in Germany uses the ZetaView from Particle Metrix to quantify extracellular vesicles such as exosomes April 28th, 2016

Tools

Exploring phosphorene, a promising new material April 29th, 2016

JPK reports on the use of a NanoWizard AFM system at the University of Kaiserslautern to study the interaction of bacteria with microstructured surfaces April 28th, 2016

Chemists use DNA to build the world's tiniest thermometer April 27th, 2016

Bruker Introduces Dimension FastScan Pro Industrial AFM: Providing Nanometer-Resolution at High Scan Rates for up to 300-mm Samples April 26th, 2016

Alliances/Trade associations/Partnerships/Distributorships

Electrically Conductive Graphene Ink Enables Printing of Biosensors April 23rd, 2016

Leti Extends Collaboration with Qualcomm on CoolCubeTM 3D Integration Technology for High-Density, High-Performance ICs: Collaboration Goals Include Building an Ecosystem To Take the Chip-stacking Technology from Design to Fabrication April 13th, 2016

FEI Partners with Five Pharmaceutical Companies, the Medical Research Council and the University of Cambridge to form Cryo-EM Research Consortium April 5th, 2016

Strem Chemicals and SONA Nanotech Sign Distribution Agreement for the World’s First Gold Nanorods Synthesized without CTAB February 24th, 2016

Printing/Lithography/Inkjet/Inks

Electrically Conductive Graphene Ink Enables Printing of Biosensors April 23rd, 2016

Highlights from the Graphene Flagship April 22nd, 2016

Penn engineers develop first transistors made entirely of nanocrystal 'inks April 11th, 2016

Researchers use 3-D printing to create structure with active chemistry April 4th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic